JP2018085487A - 半導体装置の製造方法および半導体装置 - Google Patents

半導体装置の製造方法および半導体装置 Download PDF

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Publication number
JP2018085487A
JP2018085487A JP2016229239A JP2016229239A JP2018085487A JP 2018085487 A JP2018085487 A JP 2018085487A JP 2016229239 A JP2016229239 A JP 2016229239A JP 2016229239 A JP2016229239 A JP 2016229239A JP 2018085487 A JP2018085487 A JP 2018085487A
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Japan
Prior art keywords
semiconductor device
electrode layer
resin
manufacturing
semiconductor
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JP2016229239A
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Japanese (ja)
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JP2018085487A5 (https=
Inventor
佑也 五郎丸
Yuya Goromaru
佑也 五郎丸
木村　浩
Hiroshi Kimura
浩 木村
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Torex Semiconductor Ltd
Maxell Ltd
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Maxell Holdings Ltd
Torex Semiconductor Ltd
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Priority to JP2016229239A priority Critical patent/JP2018085487A/ja
Publication of JP2018085487A publication Critical patent/JP2018085487A/ja
Publication of JP2018085487A5 publication Critical patent/JP2018085487A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
    • H10W74/142—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed the encapsulations exposing the passive side of the semiconductor body
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

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JP2016229239A 2016-11-25 2016-11-25 半導体装置の製造方法および半導体装置 Pending JP2018085487A (ja)

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JP2016229239A JP2018085487A (ja) 2016-11-25 2016-11-25 半導体装置の製造方法および半導体装置

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JP2016229239A JP2018085487A (ja) 2016-11-25 2016-11-25 半導体装置の製造方法および半導体装置

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JP2018085487A true JP2018085487A (ja) 2018-05-31
JP2018085487A5 JP2018085487A5 (https=) 2019-11-28

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020027850A (ja) * 2018-08-10 2020-02-20 ローム株式会社 半導体装置および半導体装置の製造方法
JP2023045460A (ja) * 2021-09-22 2023-04-03 ローム株式会社 半導体装置および半導体装置の製造方法
WO2023112677A1 (ja) * 2021-12-13 2023-06-22 ローム株式会社 半導体装置および半導体装置の製造方法

Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH098205A (ja) * 1995-06-14 1997-01-10 Dainippon Printing Co Ltd 樹脂封止型半導体装置
JP2002009196A (ja) * 2000-06-20 2002-01-11 Kyushu Hitachi Maxell Ltd 半導体装置の製造方法
JP2002289739A (ja) * 2001-03-23 2002-10-04 Dainippon Printing Co Ltd 樹脂封止型半導体装置および半導体装置用回路部材とその製造方法
JP2009200175A (ja) * 2008-02-20 2009-09-03 Mitsumi Electric Co Ltd 半導体装置及びその製造方法
EP2361000A1 (en) * 2010-02-11 2011-08-24 Nxp B.V. Leadless chip package mounting method and carrier
JP2011205153A (ja) * 2011-07-20 2011-10-13 Dainippon Printing Co Ltd 樹脂封止型半導体装置および半導体装置用回路部材
JP2013235999A (ja) * 2012-05-10 2013-11-21 Renesas Electronics Corp 半導体装置の製造方法および半導体装置
JP2015073120A (ja) * 2009-09-29 2015-04-16 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
WO2015145651A1 (ja) * 2014-03-27 2015-10-01 ルネサスエレクトロニクス株式会社 半導体装置の製造方法および半導体装置
JP2016127261A (ja) * 2014-12-27 2016-07-11 日立マクセル株式会社 半導体装置用基板、半導体装置用基板の製造方法、及び半導体装置
JP2017175131A (ja) * 2016-03-17 2017-09-28 ローム株式会社 半導体装置およびその製造方法
JP2017228559A (ja) * 2016-06-20 2017-12-28 ローム株式会社 半導体装置およびその製造方法

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH098205A (ja) * 1995-06-14 1997-01-10 Dainippon Printing Co Ltd 樹脂封止型半導体装置
JP2002009196A (ja) * 2000-06-20 2002-01-11 Kyushu Hitachi Maxell Ltd 半導体装置の製造方法
JP2002289739A (ja) * 2001-03-23 2002-10-04 Dainippon Printing Co Ltd 樹脂封止型半導体装置および半導体装置用回路部材とその製造方法
JP2009200175A (ja) * 2008-02-20 2009-09-03 Mitsumi Electric Co Ltd 半導体装置及びその製造方法
JP2015073120A (ja) * 2009-09-29 2015-04-16 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
EP2361000A1 (en) * 2010-02-11 2011-08-24 Nxp B.V. Leadless chip package mounting method and carrier
JP2011205153A (ja) * 2011-07-20 2011-10-13 Dainippon Printing Co Ltd 樹脂封止型半導体装置および半導体装置用回路部材
JP2013235999A (ja) * 2012-05-10 2013-11-21 Renesas Electronics Corp 半導体装置の製造方法および半導体装置
WO2015145651A1 (ja) * 2014-03-27 2015-10-01 ルネサスエレクトロニクス株式会社 半導体装置の製造方法および半導体装置
JP2016127261A (ja) * 2014-12-27 2016-07-11 日立マクセル株式会社 半導体装置用基板、半導体装置用基板の製造方法、及び半導体装置
JP2017175131A (ja) * 2016-03-17 2017-09-28 ローム株式会社 半導体装置およびその製造方法
JP2017228559A (ja) * 2016-06-20 2017-12-28 ローム株式会社 半導体装置およびその製造方法

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020027850A (ja) * 2018-08-10 2020-02-20 ローム株式会社 半導体装置および半導体装置の製造方法
JP7179526B2 (ja) 2018-08-10 2022-11-29 ローム株式会社 半導体装置および半導体装置の製造方法
JP2023045460A (ja) * 2021-09-22 2023-04-03 ローム株式会社 半導体装置および半導体装置の製造方法
JP7810534B2 (ja) 2021-09-22 2026-02-03 ローム株式会社 半導体装置および半導体装置の製造方法
WO2023112677A1 (ja) * 2021-12-13 2023-06-22 ローム株式会社 半導体装置および半導体装置の製造方法

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