JP2018056552A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2018056552A5 JP2018056552A5 JP2017151954A JP2017151954A JP2018056552A5 JP 2018056552 A5 JP2018056552 A5 JP 2018056552A5 JP 2017151954 A JP2017151954 A JP 2017151954A JP 2017151954 A JP2017151954 A JP 2017151954A JP 2018056552 A5 JP2018056552 A5 JP 2018056552A5
- Authority
- JP
- Japan
- Prior art keywords
- photoluminescent
- light emitting
- layer
- emitting device
- photoluminescence
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000463 material Substances 0.000 claims description 58
- 239000011159 matrix material Substances 0.000 claims description 36
- 229920000642 polymer Polymers 0.000 claims description 33
- 230000004888 barrier function Effects 0.000 claims description 13
- 239000002245 particle Substances 0.000 claims description 13
- 238000000149 argon plasma sintering Methods 0.000 claims description 8
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 4
- 239000002861 polymer material Substances 0.000 claims description 4
- 238000004806 packaging method and process Methods 0.000 claims description 2
- 238000005424 photoluminescence Methods 0.000 claims 30
- 239000004065 semiconductor Substances 0.000 claims 17
- 230000005540 biological transmission Effects 0.000 claims 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 7
- 239000000758 substrate Substances 0.000 claims 4
- 230000003287 optical effect Effects 0.000 claims 3
- XPIIDKFHGDPTIY-UHFFFAOYSA-N F.F.F.P Chemical compound F.F.F.P XPIIDKFHGDPTIY-UHFFFAOYSA-N 0.000 claims 1
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 claims 1
- 229910052748 manganese Inorganic materials 0.000 claims 1
- 239000011572 manganese Substances 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 claims 1
- 239000004054 semiconductor nanocrystal Substances 0.000 claims 1
- 125000006850 spacer group Chemical group 0.000 claims 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 229920001296 polysiloxane Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 229910010413 TiO 2 Inorganic materials 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 229920000620 organic polymer Polymers 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW105124965A TWI599078B (zh) | 2016-08-05 | 2016-08-05 | 具濕氣阻隔結構之晶片級封裝發光裝置 |
| TW105124965 | 2016-08-05 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020174343A Division JP7100383B2 (ja) | 2016-08-05 | 2020-10-16 | 耐湿性チップスケールパッケージ発光素子 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2018056552A JP2018056552A (ja) | 2018-04-05 |
| JP2018056552A5 true JP2018056552A5 (enExample) | 2019-03-28 |
| JP6817167B2 JP6817167B2 (ja) | 2021-01-20 |
Family
ID=60719661
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017151954A Active JP6817167B2 (ja) | 2016-08-05 | 2017-08-04 | 耐湿性チップスケールパッケージ発光素子 |
| JP2020174343A Active JP7100383B2 (ja) | 2016-08-05 | 2020-10-16 | 耐湿性チップスケールパッケージ発光素子 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020174343A Active JP7100383B2 (ja) | 2016-08-05 | 2020-10-16 | 耐湿性チップスケールパッケージ発光素子 |
Country Status (3)
| Country | Link |
|---|---|
| JP (2) | JP6817167B2 (enExample) |
| KR (1) | KR101942042B1 (enExample) |
| TW (1) | TWI599078B (enExample) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11335842B2 (en) | 2018-02-14 | 2022-05-17 | Maven Optronics Co., Ltd. | Chip-scale packaging light-emitting device with electrode polarity identifier and method of manufacturing the same |
| TWI659550B (zh) * | 2018-02-14 | 2019-05-11 | 行家光電股份有限公司 | 具電極辨識之晶片級封裝發光裝置及其製造方法 |
| KR102555238B1 (ko) * | 2018-09-13 | 2023-07-14 | 주식회사 루멘스 | 퀀텀닷 엘이디 패키지 및 이를 포함하는 퀀텀닷 엘이디 모듈 |
| JP7054005B2 (ja) | 2018-09-28 | 2022-04-13 | 日亜化学工業株式会社 | 発光装置 |
| JP6940776B2 (ja) | 2018-11-05 | 2021-09-29 | 日亜化学工業株式会社 | 発光装置及びその製造方法 |
| JP7242894B2 (ja) * | 2019-03-18 | 2023-03-20 | インテマティックス・コーポレーション | 光ルミネセンス層状構造体を備えるパッケージ化された白色発光デバイス |
| CN119208311A (zh) | 2019-03-18 | 2024-12-27 | 英特曼帝克司公司 | Led灯丝 |
| US11781714B2 (en) | 2019-03-18 | 2023-10-10 | Bridgelux, Inc. | LED-filaments and LED-filament lamps |
| KR102140993B1 (ko) * | 2019-04-01 | 2020-08-05 | (주)라이타이저 | 발광다이오드 칩 스케일 패키지 및 그의 제조 방법 |
| KR102766447B1 (ko) * | 2019-04-25 | 2025-02-10 | 어플라이드 머티어리얼스, 인코포레이티드 | 낮은 굴절률 및 낮은 수증기 투과율을 갖는 수분 배리어 막 |
| KR102677646B1 (ko) * | 2019-05-22 | 2024-06-25 | 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 | 발광소자패키지 및 광원장치 |
| JP6864875B2 (ja) | 2019-08-30 | 2021-04-28 | 日亜化学工業株式会社 | 発光モジュール及びその製造方法 |
Family Cites Families (34)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| ATE410792T1 (de) * | 2003-12-02 | 2008-10-15 | Koninkl Philips Electronics Nv | Elektrolumineszenzbauelement |
| US7560820B2 (en) * | 2004-04-15 | 2009-07-14 | Saes Getters S.P.A. | Integrated getter for vacuum or inert gas packaged LEDs |
| JP2007317787A (ja) * | 2006-05-24 | 2007-12-06 | Citizen Electronics Co Ltd | 発光装置およびその製造方法 |
| US8947619B2 (en) * | 2006-07-06 | 2015-02-03 | Intematix Corporation | Photoluminescence color display comprising quantum dots material and a wavelength selective filter that allows passage of excitation radiation and prevents passage of light generated by photoluminescence materials |
| JP2008066462A (ja) | 2006-09-06 | 2008-03-21 | Fujikura Ltd | イルミネーションランプ及びイルミネーションランプユニット |
| JP4892380B2 (ja) * | 2007-03-26 | 2012-03-07 | 出光興産株式会社 | 光半導体用反射材 |
| US7791093B2 (en) * | 2007-09-04 | 2010-09-07 | Koninklijke Philips Electronics N.V. | LED with particles in encapsulant for increased light extraction and non-yellow off-state color |
| JP2009071005A (ja) | 2007-09-13 | 2009-04-02 | Sony Corp | 波長変換部材及びその製造方法、並びに、波長変換部材を用いた発光デバイス |
| CN101878540B (zh) * | 2007-11-29 | 2013-11-06 | 日亚化学工业株式会社 | 发光装置及其制造方法 |
| EP2328994B1 (en) * | 2008-09-16 | 2012-12-26 | Koninklijke Philips Electronics N.V. | Polymeric wavelength converting elements |
| JP2010118560A (ja) * | 2008-11-13 | 2010-05-27 | Sumitomo Metal Electronics Devices Inc | 発光素子搭載用パッケージの製造方法 |
| TWI508331B (zh) * | 2008-11-13 | 2015-11-11 | Maven Optronics Corp | 用於形成螢光轉換型發光元件之薄膜螢光層的系統及方法、以及用於螢光轉換型發光元件之薄膜螢光層 |
| JP5521325B2 (ja) | 2008-12-27 | 2014-06-11 | 日亜化学工業株式会社 | 発光装置及びその製造方法 |
| JPWO2010123059A1 (ja) | 2009-04-22 | 2012-10-25 | シーシーエス株式会社 | Ｌｅｄ発光デバイスの製造方法 |
| JP2011042732A (ja) | 2009-08-20 | 2011-03-03 | Kaneka Corp | Ｌｅｄ封止剤 |
| JP2011243963A (ja) | 2010-04-21 | 2011-12-01 | Mitsubishi Chemicals Corp | 半導体発光装置及び半導体発光装置の製造方法 |
| KR20110136676A (ko) | 2010-06-14 | 2011-12-21 | 삼성엘이디 주식회사 | 양자점을 이용한 발광소자 패키지, 조광 장치 및 디스플레이 장치 |
| JP2012036265A (ja) * | 2010-08-05 | 2012-02-23 | Sharp Corp | 照明装置 |
| WO2012090961A1 (ja) * | 2010-12-28 | 2012-07-05 | コニカミノルタオプト株式会社 | 発光装置、発光装置の製造方法、及び、塗布液 |
| WO2012132236A1 (ja) * | 2011-03-31 | 2012-10-04 | パナソニック株式会社 | 半導体発光素子および発光装置 |
| CN103650183B (zh) * | 2011-06-30 | 2017-02-22 | 松下知识产权经营株式会社 | 发光装置 |
| KR101265094B1 (ko) * | 2011-08-09 | 2013-05-16 | 한국과학기술연구원 | 백색 발광 다이오드 및 그 제조 방법 |
| JP2013172041A (ja) * | 2012-02-22 | 2013-09-02 | Sharp Corp | 発光装置 |
| JP2015516691A (ja) | 2012-05-14 | 2015-06-11 | コーニンクレッカ フィリップス エヌ ヴェ | ナノ構造蛍光体を有する発光装置 |
| JP6272638B2 (ja) | 2012-07-27 | 2018-01-31 | 株式会社カネカ | 光半導体装置 |
| JP2014216622A (ja) * | 2013-04-30 | 2014-11-17 | 日亜化学工業株式会社 | 発光装置の製造方法 |
| US9484504B2 (en) * | 2013-05-14 | 2016-11-01 | Apple Inc. | Micro LED with wavelength conversion layer |
| CN105874617A (zh) * | 2014-01-07 | 2016-08-17 | 皇家飞利浦有限公司 | 具有磷光体转换器的无胶发光器件 |
| US9660151B2 (en) * | 2014-05-21 | 2017-05-23 | Nichia Corporation | Method for manufacturing light emitting device |
| JP6303805B2 (ja) | 2014-05-21 | 2018-04-04 | 日亜化学工業株式会社 | 発光装置及びその製造方法 |
| JP6582382B2 (ja) | 2014-09-26 | 2019-10-02 | 日亜化学工業株式会社 | 発光装置の製造方法 |
| TWI543394B (zh) * | 2014-12-05 | 2016-07-21 | Electroluminescence and Photoluminescence Multiband White Light Emitting Diodes | |
| KR102353095B1 (ko) * | 2014-12-26 | 2022-01-19 | 엔에스 마테리얼스 아이엔씨. | 파장 변환 부재 및 그 제조 방법 |
| US9620686B2 (en) | 2015-01-28 | 2017-04-11 | Apple Inc. | Display light sources with quantum dots |
-
2016
- 2016-08-05 TW TW105124965A patent/TWI599078B/zh active
-
2017
- 2017-08-01 KR KR1020170097665A patent/KR101942042B1/ko active Active
- 2017-08-04 JP JP2017151954A patent/JP6817167B2/ja active Active
-
2020
- 2020-10-16 JP JP2020174343A patent/JP7100383B2/ja active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2018056552A5 (enExample) | ||
| TWI418064B (zh) | 發光裝置 | |
| CN107706281B (zh) | 具湿气阻隔结构的晶片级封装发光装置 | |
| CN108198953B (zh) | Oled封装方法与oled封装结构 | |
| JP7100383B2 (ja) | 耐湿性チップスケールパッケージ発光素子 | |
| TWI334660B (en) | Surface mount type light emitting diode package device and light emitting element package device | |
| CN102751422B (zh) | 发光器件封装和具有发光器件封装的照明装置 | |
| JP5153950B1 (ja) | 発光ダイオード | |
| JP5706972B2 (ja) | 面状発光素子 | |
| JP2012089864A5 (enExample) | ||
| JP2008041917A5 (enExample) | ||
| WO2015188486A1 (zh) | 有机发光器件及其制备方法和有机发光显示装置 | |
| KR100826426B1 (ko) | 발광다이오드 패키지 | |
| US20240397748A1 (en) | Organic optoelectronic component | |
| TW201943103A (zh) | 發光裝置及其製造方法 | |
| TW201719935A (zh) | 發光二極體封裝裝置 | |
| CN105814701A (zh) | 光半导体装置及其制造方法以及银用表面处理剂及发光装置 | |
| TWI597865B (zh) | Optical semiconductor device | |
| CN108428804A (zh) | Oled显示面板及其封装方法 | |
| TWI343134B (enExample) | ||
| JP6308020B2 (ja) | 光半導体装置及びその製造方法 | |
| KR100674854B1 (ko) | 광추출 효율이 개선된 ｌｅｄ 패키지 및 그 제조방법 | |
| JP6269007B2 (ja) | 光半導体装置 | |
| JPWO2017217549A1 (ja) | 発光装置 | |
| TWM422765U (en) | Light emitting diode package structure |