JP2010521820A - 基板内での処理の均一性を改善するための動的な温度背面ガス制御 - Google Patents
基板内での処理の均一性を改善するための動的な温度背面ガス制御 Download PDFInfo
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Abstract
Description
Claims (38)
- 基板表面全体にわたるプロセスの均一性を制御する方法であって:
プロセス用の真空チャンバ内の基板支持体上で基板を支持する工程;
前記基板支持体内の複数の領域内に存在する複数のポートを介して前記基板支持体と前記基板との間の空間へ背面ガスを供する工程;及び、
前記複数のポートうちの各異なるポートでの背面ガス圧力を各独立して制御することで、前記ポートの各々の領域周辺で、プロセス中における前記基板全体にわたる前記背面ガス圧力のばらつき又は均一性を各独立して制御する工程;
を有する方法。 - 前記の背面圧力を制御する工程が、前記圧力を制御して前記基板と前記基板支持体との間の熱伝導度を制御することで、プロセス中での前記基板全体にわたる温度分布に影響を及ぼす工程を有する、請求項1に記載の方法。
- 前記基板全体にわたるパラメータを観測する工程及び該パラメータに応じて前記背面圧力を制御する工程をさらに有する、請求項1に記載の方法。
- 前記の基板支持体上で基板を支持する工程が前記基板を静電力によって前記基板支持体に保持する工程を有する、請求項1に記載の方法。
- 前記の背面ガスを供する工程が、前記ガスを、複数の領域の各々に存在するポートからなる複数の群の各々に係る複数のポートを介して、前記基板支持体全体にわたって注入する工程を有する、請求項1に記載の方法。
- 前記基板表面全体にわたる温度差に対して動的に影響する手順に従って、各領域内のポートを流れる背面ガス流を各独立して制御する工程をさらに有する、請求項3に記載の方法。
- 前記基板支持体全体にわたる各領域内の複数のポートからなる群を流れる背面ガス流を各独立に制御することで、プロセスチャンバ内部での他のプロセス条件によって生じるプロセスの不均一性に対する不均一効果を相殺するように、前記基板全体にわたる温度分布に影響を及ぼす工程をさらに有する、請求項1に記載の方法。
- 前記基板支持体全体にわたる各領域内の複数のポートからなる群を流れる背面ガス流を各独立かつ動的に変化させることで、入ってくるウエハの不均一性又は静的エッチングプロセスの不均一性の効果を相殺するように、前記基板全体にわたる温度分布に影響を及ぼす工程、をさらに有する、請求項1に記載の方法。
- 前記基板支持体の領域の各々が少なくとも2つの前記ポートを有し、
該2つの前記ポートは、背面ガスの供給体と接続する少なくとも背面ガス流入ポート、及び真空排気システムと接続する少なくとも1つの流出ポートを有する、方法であって、
当該方法は、プロセス中での前記基板全体にわたる温度分布を変化させるように前記領域の各々のポートを流入出するガス流に影響を及ぼす少なくとも1つのバルブを各独立して動的に制御する工程をさらに有する、
請求項1に記載の方法。 - 真空チャンバ;
該真空チャンバ内に存在する基板支持表面を有する基板支持体;
前記真空チャンバと結合するプラズマ源;
前記基板支持体表面と該表面上でプロセスのために支持される基板との間で背面ガスをやり取りするように設置された前記基板支持体表面内の複数のガスポート;
前記基板支持体の温度に影響を及ぼす前記基板支持体内の温度制御素子;
各々が前記ガスポートのうちの少なくとも1つと結合する複数のバルブ;並びに、
各独立して前記バルブを制御するように動作して前記基板支持体表面全体にわたる前記背面ガス分布を制御することで、請求項1の方法による前記板全体にわたる前記基板支持体表面と前記基板との間の熱伝導度に影響を及ぼすように動作可能な、制御装置;
を有するプラズマ処理装置。 - 前記ポートでの背面ガスを制御して、前記基板の直径に沿って少なくとも部分的に前記基板の温度を動的に変化させる工程をさらに有する、請求項1に記載の方法。
- 前記ポートでの背面ガスを制御して、前記基板の中心から少なくとも部分的には半径方向に前記基板の温度を動的に変化させる工程をさらに有する、請求項1に記載の方法。
- 前記ポートでの背面ガスを制御して、前記基板の中心について少なくとも部分的には円周方向に前記基板の温度を動的に変化させる工程をさらに有する、請求項1に記載の方法。
- 真空チャンバ;
該真空チャンバ内に存在する基板支持表面を有する基板支持体;
前記真空チャンバと結合するプラズマ源;
前記基板支持体表面と該表面上でプロセスのために支持される基板との間で背面ガスをやり取りするように設置された前記基板支持体表面内の複数のガスポート;
前記基板支持体の温度に影響を及ぼす前記基板支持体内の温度制御素子;
各々が各異なるガスポートと結合する複数のバルブ;並びに、
各独立して前記バルブを制御するように動作して前記基板支持体表面全体にわたる前記背面ガス分布を制御することで、前記板全体にわたる前記基板温度に影響を及ぼすように動作可能な、制御装置;
を有するプラズマ処理装置。 - 前記基板又は前記基板支持体全体にわたるパラメータを観測するセンサ;及び
該センサに応答して前記バルブを各独立して制御するように動作可能な制御装置;
をさらに有する、請求項14に記載の装置。 - 前記基板又は前記基板支持体全体にわたる圧力を観測するセンサ;及び
該センサに応答して前記バルブを各独立して制御するように動作可能な制御装置;
をさらに有する、請求項14に記載の装置。 - 前記基板又は前記基板支持体全体にわたる温度を観測するセンサ;及び
該センサに応答して前記バルブを各独立して制御するように動作可能な制御装置;
をさらに有する、請求項14に記載の装置。 - 前記基板支持体が静電チャックである、請求項14に記載の装置。
- 前記基板支持体が静電チャックであって、
該静電チャックは、前記基板表面の複数の領域の各々の温度を各独立に制御するために前記静電チャック内部に多領域温度制御素子を有する、
請求項14に記載の装置。 - 前記ポートがパターンをなすように配置されてかつ複数の群に分割され、
各群のポートは前記基板支持体表面の各異なる領域にわたって設けられ、
各バルブは、前記群の各々での前記背面ガスを制御して前記群のポート付近での熱伝導度に影響を及ぼすことで前記基板表面上の基板全体にわたる温度分布に影響を及ぼすように動作可能である、
請求項14に記載の装置。 - 背面ガス供給体;及び
真空排気システム;
をさらに有する装置であって、
前記基板支持体表面は複数の領域を有し、
各領域は該領域内部に複数のポートを有し、
該ポートは前記背面ガス供給体と接続する少なくとも1つの流入ポート及び前記真空排気システムと接続する少なくとも1つの流出ポートを有し、
各領域に係る前記ポートのうちの少なくとも1つは前記バルブのうちの対応するバルブを介して接続し、
前記制御装置は、各バルブを制御して前記背面ガスを制御することで前記基板支持体表面の各領域付近での前記基板の局所温度に影響を及ぼすことによって前記基板表面上の基板全体にわたる温度分布に影響を及ぼすように動作可能である、
請求項14に記載の装置。 - 基板を局所的に変形させる方法であって:
プロセス用の真空チャンバ内の基板支持体上で基板を支持する工程;
前記基板支持体全体にわたる複数の領域の各々に存在する複数のポートの群の各々に係る流入ポートを介して、前記基板支持体と前記基板との間の空間へ背面ガスを供する工程であって、前記の基板支持体の領域の各々は、背面ガス供給体と接続する少なくとも1つの背面ガス流入ポート及び真空排気システムと接続する少なくとも1つの背面ガス流出ポートを有する、工程;並びに、
前記領域の各々のポートへのガス流に影響を及ぼす少なくとも一のバルブを各独立に動的制御する一方で、ガスが導入される前記ポートを取り囲む前記領域の各々の残り複数のポートからのガス流に影響を及ぼす少なくとも1つの他のバルブを各独立に動的制御することによって、複数のポートうちの各異なるポートでの背面ガス圧力を各独立して制御して、前記ポートの各々の領域周辺で、前記基板背面に及ぼされる局所的な圧力を各独立して制御する工程;
を有する方法。 - 前記基板支持体上で前記基板を支持する工程が前記基板を静電力によって前記基板支持体に保持する工程を有する、請求項22に記載の方法。
- 前記の背面ガスを供する工程が、前記ガスを、複数の領域の各々に存在するポートからなる複数の群の各々に係る複数のポートを介して、前記基板支持体全体にわたって注入する工程を有する、請求項22に記載の方法。
- 前記基板表面全体にわたる温度差に対して動的に影響する手順に従って、各領域内のポートを流れる背面ガス流を各独立して制御する工程をさらに有する、請求項24に記載の方法。
- 前記基板上の部位に膜を堆積する工程をさらに有する、請求項22に記載の方法。
- 前記基板上の部位上の膜をエッチングする工程をさらに有する、請求項22に記載の方法。
- 前記基板上の部位上の膜の側壁を処理する工程をさらに有する、請求項22に記載の方法。
- 前記基板支持体の領域の各々が少なくとも2つの前記ポートを有し、
該2つの前記ポートは、背面ガスの供給体と接続する少なくとも背面ガス流入ポート、及び真空排気システムと接続する少なくとも1つの流出ポートを有する、
請求項22に記載の方法。 - 前記領域の1つでの前記基板背面上に及ぼされる局所的圧力が50Torrを超える、請求項22に記載の方法。
- 前記領域の1つでの前記基板背面上に及ぼされる局所的圧力が100Torrを超える、請求項22に記載の方法。
- 前記領域の1つでの前記基板背面上に及ぼされる局所的圧力が500Torrを超える、請求項22に記載の方法。
- 前記領域の1つでの前記基板背面上に及ぼされる局所的圧力が前記基板の変形を生じさせる、請求項22に記載の方法。
- 前記領域の1つでの前記基板背面上に及ぼされる局所的圧力が前記基板内での引っ張り応力及び圧縮応力の発生を起こす、請求項22に記載の方法。
- 基板を局所的に変形させる方法であって:
プロセス中での基板の変形プロファイルを予め決定する工程;
プロセス用の真空チャンバ内の基板支持体上で基板を支持する工程;
前記基板支持体全体にわたる複数の領域の各々に存在する複数のポートの群の各々に係る流入ポートを介して、前記基板支持体と前記基板との間の空間へ背面ガスを供する工程であって、前記の基板支持体の領域の各々は、背面ガス供給体と接続する少なくとも1つの背面ガス流入ポート及び真空排気システムと接続する少なくとも1つの背面ガス流出ポートを有する、工程;並びに、
複数のポートうちの各異なるポートでの背面ガス圧力を各独立して制御して、前記ポートの各々の領域周辺で、前記基板背面に及ぼされる局所的な圧力を各独立して制御することによって前記の基板の所定の変形プロファイルを実現する工程;
を有する方法。 - 前記所定の変形プロファイルを生成するために圧力プロファイルを予め決定する工程;及び、
前記の予め決定された圧力プロファイルに従って前記背面ガスの圧力を各独立して制御する工程;
をさらに有する、請求項35に記載の方法。 - プロセス中での前記基板の変形を検知する工程;及び、
前記の検知された基板の変形に応答して前記背面ガスの圧力を各独立に制御する工程;
をさらに有する、請求項35に記載の方法。 - 前記圧力を制御する工程が、前記領域の各々のポートへのガス流に影響を及ぼす少なくとも一のバルブを各独立に動的制御する一方で、ガスが導入される前記ポートを取り囲む前記領域の各々の残り複数のポートからのガス流に影響を及ぼす少なくとも1つの他のバルブを各独立に動的制御することによって、複数のポートうちの各異なるポートでの背面ガス圧力を各独立して制御して、前記ポートの各々の領域周辺で、前記基板背面に及ぼされる局所的な圧力を各独立して制御する工程を有する、
請求項35に記載の方法。
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US11/684,957 US7576018B2 (en) | 2007-03-12 | 2007-03-12 | Method for flexing a substrate during processing |
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KR102412534B1 (ko) * | 2014-11-19 | 2022-06-23 | 베리안 세미콘덕터 이큅먼트 어소시에이츠, 인크. | 작업물의 온도를 제어하기 위한 시스템 및 방법 |
JP2018505561A (ja) * | 2015-02-06 | 2018-02-22 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | 静電チャック表面の半径方向外側パッド設計 |
JP2018085498A (ja) * | 2016-09-06 | 2018-05-31 | エスピーティーエス テクノロジーズ リミティド | ウェハ基板の変形を監視及び制御する方法及びシステム |
KR20200030455A (ko) * | 2018-09-12 | 2020-03-20 | 도쿄엘렉트론가부시키가이샤 | 진공 반송 모듈 및 진공 반송 방법 |
KR102338151B1 (ko) | 2018-09-12 | 2021-12-10 | 도쿄엘렉트론가부시키가이샤 | 진공 반송 모듈 및 진공 반송 방법 |
JP2020068350A (ja) * | 2018-10-26 | 2020-04-30 | 日本特殊陶業株式会社 | 保持装置 |
JP7198629B2 (ja) | 2018-10-26 | 2023-01-04 | 日本特殊陶業株式会社 | 保持装置 |
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KR20100015515A (ko) | 2010-02-12 |
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