JP2018022824A5 - - Google Patents

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Publication number
JP2018022824A5
JP2018022824A5 JP2016154426A JP2016154426A JP2018022824A5 JP 2018022824 A5 JP2018022824 A5 JP 2018022824A5 JP 2016154426 A JP2016154426 A JP 2016154426A JP 2016154426 A JP2016154426 A JP 2016154426A JP 2018022824 A5 JP2018022824 A5 JP 2018022824A5
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JP
Japan
Prior art keywords
electronic component
cavity
pattern
core substrate
insulating layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2016154426A
Other languages
English (en)
Japanese (ja)
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JP6660850B2 (ja
JP2018022824A (ja
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Publication date
Application filed filed Critical
Priority to JP2016154426A priority Critical patent/JP6660850B2/ja
Priority claimed from JP2016154426A external-priority patent/JP6660850B2/ja
Priority to US15/658,532 priority patent/US10080293B2/en
Publication of JP2018022824A publication Critical patent/JP2018022824A/ja
Publication of JP2018022824A5 publication Critical patent/JP2018022824A5/ja
Application granted granted Critical
Publication of JP6660850B2 publication Critical patent/JP6660850B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2016154426A 2016-08-05 2016-08-05 電子部品内蔵基板及びその製造方法と電子部品装置 Active JP6660850B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2016154426A JP6660850B2 (ja) 2016-08-05 2016-08-05 電子部品内蔵基板及びその製造方法と電子部品装置
US15/658,532 US10080293B2 (en) 2016-08-05 2017-07-25 Electronic component-embedded board and electronic component device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016154426A JP6660850B2 (ja) 2016-08-05 2016-08-05 電子部品内蔵基板及びその製造方法と電子部品装置

Publications (3)

Publication Number Publication Date
JP2018022824A JP2018022824A (ja) 2018-02-08
JP2018022824A5 true JP2018022824A5 (enExample) 2019-04-18
JP6660850B2 JP6660850B2 (ja) 2020-03-11

Family

ID=61072023

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016154426A Active JP6660850B2 (ja) 2016-08-05 2016-08-05 電子部品内蔵基板及びその製造方法と電子部品装置

Country Status (2)

Country Link
US (1) US10080293B2 (enExample)
JP (1) JP6660850B2 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10737495B2 (en) 2018-02-13 2020-08-11 Seiko Epson Corporation Liquid ejecting apparatus and maintenance method of liquid ejecting apparatus
JP2019176118A (ja) * 2018-03-28 2019-10-10 京セラ株式会社 配線基板
KR102595865B1 (ko) * 2019-03-04 2023-10-30 삼성전자주식회사 하이브리드 인터포저를 갖는 반도체 패키지
KR102867020B1 (ko) * 2020-09-16 2025-10-01 삼성전기주식회사 전자부품 내장기판
US20220130741A1 (en) * 2020-10-27 2022-04-28 Qualcomm Incorporated Package structure for passive component to die critical distance reduction
KR20220067630A (ko) * 2020-11-17 2022-05-25 삼성전자주식회사 반도체 패키지
KR20240165255A (ko) * 2023-05-15 2024-11-22 앱솔릭스 인코포레이티드 소자 내장 기판 및 이의 제조방법

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4437361B2 (ja) 2000-07-21 2010-03-24 イビデン株式会社 プリント配線板及びプリント配線板の製造方法
FI119583B (fi) * 2003-02-26 2008-12-31 Imbera Electronics Oy Menetelmä elektroniikkamoduulin valmistamiseksi
JP4648230B2 (ja) 2006-03-24 2011-03-09 日本特殊陶業株式会社 配線基板の製造方法
KR101422437B1 (ko) 2011-05-13 2014-07-22 이비덴 가부시키가이샤 배선판 및 그 제조 방법
JP5955023B2 (ja) * 2012-02-23 2016-07-20 京セラ株式会社 部品内蔵印刷配線板及びその製造方法
KR101420526B1 (ko) * 2012-11-29 2014-07-17 삼성전기주식회사 전자부품 내장기판 및 그 제조방법
JP2014220366A (ja) 2013-05-08 2014-11-20 イビデン株式会社 電子部品内蔵配線板および電子部品内蔵配線板の製造方法
JP2015159153A (ja) * 2014-02-21 2015-09-03 イビデン株式会社 電子部品内蔵多層配線板
JP2015191996A (ja) * 2014-03-28 2015-11-02 京セラサーキットソリューションズ株式会社 印刷配線板およびその製造方法
JP2015220282A (ja) * 2014-05-15 2015-12-07 イビデン株式会社 プリント配線板
KR101609264B1 (ko) * 2014-12-09 2016-04-05 삼성전기주식회사 전자소자 내장 기판 및 그 제조 방법
JP2016219478A (ja) * 2015-05-15 2016-12-22 イビデン株式会社 配線基板及びその製造方法

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