JP2018157196A - 改良型の半角ノズル - Google Patents
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- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45563—Gas nozzles
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- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
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- C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
- C30B25/02—Epitaxial-layer growth
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Abstract
【解決手段】装置は、本体230と、角度が付いたガス源アセンブリ246と、ガス注入チャネル249とを含む。ガス注入チャネルは、互いに異なる、第1半角と第2半角とを有する。基板のエッジに向かってガスを導くために、処理チャンバ内で改良型の側方ガスアセンブリを使用することで、基板全体における成長均一性が制御される。不均一な半角を有するガスチャネルを通してガスを導くことで、基板のエッジにおける又はエッジ付近での反応が著しく増大し、それにより、基板の全体的な厚さ均一性の向上がもたらされる。
【選択図】図2A
Description
半導体基板は、集積回路用のデバイス及び微小デバイスの製造を含む、広範な応用のために処理される。基板を処理する方法の1つは、処理チャンバの中に載置された基板の上側表面で酸化物層を成長させることを含む。酸化物層は、基板を、放射熱源を用いて加熱しつつ、酸素ガス及び水素ガスに曝露することによって、堆積されうる。酸素ラジカルが、基板の表面にぶつかって、ケイ素基板に層(例えば二酸化ケイ素層)を形成する。
101 基板
107 コントローラ
108 加熱源
110 ランプアセンブリ
114 石英ウインドウ
122 側方ポート
123 中心軸
124 排気アセンブリ
125 排気空間
130 チャンバアセンブリ
131 ガス入口
134 ガス出口
135 ガス源
136 ポンプシステム
137 スリットバルブ
138 基板支持体
139 処理空間
140 ベースリング
141 第1ガス源
142 第2ガス源
143 2つの入口
144 2つの入口
145 主ガス流
146 流量調整デバイス
147 ガスインジェクタ
148 側方ガス流
149 カートリッジ
150 狭長チャネル
151 注入孔
152 ガス源
153 ガス源
154 ガス源
179 内表面
189 方向
197 反時計回り方向
202 突起
204 第2ファセット
205 突起
210 中心軸線
212 点
214 内部空間
216 円形の入口
218 第1ファセット
220 中心交点
226 第5の壁
228 第4の湾曲面
230 本体
232 面
234 面
236 第1の湾曲面
238 第3の湾曲面
240 第2の湾曲面
242 角度
246 角度が付いたガス源アセンブリ
247 ガスインジェクタ
248 側方ガス流
249 入口チャネル
250a 一方の半角
250b 他方の半角
279 内部表面
280 内部表面
282 湾曲面
Claims (15)
- 基板を熱処理するための装置であって、
本体と、
角度がついた突起と、
ガス注入チャネルであって、
第1半角、及び、
第2半角を備え、前記第1半角は前記第2半角とは異なる、ガス注入チャネルとを備える、装置。 - 前記本体が、
第1の面と、
前記第1の面の反対側の第2の面であって、前記第1の面は前記第2の面と実質的に同じ長さである、第2の面と、
前記第1の面に対して直角な第3の面と、
前記第1の面と前記第3の面との間に延在する、第1の湾曲面と、
前記第3の面と前記第2の面との間に延在する、第2の湾曲面と、
前記第2の面に対して直角な第4の面と、
前記第1の面と前記第4の面との間に延在する、第3の湾曲面と、
前記第4の面と前記第2の面との間に延在する第4の湾曲面であって、前記第3の面が前記第4の面の反対側にある、第4の湾曲面と、
前記第1の面に対して直角な第5の面と、
前記第1の面に対して直角な第6の面であって、前記第6の面は前記第5の面の反対側にある、第6の面とを備える、請求項1に記載の装置。 - 角度がついた突起が前記第5の面に配置され、ガス注入チャネルが前記第6の面に配置される、請求項2に記載の装置。
- 前記角度がついた突起が三角形である、請求項1に記載の装置。
- 角度がついた突起が、
第1ファセットと、
第2ファセットと、
前記湾曲したガス注入チャネルと流体連通している円形の入口とを備える、請求項2に記載の装置。 - 前記ガス注入チャネルが、流路に平行な基板支持面の接線から約5mmから約10mmの距離にある前記流路に沿って、ガス流を提供する、請求項1に記載の装置。
- 前記第1半角が約29.5度から約30.5度であり、前記第2半角が約31.8度から約32.8度である、請求項1に記載の装置。
- 前記ガス注入チャネルが、湾曲面を伴って処理空間に向かって広がる、扁平な漏斗型構造物である、請求項1に記載の装置。
- 処理空間を画定するチャンバ本体と、
前記処理空間内に配置された基板支持体であって、基板支持面を有する、基板支持体と、
前記チャンバ本体の入口に連結された、ガス源突起と、
前記チャンバ本体の出口に連結された、排気アセンブリと、
前記チャンバ本体の側壁に連結された、側方ガスアセンブリとを備える、基板を処理するための装置であって、前記側方ガスアセンブリが、
ガス注入チャネルであって、
第1半角、及び、
第2半角を備え、前記第1半角は前記第2半角とは異なる、ガス注入チャネルを備える、装置。 - 前記側方ガスアセンブリが、
本体と、
角度がついた突起とを更に備える、請求項9に記載の装置。 - 前記本体が、
第1の面と、
前記第1の面の反対側の第2の面であって、前記第1の面は前記第2の面と実質的に同じ長さである、第2の面と、
前記第1の面に対して直角な第3の面と、
前記第1の面と前記第3の面との間に延在する、第1の湾曲面と、
前記第3の面と前記第2の面との間に延在する、第2の湾曲面と、
前記第2の面に対して直角な第4の面と、
前記第1の面と前記第4の面との間に延在する、第3の湾曲面と、
前記第4の面と前記第2の面との間に延在する第4の湾曲面であって、前記第3の面が前記第4の面の反対側にある、第4の湾曲面と、
前記第1の面に対して直角な第5の面と、
前記第1の面に対して直角な第6の面であって、前記第6の面は前記第5の面の反対側にある、第6の面とを備える、請求項10に記載の装置。 - 前記角度がついたガス源突起が前記第5の面に配置され、前記ガス注入チャネルが前記第6の面に配置される、請求項11に記載の装置。
- 角度がついた前記突起が、
第1ファセットと、
第2ファセットと、
前記湾曲したガス注入チャネルと流体連通している円形の入口とを備える、請求項9に記載の装置。 - 前記側方ガスアセンブリが、流路に平行な前記基板支持面の接線から約5mmから約10mmの距離にある前記流路に沿って、ガス流を提供する、請求項9に記載の装置。
- 前記第1半角が約29.5度から約30.5度までであり、前記第2半角が約31.8度から約32.8度までである、請求項9に記載の装置。
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JP2022523049A (ja) * | 2019-01-30 | 2022-04-21 | アプライド マテリアルズ インコーポレイテッド | より良いウエハ均一性のための非対称注入 |
JP7407867B2 (ja) | 2017-02-06 | 2024-01-04 | アプライド マテリアルズ インコーポレイテッド | 改良型の半角ノズル |
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US11032945B2 (en) * | 2019-07-12 | 2021-06-08 | Applied Materials, Inc. | Heat shield assembly for an epitaxy chamber |
CN112526827A (zh) * | 2019-09-19 | 2021-03-19 | 株式会社斯库林集团 | 曝光装置 |
FI128855B (en) * | 2019-09-24 | 2021-01-29 | Picosun Oy | FLUID DISTRIBUTOR FOR THIN FILM GROWING EQUIPMENT, RELATED EQUIPMENT AND METHODS |
TW202235675A (zh) * | 2020-11-30 | 2022-09-16 | 荷蘭商Asm Ip私人控股有限公司 | 注入器、及基板處理設備 |
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Also Published As
Publication number | Publication date |
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US11634813B2 (en) | 2023-04-25 |
KR102555394B1 (ko) | 2023-07-13 |
TW201830556A (zh) | 2018-08-16 |
US20180223426A1 (en) | 2018-08-09 |
US20220081767A1 (en) | 2022-03-17 |
TWI702672B (zh) | 2020-08-21 |
TWI735293B (zh) | 2021-08-01 |
KR20180091760A (ko) | 2018-08-16 |
US10752991B2 (en) | 2020-08-25 |
TW202044466A (zh) | 2020-12-01 |
CN208208720U (zh) | 2018-12-07 |
US11220746B2 (en) | 2022-01-11 |
KR20230110464A (ko) | 2023-07-24 |
JP2022137077A (ja) | 2022-09-21 |
CN108400102A (zh) | 2018-08-14 |
JP7407867B2 (ja) | 2024-01-04 |
JP7094113B2 (ja) | 2022-07-01 |
TWM569933U (zh) | 2018-11-11 |
US20200407844A1 (en) | 2020-12-31 |
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