JP2018060876A5 - - Google Patents

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Publication number
JP2018060876A5
JP2018060876A5 JP2016196164A JP2016196164A JP2018060876A5 JP 2018060876 A5 JP2018060876 A5 JP 2018060876A5 JP 2016196164 A JP2016196164 A JP 2016196164A JP 2016196164 A JP2016196164 A JP 2016196164A JP 2018060876 A5 JP2018060876 A5 JP 2018060876A5
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JP
Japan
Prior art keywords
cavity
core substrate
electronic component
component built
support pattern
Prior art date
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Application number
JP2016196164A
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English (en)
Japanese (ja)
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JP6678090B2 (ja
JP2018060876A (ja
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Priority to JP2016196164A priority Critical patent/JP6678090B2/ja
Priority claimed from JP2016196164A external-priority patent/JP6678090B2/ja
Priority to US15/718,280 priority patent/US10321574B2/en
Publication of JP2018060876A publication Critical patent/JP2018060876A/ja
Publication of JP2018060876A5 publication Critical patent/JP2018060876A5/ja
Application granted granted Critical
Publication of JP6678090B2 publication Critical patent/JP6678090B2/ja
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JP2016196164A 2016-10-04 2016-10-04 電子部品内蔵基板及びその製造方法と電子部品装置 Active JP6678090B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2016196164A JP6678090B2 (ja) 2016-10-04 2016-10-04 電子部品内蔵基板及びその製造方法と電子部品装置
US15/718,280 US10321574B2 (en) 2016-10-04 2017-09-28 Electronic component-embedded substrate and electronic component device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016196164A JP6678090B2 (ja) 2016-10-04 2016-10-04 電子部品内蔵基板及びその製造方法と電子部品装置

Publications (3)

Publication Number Publication Date
JP2018060876A JP2018060876A (ja) 2018-04-12
JP2018060876A5 true JP2018060876A5 (enExample) 2019-06-20
JP6678090B2 JP6678090B2 (ja) 2020-04-08

Family

ID=61759157

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016196164A Active JP6678090B2 (ja) 2016-10-04 2016-10-04 電子部品内蔵基板及びその製造方法と電子部品装置

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US (1) US10321574B2 (enExample)
JP (1) JP6678090B2 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11335614B2 (en) * 2017-10-26 2022-05-17 Tdk Corporation Electric component embedded structure
KR102595865B1 (ko) * 2019-03-04 2023-10-30 삼성전자주식회사 하이브리드 인터포저를 갖는 반도체 패키지
CN111970809B (zh) * 2019-05-20 2022-01-11 鹏鼎控股(深圳)股份有限公司 高频电路板及其制作方法
JP2021052108A (ja) * 2019-09-25 2021-04-01 ソニーセミコンダクタソリューションズ株式会社 半導体レーザ駆動装置、電子機器、および、半導体レーザ駆動装置の製造方法
US11158582B2 (en) 2019-12-04 2021-10-26 Amkor Technology Singapore Holding Pte. Ltd. Semiconductor devices and methods of manufacturing semiconductor devices
US11342248B2 (en) * 2020-07-14 2022-05-24 Gan Systems Inc. Embedded die packaging for power semiconductor devices
KR20230061801A (ko) * 2021-10-29 2023-05-09 삼성전기주식회사 전자부품 내장기판

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011249457A (ja) * 2010-05-25 2011-12-08 Dainippon Printing Co Ltd 部品内蔵配線板、部品内蔵配線板の製造方法
KR101422437B1 (ko) 2011-05-13 2014-07-22 이비덴 가부시키가이샤 배선판 및 그 제조 방법
JP5968753B2 (ja) * 2012-10-15 2016-08-10 新光電気工業株式会社 配線基板
JP2015159153A (ja) * 2014-02-21 2015-09-03 イビデン株式会社 電子部品内蔵多層配線板
JP6393566B2 (ja) * 2014-09-17 2018-09-19 新光電気工業株式会社 配線基板、半導体装置及び配線基板の製造方法

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