JP2018142663A - 電子回路装置及び電子回路装置の製造方法 - Google Patents
電子回路装置及び電子回路装置の製造方法 Download PDFInfo
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Abstract
【解決手段】電子回路装置1は、面10aに第1ピッチP1で設けられた端子11群を有する電子部品10と、電子部品10の面10aに対向する面20aにピッチP2で設けられた端子21群を有する電子部品20とを含む。端子21群のピッチP2を、端子11群のピッチP1よりも大きくし、位置ずれが生じても、各端子21に少なくとも1つの端子11が接続されるようにすることで、電子部品10と電子部品20との間の位置ずれ許容量を増大させ、接続不良の発生を抑える。
【選択図】図3
Description
LSI(Large Scale Integration)チップ等の半導体素子は、フォトリソグラフィ技術を開発及び改善することで、その配線幅の微細化が進められてきた。この微細化により、トランジスタ面積の縮小、動作電圧の低減が図られ、その結果、半導体素子の高密度化、高速化、低消費電力化が実現されてきた。
図1及び図2は電子部品間の端子接続についての説明図である。
まず、第1の実施の形態について説明する。
図3に示す電子回路装置1は、対向して配置された電子部品10及び電子部品20を含む。電子部品10は、電子部品20と対向する面10aに、端子11群を有する。電子部品20は、電子部品10と対向する面20aに、端子21群を有する。端子11群及び端子21群は、例えば、電極パッド、又は表面に半田等の接合材が設けられた電極パッドである。このほか、端子11群及び端子21群は、ピラー、若しくは先端に半田等の接合材が設けられたピラー、又は半田バンプ等の突起状電極でもよい。
ここでは、上記第1の実施の形態で述べたような電子回路装置1の、より具体的な例を、第2の実施の形態として説明する。
図4に示す電子回路装置1Aは、電子部品として、上下に対向して配置された半導体チップ40(半導体素子)及び半導体チップ50(半導体素子)を含む。
半導体チップ40と半導体チップ50との接続時には、端子41が設けられた面40aと端子51が設けられた面50aとが対向されて位置合わせが行われた後、加熱及び加圧等が行われ、端子41群と端子51群とが接続される。
コンフィグ回路44の構成例を図5に示す。
コンフィグ回路44は、例えば、図5に示すように、マルチプレクサ(MUX)44a、メモリ回路44b及びスキャン回路44cを含む。
その際は、スキャン回路44cにより、マルチプレクサ44a1の出力ピンOUTに接続する入力ピンINが、ステップS2〜S5のスキャンで出力ピンOUTからHレベルの出力が検出された時の入力ピンINに設定される(ステップS7;図7)。そして、スキャン回路44cにより、出力ピンOUTからの出力がLレベルか否かが検出される(ステップS8;図7)。ステップS8において、出力がLレベルである場合は、第1のマルチプレクサ44a1についての設定は終了となり、第2のマルチプレクサ44a2について、同様にステップS1〜S8の処理が行われる。ステップS8において、出力がLレベルでない場合、この電子回路装置1Aはエラーと判定される(ステップS8;図7)。
図10は端子ピッチに関する説明図である。
図11は効果の説明図である。図11には、端子ピッチと位置ずれ許容量との関係を模式的に図示している。
図12は第3の実施の形態に係る電子回路装置の構成例を示す図である。尚、図12では便宜上、上下の電子部品の端子間を離間させている。
上側の半導体チップ40は、半導体チップ50と対向する面40aに設けられた端子41群、各端子41と配線43aを通じて電気的に接続されたコンフィグ回路44、及びコンフィグ回路44と配線43bを通じて電気的に接続されたチップ回路42を有する。端子41群は、平面サイズD4、スペースS4及びピッチP4で設けられる。
図13(A)には、上側の半導体チップ40に設けられる端子41群の平面レイアウトの一例を図示し、図13(B)には、下側の半導体チップ50に設けられる端子51群の平面レイアウトの一例を図示している。図14(A)〜図14(C)にはそれぞれ、上側の半導体チップ40と下側の半導体チップ50とが接続された時の、互いの端子41群と端子51群との重ね合わせイメージの一例を図示している。
その場合は、まず、下側の半導体チップ50のチップ回路52に、導体部55を経由して電気信号が供給され、端子51群のうちの1つのみが例えばHレベル(電源レベル)とされ、残りが例えばHigh−Z状態とされる。尚、この場合の半導体チップ50は、電源用及びGND用のいずれの端子51も回路的に個別にHigh−Z状態にできるような構成とされている。
メモリ回路に書き込まれた、各端子51の電気的接続先の端子41又は端子41群を示す情報は、ブートシーケンス時等、電子回路装置1Bの実動作時に読み出され、読み出された情報に示される端子41又は端子41群が、チップ回路42に接続される。これにより、その情報に示される組み合わせの各端子51とその電気的接続先の端子41又は端子41群を通じて、半導体チップ50と半導体チップ40との間の電気信号の伝送が行われる。
図15は第4の実施の形態に係る電子回路装置の構成例を示す図である。尚、図15では便宜上、上下の電子部品の端子間を離間させている。
上側の半導体チップ40は、半導体チップ50と対向する面40aに設けられた端子41群、各端子41と配線43aを通じて電気的に接続されたコンフィグ回路44、及びコンフィグ回路44と配線43bを通じて電気的に接続されたチップ回路42を有する。端子41群は、平面サイズD4、スペースS4及びピッチP4で設けられる。
図16及び図17は第5の実施の形態に係る電子回路装置の端子の説明図である。
図16(A)には、上側の半導体チップ40に設けられる端子41群の平面レイアウトの一例を図示し、図16(B)には、下側の半導体チップ50に設けられる端子51群の平面レイアウトの一例を図示している。図17(A)及び図17(B)にはそれぞれ、上側の半導体チップ40と下側の半導体チップ50とが接続された時の、互いの端子41群と端子51群との重ね合わせイメージの一例を図示している。
図18は第6の実施の形態に係る電子回路装置の構成例を示す図である。尚、図18では便宜上、上下の電子部品の端子間を離間させている。
上側の半導体チップ40には、例えば、上記第4の実施の形態で述べたような構成を有するものが用いられる。即ち、半導体チップ40は、端子41群、各端子41と配線43aを通じて電気的に接続されたコンフィグ回路44、及びコンフィグ回路44と配線43bを通じて電気的に接続されたチップ回路42を有する。端子41群は、平面サイズD4、スペースS4及びピッチP4で設けられる。半導体チップ40は更に、コンフィグ回路44及びチップ回路42から引き出された導体部46、及びそれと接続された比較的大面積の電極47を有する。
図19は第7の実施の形態に係る電子回路装置の構成例を示す図である。尚、図19では便宜上、上下の電子部品の端子間を離間させている。
電子回路装置1Eの半導体チップ40は、半導体チップ50と対向する面40aに設けられた端子41群、各端子41と配線43aを通じて電気的に接続されたコンフィグ回路44、及びコンフィグ回路44と配線43bを通じて電気的に接続されたチップ回路42を有する。端子41群は、平面サイズD4、スペースS4及びピッチP4で設けられる。
図20に示す電子回路装置1Fでは、半導体チップ40の面40b上に比較的広ピッチP8で端子41E群が設けられ、半導体チップ80の面80a上に比較的狭ピッチP4で端子81群が設けられる。この半導体チップ80内にコンフィグ回路44Eが設けられる。電子回路装置1Fは、このような点で、上記電子回路装置1Eと相違する。
また、電子回路装置1E及び電子回路装置1Fにおいて、半導体チップ80が上側に積層される半導体チップ40の下側の接続相手を、半導体チップ50に替えて、上記第6の実施の形態で述べたような回路基板70とすることもできる。
上記第1〜第7の実施の形態で述べたような電子回路装置1,1A,1B,1C,1D,1E,1F等は、各種電子機器に搭載することができる。例えば、コンピュータ(パーソナルコンピュータ、スーパーコンピュータ、サーバ等)、スマートフォン、携帯電話、タブレット端末、センサ、カメラ、オーディオ機器、測定装置、検査装置、製造装置といった、各種電子機器に搭載することができる。
図21に示すように、例えば上記第2の実施の形態で述べたような電子回路装置1A(図4)が、各種電子機器90に搭載(内蔵)される。電子回路装置1Aでは、一定の規約の下、半導体チップ40に比較的狭ピッチP4で端子41が設けられ、半導体チップ50に比較的広ピッチP5で端子51が設けられ、このような半導体チップ40と半導体チップ50とが物理的に接続される。半導体チップ40と半導体チップ50の物理的な接続時に、たとえ位置ずれGが生じても、比較的広いピッチ(広ピッチ)P5の端子51群は、比較的狭いピッチ(狭ピッチ)P4の端子41群の少なくとも1つと接続される。電子回路装置1Aでは、半導体チップ40と半導体チップ50との物理的な接続後に、コンフィグ回路44により、各端子51の電気的接続先となる端子41又は端子41群が設定される。これにより、半導体チップ40と半導体チップ50との位置ずれ許容量の増大が図られ、位置ずれに起因した接続不良が抑えられて、性能及び信頼性に優れた電子回路装置1Aが実現される。このような電子回路装置1Aを搭載する、性能及び信頼性に優れた電子機器90が実現される。
10,20,100,200 電子部品
10a,20a,40a,40b,50a,50b,70a,70b,80a 面
11,21,41,41E,51,71,81,110,210 端子
30 回路
40,50,80 半導体チップ
42,52,82 チップ回路
43a,43b,43c,43d,53a,83a 配線
44,44E コンフィグ回路
44a,44a1,44a2,44a3 マルチプレクサ
44b メモリ回路
44c スキャン回路
45,46,55,56,75,76 導体部
45a,55a,56a TSV
47,57,77 電極
60 制御装置
70 回路基板
90 電子機器
G0,G,G1,G2 位置ずれ
D0,D1,D2,D4,D5,D7,D8 平面サイズ
S1,S2,S4,S5,S7,S8 スペース
P0,P0a,P1,P2,P4,P5,P7,P8 ピッチ
S 入力信号
C1,C2 制御信号
IN(IN1〜IN6) 入力ピン
OUT 出力ピン
Claims (9)
- 第1面と、前記第1面に第1ピッチで設けられた第1端子群とを有する第1電子部品と、
前記第1面に対向する第2面と、前記第2面に前記第1ピッチよりも大きい第2ピッチで設けられ、各々に少なくとも1つの前記第1端子が接続される第2端子群とを有する第2電子部品と
を含むことを特徴とする電子回路装置。 - 隣り合う前記第2端子間のスペースは、前記第1端子の平面サイズよりも大きく、且つ、隣り合う前記第1端子間のスペースは、前記第2端子の平面サイズよりも小さいことを特徴とする請求項1に記載の電子回路装置。
- 前記第1端子の平面サイズは、前記第2端子の平面サイズよりも小さいことを特徴とする請求項1又は2に記載の電子回路装置。
- 前記第1電子部品に、前記第2端子と、前記第2端子に接続される少なくとも1つの前記第1端子との組み合わせを検出する回路を含むことを特徴とする請求項1乃至3のいずれかに記載の電子回路装置。
- 前記回路は、検出された前記組み合わせを示す情報を記憶するメモリを含むことを特徴とする請求項4に記載の電子回路装置。
- 前記メモリに記憶された前記情報を用い、前記組み合わせの前記第2端子と少なくとも1つの前記第1端子とを通じて、前記第1電子部品と前記第2電子部品との間で電気信号を伝送することを特徴とする請求項5に記載の電子回路装置。
- 第1電子部品の、第1ピッチで第1端子群が設けられた第1面と、第2電子部品の、前記第1ピッチよりも大きい第2ピッチで第2端子群が設けられた第2面とを対向させ、前記第2端子群の各々と、少なくとも1つの前記第1端子とを接続する工程を含むことを特徴とする電子回路装置の製造方法。
- 前記第1電子部品に設けられた回路を用い、前記第2端子と、前記第2端子に接続される少なくとも1つの前記第1端子との組み合わせを検出する工程を含むことを特徴とする請求項7に記載の電子回路装置の製造方法。
- 検出された前記組み合わせを示す情報をメモリに記憶する工程を含むことを特徴とする請求項8に記載の電子回路装置の製造方法。
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