JP6660850B2 - 電子部品内蔵基板及びその製造方法と電子部品装置 - Google Patents

電子部品内蔵基板及びその製造方法と電子部品装置 Download PDF

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Publication number
JP6660850B2
JP6660850B2 JP2016154426A JP2016154426A JP6660850B2 JP 6660850 B2 JP6660850 B2 JP 6660850B2 JP 2016154426 A JP2016154426 A JP 2016154426A JP 2016154426 A JP2016154426 A JP 2016154426A JP 6660850 B2 JP6660850 B2 JP 6660850B2
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electronic component
core substrate
cavity
pattern
insulating layer
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JP2018022824A (ja
JP2018022824A5 (enExample
Inventor
淳史 佐藤
淳史 佐藤
深瀬　克哉
克哉 深瀬
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Shinko Electric Industries Co Ltd
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Shinko Electric Industries Co Ltd
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Priority to JP2016154426A priority Critical patent/JP6660850B2/ja
Priority to US15/658,532 priority patent/US10080293B2/en
Publication of JP2018022824A publication Critical patent/JP2018022824A/ja
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H05K1/186—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit manufactured by mounting on or connecting to patterned circuits before or during embedding
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    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
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    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10015—Non-printed capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10507—Involving several components
    • H05K2201/10515—Stacked components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10507—Involving several components
    • H05K2201/10522—Adjacent components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Geometry (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
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US10737495B2 (en) 2018-02-13 2020-08-11 Seiko Epson Corporation Liquid ejecting apparatus and maintenance method of liquid ejecting apparatus
JP2019176118A (ja) * 2018-03-28 2019-10-10 京セラ株式会社 配線基板
KR102595865B1 (ko) * 2019-03-04 2023-10-30 삼성전자주식회사 하이브리드 인터포저를 갖는 반도체 패키지
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US20220130741A1 (en) * 2020-10-27 2022-04-28 Qualcomm Incorporated Package structure for passive component to die critical distance reduction
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KR20240165255A (ko) * 2023-05-15 2024-11-22 앱솔릭스 인코포레이티드 소자 내장 기판 및 이의 제조방법

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KR101420526B1 (ko) * 2012-11-29 2014-07-17 삼성전기주식회사 전자부품 내장기판 및 그 제조방법
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JP2015191996A (ja) * 2014-03-28 2015-11-02 京セラサーキットソリューションズ株式会社 印刷配線板およびその製造方法
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