JP6678090B2 - 電子部品内蔵基板及びその製造方法と電子部品装置 - Google Patents

電子部品内蔵基板及びその製造方法と電子部品装置 Download PDF

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Publication number
JP6678090B2
JP6678090B2 JP2016196164A JP2016196164A JP6678090B2 JP 6678090 B2 JP6678090 B2 JP 6678090B2 JP 2016196164 A JP2016196164 A JP 2016196164A JP 2016196164 A JP2016196164 A JP 2016196164A JP 6678090 B2 JP6678090 B2 JP 6678090B2
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JP
Japan
Prior art keywords
cavity
core substrate
electronic component
substrate
support pattern
Prior art date
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Active
Application number
JP2016196164A
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English (en)
Japanese (ja)
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JP2018060876A (ja
JP2018060876A5 (enExample
Inventor
淳史 佐藤
淳史 佐藤
深瀬　克哉
克哉 深瀬
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP2016196164A priority Critical patent/JP6678090B2/ja
Priority to US15/718,280 priority patent/US10321574B2/en
Publication of JP2018060876A publication Critical patent/JP2018060876A/ja
Publication of JP2018060876A5 publication Critical patent/JP2018060876A5/ja
Application granted granted Critical
Publication of JP6678090B2 publication Critical patent/JP6678090B2/ja
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
    • H10W70/05—
    • H10W70/65—
    • H10W70/685—
    • H10W72/00—
    • H10W74/141—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10015—Non-printed capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0191—Using tape or non-metallic foil in a process, e.g. during filling of a hole with conductive paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1461—Applying or finishing the circuit pattern after another process, e.g. after filling of vias with conductive paste, after making printed resistors
    • H05K2203/1469—Circuit made after mounting or encapsulation of the components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
    • H10W70/095—
    • H10W70/635—
    • H10W74/15—
    • H10W90/724—
    • H10W90/728—
    • H10W90/734—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Geometry (AREA)
JP2016196164A 2016-10-04 2016-10-04 電子部品内蔵基板及びその製造方法と電子部品装置 Active JP6678090B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2016196164A JP6678090B2 (ja) 2016-10-04 2016-10-04 電子部品内蔵基板及びその製造方法と電子部品装置
US15/718,280 US10321574B2 (en) 2016-10-04 2017-09-28 Electronic component-embedded substrate and electronic component device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016196164A JP6678090B2 (ja) 2016-10-04 2016-10-04 電子部品内蔵基板及びその製造方法と電子部品装置

Publications (3)

Publication Number Publication Date
JP2018060876A JP2018060876A (ja) 2018-04-12
JP2018060876A5 JP2018060876A5 (enExample) 2019-06-20
JP6678090B2 true JP6678090B2 (ja) 2020-04-08

Family

ID=61759157

Family Applications (1)

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JP2016196164A Active JP6678090B2 (ja) 2016-10-04 2016-10-04 電子部品内蔵基板及びその製造方法と電子部品装置

Country Status (2)

Country Link
US (1) US10321574B2 (enExample)
JP (1) JP6678090B2 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11335614B2 (en) * 2017-10-26 2022-05-17 Tdk Corporation Electric component embedded structure
KR102595865B1 (ko) * 2019-03-04 2023-10-30 삼성전자주식회사 하이브리드 인터포저를 갖는 반도체 패키지
CN111970809B (zh) * 2019-05-20 2022-01-11 鹏鼎控股(深圳)股份有限公司 高频电路板及其制作方法
JP2021052108A (ja) * 2019-09-25 2021-04-01 ソニーセミコンダクタソリューションズ株式会社 半導体レーザ駆動装置、電子機器、および、半導体レーザ駆動装置の製造方法
US11158582B2 (en) 2019-12-04 2021-10-26 Amkor Technology Singapore Holding Pte. Ltd. Semiconductor devices and methods of manufacturing semiconductor devices
US11342248B2 (en) * 2020-07-14 2022-05-24 Gan Systems Inc. Embedded die packaging for power semiconductor devices
KR20230061801A (ko) * 2021-10-29 2023-05-09 삼성전기주식회사 전자부품 내장기판
WO2026009566A1 (ja) * 2024-07-04 2026-01-08 株式会社村田製作所 電子部品内蔵基板

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011249457A (ja) * 2010-05-25 2011-12-08 Dainippon Printing Co Ltd 部品内蔵配線板、部品内蔵配線板の製造方法
JP5600803B2 (ja) 2011-05-13 2014-10-01 イビデン株式会社 配線板及びその製造方法
JP5968753B2 (ja) * 2012-10-15 2016-08-10 新光電気工業株式会社 配線基板
JP2015159153A (ja) * 2014-02-21 2015-09-03 イビデン株式会社 電子部品内蔵多層配線板
JP6393566B2 (ja) * 2014-09-17 2018-09-19 新光電気工業株式会社 配線基板、半導体装置及び配線基板の製造方法

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JP2018060876A (ja) 2018-04-12
US10321574B2 (en) 2019-06-11
US20180098430A1 (en) 2018-04-05

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