JP2018085498A - ウェハ基板の変形を監視及び制御する方法及びシステム - Google Patents
ウェハ基板の変形を監視及び制御する方法及びシステム Download PDFInfo
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- 238000000034 method Methods 0.000 title claims abstract description 131
- 239000000758 substrate Substances 0.000 title claims abstract description 49
- 238000012544 monitoring process Methods 0.000 title claims abstract description 29
- 238000005530 etching Methods 0.000 claims abstract description 37
- 238000001020 plasma etching Methods 0.000 claims abstract description 26
- 238000012806 monitoring device Methods 0.000 claims description 13
- 230000008878 coupling Effects 0.000 claims description 7
- 238000010168 coupling process Methods 0.000 claims description 7
- 238000005859 coupling reaction Methods 0.000 claims description 7
- 230000002238 attenuated effect Effects 0.000 claims description 3
- 230000007423 decrease Effects 0.000 claims 1
- 230000003247 decreasing effect Effects 0.000 claims 1
- 238000010791 quenching Methods 0.000 claims 1
- 230000000171 quenching effect Effects 0.000 claims 1
- 235000012431 wafers Nutrition 0.000 description 116
- 239000007789 gas Substances 0.000 description 16
- 230000006378 damage Effects 0.000 description 6
- 229910052594 sapphire Inorganic materials 0.000 description 5
- 239000010980 sapphire Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 3
- 238000005498 polishing Methods 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000000227 grinding Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000010849 ion bombardment Methods 0.000 description 1
- 230000005693 optoelectronics Effects 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- KFZUDNZQQCWGKF-UHFFFAOYSA-M sodium;4-methylbenzenesulfinate Chemical compound [Na+].CC1=CC=C(S([O-])=O)C=C1 KFZUDNZQQCWGKF-UHFFFAOYSA-M 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- FAQYAMRNWDIXMY-UHFFFAOYSA-N trichloroborane Chemical compound ClB(Cl)Cl FAQYAMRNWDIXMY-UHFFFAOYSA-N 0.000 description 1
- 238000003631 wet chemical etching Methods 0.000 description 1
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- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32917—Plasma diagnostics
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- H01J37/32082—Radio frequency generated discharge
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- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32715—Workpiece holder
- H01J37/32724—Temperature
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/3065—Plasma etching; Reactive-ion etching
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
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- H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
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- H01L22/10—Measuring as part of the manufacturing process
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- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
- H01L22/24—Optical enhancement of defects or not directly visible states, e.g. selective electrolytic deposition, bubbles in liquids, light emission, colour change
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Abstract
Description
− ウェハ基板を、ウェハの上面全体が露出するようにプロセスチャンバ内のプラテンアセンブリ上に配置する工程;
− プロセスチャンバ中にプロセスガスを通す工程;
− プラテンアセンブリに高周波バイアス電圧を印加する工程;
− プロセスチャンバ内にプラズマを生成させる工程;
− エッチプロセスの間に、プラテンアセンブリとプロセスチャンバとの間の電圧差を監視する工程;
− 閾値監視電圧に達したら、さらなるエッチングを防止するためにプラズマを減衰又は消滅させる工程;
を含む方法が提供される。
プロセスチャンバ;
プロセスチャンバ中に配置され、ウェハ基板を受容するように構成されたプラテンアセンブリ;
プロセスガスをチャンバ中に受け入れるための入口;
プラズマを生成させるための手段;
当該プラテンアセンブリの電圧をバイアスするためにプラテンアセンブリに高周波電圧を印加するように構成された電圧発生器;
プラズマエッチプロセスの間にプラテンアセンブリとプロセスチャンバとの間の電圧差を監視するように構成された監視装置;及び
監視装置及びプラズマ生成手段に通信可能に結合されたプロセッサであって、閾値監視電圧に達したら、さらなるエッチングを防止するためにプラズマを減衰又は消滅させるように構成されたプロセッサ;
を含むシステムが提供される。
Claims (17)
- ウェハ基板のプラズマエッチングの間に前記ウェハ基板の変形を監視及び制御する方法であって、
− ウェハ基板を、前記ウェハの上面全体が露出するようにプロセスチャンバ内のプラテンアセンブリ上に配置する工程;
− 前記プロセスチャンバ中にプロセスガスを通す工程;
− 前記プラテンアセンブリに高周波バイアス電圧を印加する工程;
− 前記プロセスチャンバ内にプラズマを生成させる工程;
− エッチプロセスの間に、前記プラテンアセンブリと前記プロセスチャンバとの間の電圧差を監視する工程;
− 閾値監視電圧に達したら、さらなるエッチングを防止するために前記プラズマを減衰又は消滅させる工程;
を含む、方法。 - 前記プラテンアセンブリに対して前記変形が監視される、請求項1に記載の方法。
- 相対的変形の量が、前記ガスが前記ウェハ基板をエッチングする際の前記プラテンアセンブリと前記チャンバとの間の電圧差を監視することにより求められる、請求項2に記載の方法。
- 前記基板が電気的に絶縁性である、請求項1に記載の方法。
- 前記プラズマが、高周波(RF)電力を前記プロセスチャンバ中に誘導又は容量結合させることにより生成される、請求項1〜4のいずれか一項に記載の方法。
- 前記チャンバの周りに配置された1つ又は2つ以上のアンテナにRF電位を印加することにより前記チャンバ中にRF電力を誘導結合させることをさらに含む、請求項5に記載の方法。
- 前記プラテンアセンブリと前記チャンバとの間のピーク・トゥ・ピーク電圧差(Vpp)を監視することを含む、請求項1〜6のいずれか一項に記載の方法。
- 前記プラテンアセンブリと前記チャンバとの間の直流電圧差(Vdc)を監視することを含む又はさらに含む、請求項1〜7のいずれか一項に記載の方法。
- 前記プラテンアセンブリと前記チャンバとの間のVppが前記エッチングプロセスの開始時のVppの10%を超えたら、プラズマを減衰又は消滅させることをさらに含む、請求項7に記載の方法。
- 前記プラテンアセンブリと前記チャンバとの間のVppが前記エッチングプロセスの開始時のVppの20%を超えたら、プラズマを減衰又は消滅させることをさらに含む、請求項7に記載の方法。
- 前記プラテンアセンブリと前記チャンバの間のVdcが前記エッチングプロセスの開始時のVdcの50%を超えたら、プラズマを減衰又は消滅させることをさらに含む、請求項8に記載の方法。
- 前記プラテンアセンブリと前記チャンバの間のVdcが前記エッチングプロセスの開始時のVdcの100%を超えたら、プラズマを減衰又は消滅させることをさらに含む、請求項8に記載の方法。
- 監視した前記ピーク・トゥ・ピーク電圧差が、前記プラテンアセンブリ上に実質的にフラットな配向で延在するウェハのピーク・トゥ・ピーク電圧差に特徴的な値まで減少したら、前記プラズマを減衰又は消滅させることをさらに含む、請求項7に記載の方法。
- 監視した前記直流電圧差が、前記プラテンアセンブリ上に実質的にフラットな配向で延在するウェハの直流電圧差に特徴的な値まで減少したら、プラズマを減衰又は消滅させることをさらに含む、請求項8に記載の方法。
- 前記ウェハ基板の温度を調節するために前記プラテンアセンブリの温度を制御することをさらに含む、請求項1〜14のいずれか一項に記載の方法。
- ウェハ基板の上面全体をプラズマエッチングする間に前記ウェハ基板の変形を監視するためのシステムであって、
プロセスチャンバ;
前記プロセスチャンバ中に配置され、前記ウェハ基板を受容するように構成されたプラテンアセンブリ;
プロセスガスを前記チャンバ中に受け入れるための入口;
プラズマを生成させるための手段;
前記プラテンアセンブリの電圧をバイアスするために前記プラテンアセンブリに高周波電圧を印加するように構成された電圧発生器;
プラズマエッチプロセスの間に前記プラテンアセンブリと前記プロセスチャンバとの間の電圧差を監視するように構成された監視装置;及び
前記監視装置及び前記プラズマ生成手段に通信可能に結合されたプロセッサであって、閾値監視電圧に達したら、さらなるエッチングを防止するためにプラズマを減衰又は消滅させるように構成されたプロセッサ;
を含むシステム。 - ウェハ基板の上面全体をプラズマエッチングする間に前記ウェハ基板の変形を監視するためのシステムであって、請求項1に記載の方法を実施するように構成されたシステム。
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GBGB1615114.4A GB201615114D0 (en) | 2016-09-06 | 2016-09-06 | A Method and system of monitoring and controlling deformation of a wafer substrate |
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US10804125B2 (en) * | 2018-05-07 | 2020-10-13 | Applied Materials, Inc. | Substrate deformation detection and correction |
KR20210069117A (ko) * | 2018-10-30 | 2021-06-10 | 램 리써치 코포레이션 | 플라즈마 프로세싱 툴들을 위한 기판 상태 검출 |
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KR102215499B1 (ko) | 2021-02-10 |
EP3291280A1 (en) | 2018-03-07 |
JP6850703B2 (ja) | 2021-03-31 |
US10431436B2 (en) | 2019-10-01 |
TWI720249B (zh) | 2021-03-01 |
GB201615114D0 (en) | 2016-10-19 |
EP3291280B1 (en) | 2020-04-29 |
CN107799411B (zh) | 2022-11-15 |
TW201820381A (zh) | 2018-06-01 |
KR20180027386A (ko) | 2018-03-14 |
US20180144911A1 (en) | 2018-05-24 |
CN107799411A (zh) | 2018-03-13 |
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