JP2018056552A5 - - Google Patents

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Publication number
JP2018056552A5
JP2018056552A5 JP2017151954A JP2017151954A JP2018056552A5 JP 2018056552 A5 JP2018056552 A5 JP 2018056552A5 JP 2017151954 A JP2017151954 A JP 2017151954A JP 2017151954 A JP2017151954 A JP 2017151954A JP 2018056552 A5 JP2018056552 A5 JP 2018056552A5
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JP
Japan
Prior art keywords
photoluminescent
light emitting
layer
emitting device
photoluminescence
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JP2017151954A
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English (en)
Japanese (ja)
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JP2018056552A (ja
JP6817167B2 (ja
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Priority claimed from TW105124965A external-priority patent/TWI599078B/zh
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Publication of JP2018056552A publication Critical patent/JP2018056552A/ja
Publication of JP2018056552A5 publication Critical patent/JP2018056552A5/ja
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Publication of JP6817167B2 publication Critical patent/JP6817167B2/ja
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JP2017151954A 2016-08-05 2017-08-04 耐湿性チップスケールパッケージ発光素子 Active JP6817167B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW105124965A TWI599078B (zh) 2016-08-05 2016-08-05 具濕氣阻隔結構之晶片級封裝發光裝置
TW105124965 2016-08-05

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2020174343A Division JP7100383B2 (ja) 2016-08-05 2020-10-16 耐湿性チップスケールパッケージ発光素子

Publications (3)

Publication Number Publication Date
JP2018056552A JP2018056552A (ja) 2018-04-05
JP2018056552A5 true JP2018056552A5 (enExample) 2019-03-28
JP6817167B2 JP6817167B2 (ja) 2021-01-20

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ID=60719661

Family Applications (2)

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JP2017151954A Active JP6817167B2 (ja) 2016-08-05 2017-08-04 耐湿性チップスケールパッケージ発光素子
JP2020174343A Active JP7100383B2 (ja) 2016-08-05 2020-10-16 耐湿性チップスケールパッケージ発光素子

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JP2020174343A Active JP7100383B2 (ja) 2016-08-05 2020-10-16 耐湿性チップスケールパッケージ発光素子

Country Status (3)

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JP (2) JP6817167B2 (enExample)
KR (1) KR101942042B1 (enExample)
TW (1) TWI599078B (enExample)

Families Citing this family (12)

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TWI659550B (zh) * 2018-02-14 2019-05-11 行家光電股份有限公司 具電極辨識之晶片級封裝發光裝置及其製造方法
US11335842B2 (en) 2018-02-14 2022-05-17 Maven Optronics Co., Ltd. Chip-scale packaging light-emitting device with electrode polarity identifier and method of manufacturing the same
KR102555238B1 (ko) * 2018-09-13 2023-07-14 주식회사 루멘스 퀀텀닷 엘이디 패키지 및 이를 포함하는 퀀텀닷 엘이디 모듈
JP7054005B2 (ja) 2018-09-28 2022-04-13 日亜化学工業株式会社 発光装置
JP6940776B2 (ja) 2018-11-05 2021-09-29 日亜化学工業株式会社 発光装置及びその製造方法
US11781714B2 (en) 2019-03-18 2023-10-10 Bridgelux, Inc. LED-filaments and LED-filament lamps
WO2020190914A1 (en) * 2019-03-18 2020-09-24 Intematix Corporation Packaged white light emitting device comprising photoluminescence layered structure
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KR102140993B1 (ko) * 2019-04-01 2020-08-05 (주)라이타이저 발광다이오드 칩 스케일 패키지 및 그의 제조 방법
WO2020219087A1 (en) * 2019-04-25 2020-10-29 Applied Materials, Inc. Moisture barrier film having low refraction index and low water vapor tramission rate
KR102677646B1 (ko) * 2019-05-22 2024-06-25 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 발광소자패키지 및 광원장치
JP6864875B2 (ja) 2019-08-30 2021-04-28 日亜化学工業株式会社 発光モジュール及びその製造方法

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JP2013172041A (ja) * 2012-02-22 2013-09-02 Sharp Corp 発光装置
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JP2014216622A (ja) * 2013-04-30 2014-11-17 日亜化学工業株式会社 発光装置の製造方法
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JP6582382B2 (ja) * 2014-09-26 2019-10-02 日亜化学工業株式会社 発光装置の製造方法
TWI543394B (zh) * 2014-12-05 2016-07-21 聯勝光電股份有限公司 Electroluminescence and Photoluminescence Multiband White Light Emitting Diodes
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