JP2018095959A5 - - Google Patents

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Publication number
JP2018095959A5
JP2018095959A5 JP2017227203A JP2017227203A JP2018095959A5 JP 2018095959 A5 JP2018095959 A5 JP 2018095959A5 JP 2017227203 A JP2017227203 A JP 2017227203A JP 2017227203 A JP2017227203 A JP 2017227203A JP 2018095959 A5 JP2018095959 A5 JP 2018095959A5
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JP
Japan
Prior art keywords
adhesive surface
region
close contact
sheet
partition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2017227203A
Other languages
English (en)
Japanese (ja)
Other versions
JP7002302B2 (ja
JP2018095959A (ja
Filing date
Publication date
Application filed filed Critical
Priority to CN201711281075.1A priority Critical patent/CN108220882B/zh
Priority to US15/838,982 priority patent/US10633736B2/en
Priority to TW106143484A priority patent/TWI656230B/zh
Priority to KR1020170170254A priority patent/KR102032307B1/ko
Publication of JP2018095959A publication Critical patent/JP2018095959A/ja
Publication of JP2018095959A5 publication Critical patent/JP2018095959A5/ja
Application granted granted Critical
Publication of JP7002302B2 publication Critical patent/JP7002302B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2017227203A 2016-12-13 2017-11-27 成膜装置 Active JP7002302B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
CN201711281075.1A CN108220882B (zh) 2016-12-13 2017-12-06 成膜装置
US15/838,982 US10633736B2 (en) 2016-12-13 2017-12-12 Film formation apparatus
TW106143484A TWI656230B (zh) 2016-12-13 2017-12-12 成膜裝置
KR1020170170254A KR102032307B1 (ko) 2016-12-13 2017-12-12 성막 장치

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016240856 2016-12-13
JP2016240856 2016-12-13

Publications (3)

Publication Number Publication Date
JP2018095959A JP2018095959A (ja) 2018-06-21
JP2018095959A5 true JP2018095959A5 (enExample) 2021-01-14
JP7002302B2 JP7002302B2 (ja) 2022-02-10

Family

ID=62632166

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017227203A Active JP7002302B2 (ja) 2016-12-13 2017-11-27 成膜装置

Country Status (4)

Country Link
JP (1) JP7002302B2 (enExample)
KR (1) KR102032307B1 (enExample)
CN (1) CN108220882B (enExample)
TW (1) TWI656230B (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7134802B2 (ja) * 2018-09-14 2022-09-12 株式会社アルバック 真空処理装置
JP7141989B2 (ja) * 2018-09-28 2022-09-26 芝浦メカトロニクス株式会社 成膜装置
JP7190386B2 (ja) * 2019-03-28 2022-12-15 芝浦メカトロニクス株式会社 成膜装置
JP7159238B2 (ja) * 2020-03-13 2022-10-24 キヤノントッキ株式会社 基板キャリア、成膜装置、及び成膜方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001003026A (ja) 1999-06-22 2001-01-09 Bridgestone Corp 粘着剤組成物、粘着剤付きフィルム及び粘着剤付きフィルムの貼着方法
JP4308564B2 (ja) 2002-04-09 2009-08-05 パナソニック株式会社 プラズマ処理装置及びプラズマ処理用トレー
US7232591B2 (en) 2002-04-09 2007-06-19 Matsushita Electric Industrial Co., Ltd. Method of using an adhesive for temperature control during plasma processing
EP1551730A4 (en) * 2002-09-11 2007-10-24 Entegris Inc PATTERNS WITH STICKY SURROGES
US7108899B2 (en) * 2002-09-11 2006-09-19 Entegris, Inc. Chip tray with tacky surface
JP2005116610A (ja) 2003-10-03 2005-04-28 Nitto Denko Corp 半導体ウエハの加工方法および半導体ウエハ加工用粘着シート
JP4555032B2 (ja) 2004-09-03 2010-09-29 シーエステック株式会社 トレイ
CN101803460B (zh) * 2007-09-10 2012-01-25 株式会社爱发科 有机材料蒸气产生装置、成膜源、成膜装置
DE112009002174B4 (de) * 2008-08-27 2021-08-19 Ulvac, Inc. Elektrostatische Haltevorrichtung und Unterdruck-Bearbeitungsvorrichtung
US20120225207A1 (en) * 2011-03-01 2012-09-06 Applied Materials, Inc. Apparatus and Process for Atomic Layer Deposition
JP2013035819A (ja) 2011-08-09 2013-02-21 Norimichi Kawashima 薬剤およびその使用方法
JP6411975B2 (ja) 2014-09-30 2018-10-24 芝浦メカトロニクス株式会社 成膜装置及び成膜基板製造方法
CN105463386B (zh) * 2014-09-30 2018-10-12 芝浦机械电子装置株式会社 成膜装置及成膜基板制造方法

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