JP2018155707A5 - - Google Patents
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- JP2018155707A5 JP2018155707A5 JP2017054930A JP2017054930A JP2018155707A5 JP 2018155707 A5 JP2018155707 A5 JP 2018155707A5 JP 2017054930 A JP2017054930 A JP 2017054930A JP 2017054930 A JP2017054930 A JP 2017054930A JP 2018155707 A5 JP2018155707 A5 JP 2018155707A5
- Authority
- JP
- Japan
- Prior art keywords
- scan
- value
- scan chain
- flop
- retention flip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 230000014759 maintenance of location Effects 0.000 claims 13
- 239000004065 semiconductor Substances 0.000 claims 8
- 238000003745 diagnosis Methods 0.000 claims 3
- 238000002405 diagnostic procedure Methods 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017054930A JP6878071B2 (ja) | 2017-03-21 | 2017-03-21 | 半導体集積回路及び半導体集積回路の診断方法 |
| CN201710710254.6A CN108627757A (zh) | 2017-03-21 | 2017-08-18 | 半导体集成电路以及半导体集成电路的诊断方法 |
| EP17188108.9A EP3379275A1 (en) | 2017-03-21 | 2017-08-28 | Semiconductor integrated circuit and semiconductor integrated circuit diagnosis method |
| US15/691,121 US10401430B2 (en) | 2017-03-21 | 2017-08-30 | Semiconductor integrated circuit and semiconductor integrated circuit diagnosis method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017054930A JP6878071B2 (ja) | 2017-03-21 | 2017-03-21 | 半導体集積回路及び半導体集積回路の診断方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2018155707A JP2018155707A (ja) | 2018-10-04 |
| JP2018155707A5 true JP2018155707A5 (enExample) | 2019-04-18 |
| JP6878071B2 JP6878071B2 (ja) | 2021-05-26 |
Family
ID=59745218
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017054930A Active JP6878071B2 (ja) | 2017-03-21 | 2017-03-21 | 半導体集積回路及び半導体集積回路の診断方法 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US10401430B2 (enExample) |
| EP (1) | EP3379275A1 (enExample) |
| JP (1) | JP6878071B2 (enExample) |
| CN (1) | CN108627757A (enExample) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE112020000469T5 (de) | 2019-01-22 | 2021-10-07 | Advantest Corporation | Automatisierte testeinrichtung, die ein auf-chip-system-teststeuergerät verwendet |
| US11802807B2 (en) * | 2019-09-25 | 2023-10-31 | Dell Products L.P. | Leak detection apparatus for an information handling system |
| EP4361650A4 (en) * | 2021-07-30 | 2024-09-18 | Huawei Technologies Co., Ltd. | METHOD FOR DESIGNING A TEST CIRCUIT AND ELECTRONIC DEVICE |
| JP2023040646A (ja) | 2021-09-10 | 2023-03-23 | キオクシア株式会社 | 半導体装置及び半導体装置の検査方法 |
| JPWO2023228812A1 (enExample) * | 2022-05-26 | 2023-11-30 | ||
| JP2024138860A (ja) | 2023-03-27 | 2024-10-09 | 株式会社東芝 | 半導体集積回路及び半導体集積回路のテスト方法 |
| CN118364781B (zh) * | 2024-06-20 | 2024-08-16 | 中国人民解放军国防科技大学 | 集成电路测试模式下的时钟诊断修复方法、装置和设备 |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6691268B1 (en) * | 2000-06-30 | 2004-02-10 | Oak Technology, Inc. | Method and apparatus for swapping state data with scan cells |
| JP4228061B2 (ja) * | 2000-12-07 | 2009-02-25 | 富士通マイクロエレクトロニクス株式会社 | 集積回路の試験装置および試験方法 |
| US20030188241A1 (en) * | 2002-03-29 | 2003-10-02 | International Business Machines Corporation | CMOS low leakage power-down data retention mechanism |
| JP2004093351A (ja) | 2002-08-30 | 2004-03-25 | Matsushita Electric Ind Co Ltd | 組み込み自己検査回路 |
| JP2004325124A (ja) | 2003-04-22 | 2004-11-18 | Matsushita Electric Ind Co Ltd | 半導体装置 |
| JP2006349548A (ja) | 2005-06-17 | 2006-12-28 | Matsushita Electric Ind Co Ltd | 組み込み自己検査回路 |
| US7596737B2 (en) * | 2006-11-10 | 2009-09-29 | Taiwan Semiconductor Manufacturing Co., Ltd. | System and method for testing state retention circuits |
| US8271226B2 (en) * | 2008-06-26 | 2012-09-18 | Cadence Design Systems, Inc. | Testing state retention logic in low power systems |
| US8296703B1 (en) * | 2008-12-19 | 2012-10-23 | Cadence Design Systems, Inc. | Fault modeling for state retention logic |
| JP2010282411A (ja) | 2009-06-04 | 2010-12-16 | Renesas Electronics Corp | 半導体集積回路、半導体集積回路の内部状態退避回復方法 |
| KR102112367B1 (ko) | 2013-02-12 | 2020-05-18 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
| JP2014185981A (ja) * | 2013-03-25 | 2014-10-02 | Toshiba Corp | 半導体集積回路および半導体集積回路の自己テスト方法 |
| US8841952B1 (en) * | 2013-05-27 | 2014-09-23 | Freescale Semiconductor, Inc. | Data retention flip-flop |
| CN105575438B (zh) * | 2014-10-16 | 2020-11-06 | 恩智浦美国有限公司 | 用于测试存储器的方法及装置 |
| KR102325388B1 (ko) * | 2015-06-04 | 2021-11-11 | 삼성전자주식회사 | 데이터 복원을 안정적으로 제어하는 파워 게이팅 제어 회로 |
-
2017
- 2017-03-21 JP JP2017054930A patent/JP6878071B2/ja active Active
- 2017-08-18 CN CN201710710254.6A patent/CN108627757A/zh active Pending
- 2017-08-28 EP EP17188108.9A patent/EP3379275A1/en not_active Withdrawn
- 2017-08-30 US US15/691,121 patent/US10401430B2/en active Active
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