JP2018107441A - p+基板、p−層、n−層および第3の層から成る層スタックの製造方法 - Google Patents
p+基板、p−層、n−層および第3の層から成る層スタックの製造方法 Download PDFInfo
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 25
- 239000000758 substrate Substances 0.000 title claims description 58
- 238000000407 epitaxy Methods 0.000 claims abstract description 19
- 238000005498 polishing Methods 0.000 claims abstract description 9
- 239000002019 doping agent Substances 0.000 claims description 17
- 229910001218 Gallium arsenide Inorganic materials 0.000 claims description 16
- -1 GaAs compound Chemical class 0.000 claims description 12
- 239000000463 material Substances 0.000 claims description 8
- 238000002513 implantation Methods 0.000 claims description 7
- 239000012535 impurity Substances 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 150000002736 metal compounds Chemical class 0.000 claims description 5
- 238000000926 separation method Methods 0.000 claims description 4
- 238000002347 injection Methods 0.000 abstract description 3
- 239000007924 injection Substances 0.000 abstract description 3
- 239000000243 solution Substances 0.000 abstract 1
- 239000004065 semiconductor Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000002488 metal-organic chemical vapour deposition Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000000969 carrier Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 239000007943 implant Substances 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 238000005215 recombination Methods 0.000 description 1
- 230000006798 recombination Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
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Abstract
【解決手段】第1の部分スタックは、少なくとも、p+基板を含んでおり、第2の部分スタックは、少なくとも、n-層を含んでおり、p-層は、p+基板の上面における注入またはエピタキシによって、またはn-層におけるエピタキシによって形成され、かつp-層は、第1の部分スタックの上面または第2の部分スタックの上面を形成し、第3の層は、ウェハボンディングの前または後に形成され、n-層は、ウェハボンディングの後に、第2の部分スタックを少なくとも部分的に形成するn-基板の研磨によって形成されるか、またはn-層は、ウェハボンディングの前に、n+基板の上に形成される。
【選択図】図1
Description
Claims (8)
- p+基板、p-層、n-層および第3の層から成る層スタックの製造方法において、
前記p+基板は、5×1018〜5×1020cm-3のドーパント濃度および50〜900μmの層厚を有しており、かつGaAs化合物を含有しているか、またはGaAs化合物から成り、
前記p-層は、1014〜1016cm-3のドーパント濃度および0.01〜1μmの層厚を有しており、かつGaAs化合物を含有しているか、またはGaAs化合物から成り、
前記n-層は、1014〜1016cm-3のドーパント濃度および10〜200μmの層厚を有しており、かつGaAs化合物を含有しているか、またはGaAs化合物から成り、
第1の部分スタックおよび第2の部分スタックを形成し、前記第1の部分スタックの上面を、ウェハボンディングを用いて、前記第2の部分スタックの上面と素材結合によって接合させることによって前記層スタックを形成し、
前記第1の部分スタックは、少なくとも、前記p+基板を含んでおり、
前記第2の部分スタックは、少なくとも、前記n-層を含んでおり、
前記p-層を、前記p+基板の上面における注入またはエピタキシによって、または前記n-層におけるエピタキシによって形成し、かつ前記p-層によって、前記第1の部分スタックの前記上面または前記第2の部分スタックの前記上面を形成し、
前記第3の層は、前記ウェハボンディングの前または後に形成し、
前記n-層を、第1の代替形態においては、前記ウェハボンディングの後に、前記第2の部分スタックを少なくとも部分的に形成するn-基板の研磨によって形成するか、または第2の代替形態においては、前記n-層を、前記ウェハボンディングの前に、n+基板の上に形成する、
製造方法。 - 前記ウェハボンディングの前に、前記n+基板の上に形成される前記n-層を、エピタキシによってn+基板の上に形成する、
請求項1記載の製造方法。 - 前記第3の層は、少なくとも1019cm-3のドーパント濃度および30μm未満の層厚を備えており、かつGaAs化合物を含有しているか、またはGaAs化合物から成るn+層として形成されている、
請求項1または2記載の製造方法。 - 前記n+層を、前記ウェハボンディングの後に、研磨によって形成された前記n-層におけるエピタキシによって、または研磨によって形成された前記n-層における注入によって、または前記n+基板の分離によって形成する、
請求項3記載の製造方法。 - 前記n+層を、前記n-層に直接的に接している、前記n+基板の領域として、前記ウェハボンディングの前に、前記n-層と共に、前記n+基板から分離させる、
請求項4記載の製造方法。 - 前記n-層を、不純物の注入によって、前記n-基板から分離させる、
請求項1から5までのいずれか1項記載の製造方法。 - 前記n-層を、不純物の注入によって、前記n+基板から分離させる、かつ/または、
前記n+層を、不純物の注入によって、前記n+基板から分離させる、
請求項1から5までのいずれか1項記載の製造方法。 - 前記第3の層は、金属または金属化合物を含有しているか、もしくは金属または金属化合物から成る、
請求項1または2記載の製造方法。
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DE102016015056.4A DE102016015056A1 (de) | 2016-12-17 | 2016-12-17 | Herstellungsverfahren eines Schichtstapels aus einem p+-Substrat, einer p--Schicht, einer n--Schicht und einer dritten Schicht |
DE102016015056.4 | 2016-12-17 |
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US (1) | US10192745B2 (ja) |
EP (1) | EP3336906B1 (ja) |
JP (1) | JP6649935B2 (ja) |
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DE102019003069B4 (de) | 2019-04-30 | 2023-06-01 | Azur Space Solar Power Gmbh | Stapelförmige hochsperrende lll-V-Halbleiterleistungsdioden |
DE102019003068A1 (de) | 2019-04-30 | 2020-11-05 | 3-5 Power Electronics GmbH | Stapelförmige hochsperrende lnGaAS-Halbleiterleistungsdiode |
DE102020001841A1 (de) | 2020-03-20 | 2021-09-23 | Azur Space Solar Power Gmbh | Stapelförmige hochsperrende III-V-Halbleiterleistungsdiode |
DE102020001842A1 (de) | 2020-03-20 | 2021-09-23 | Azur Space Solar Power Gmbh | Stapelförmiges photonisches III-V-Halbleiterbauelement |
DE102020001840B3 (de) | 2020-03-20 | 2021-09-23 | Azur Space Solar Power Gmbh | Stapelförmiges photonisches III-V-Halbleiterbauelement |
DE102020001838A1 (de) | 2020-03-20 | 2021-09-23 | Azur Space Solar Power Gmbh | Stapelförmige hochsperrende lll-V-Halbleiterleistungsdiode |
DE102020001835A1 (de) | 2020-03-20 | 2021-09-23 | Azur Space Solar Power Gmbh | Stapelförmige hochsperrende lll-V-Halbleiterleistungsdiode |
DE102020001837B3 (de) | 2020-03-20 | 2021-08-26 | Azur Space Solar Power Gmbh | Stapelförmiges photonisches lll-V-Halbleiterbauelement |
DE102020001843A1 (de) | 2020-03-20 | 2021-09-23 | Azur Space Solar Power Gmbh | Stapelförmige hochsperrende InGaAs-Halbleiterleistungsdiode |
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JP2001015769A (ja) * | 1999-07-02 | 2001-01-19 | Fuji Electric Co Ltd | 高耐圧半導体装置 |
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EP3336906B1 (de) | 2019-04-10 |
JP6649935B2 (ja) | 2020-02-19 |
CN108346576A (zh) | 2018-07-31 |
DE102016015056A1 (de) | 2018-06-21 |
EP3336906A1 (de) | 2018-06-20 |
CN108346576B (zh) | 2021-03-16 |
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