JP2018022758A - Light-emitting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a light-emitting device in which a light reflector is firmly in close contact with a substrate.SOLUTION: A light-emitting device 10 comprises: a substrate 12; a light-emitting element 14; a light reflector 16; a reinforcement material 18; and a sealant 20. The substrate 12 includes: a peripheral edge 12a; and a center portion 12b located inside the peripheral edge 12a. At least a part of the peripheral edge 12a has an upper face lower than an upper face of the center portion 12b. The light-emitting element 14 is provided over the center portion 12b. The light reflector 16 is provided on the part of the peripheral edge 12a lower than the center portion 12b. The reinforcement material 18 is provided so as to be in contact with an inner wall 16a of the light reflector 16, and the upper face of the center portion 12b. The sealant 20 covers the light-emitting element 14 and the reinforcement material 18 inside the light reflector 16. An adhesive force of the reinforcement material 18 to an upper face of the substrate 12 is larger than an adhesive force of the sealant 20 to the upper face of the substrate 12.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a thin light emitting device and a manufacturing method thereof.

  In recent years, LEDs are often used as in-vehicle lighting as well as room lighting and signs. It is no exaggeration to say that surpassing conventional fluorescent lamps in terms of performance such as brightness and power consumption, lifespan, price, and design. When an LED is pursued to increase its brightness, it becomes a package on which a high-watt LED element is mounted. Therefore, it is necessary to efficiently release heat generated from the LED element.

  As a substrate for LED having a heat dissipation structure, a copper inlay substrate 74 in which a columnar copper pin 72 is embedded in a base material 70 on which an LED element is mounted as shown in FIG. 7, or a thick copper as shown in FIG. A copper post substrate 82 including a copper post 80 obtained by processing the substrate into a cylindrical shape by etching is used. However, downsizing of LEDs has been a challenge by using a substrate having such a heat dissipation structure. In addition, LEDs are becoming thinner in parallel with downsizing. In an LED including a conventional light reflecting material in which a resin molded product is attached to a substrate, there is a limit to downsizing and thinning. For this reason, there has been an urgent need to increase the definition of the LED substrate and the light reflecting material.

  Therefore, a light emitting device 90 as shown in FIG. 9 has been developed. In the light emitting device 90, an LED element 94 that is a light emitting element is mounted on a collective substrate 92, and the LED element 94 is covered with a sealing material 96, and then the upper portion of the collective substrate 92 and a predetermined portion of the sealing material 96. A cut is made by dicing with a predetermined width (so-called “half dicing”), and the light reflecting material 98 is filled in the cut (Patent Document 1). With the method for manufacturing the light emitting device 90, the width and height of the light reflecting material 98 can be increased. However, in this method of manufacturing the light emitting device 90, the groove is dug to about half the depth of the collective substrate 92 by dicing, and therefore the thickness of the collective substrate 92 needs to be 0.4 mm or more.

  At present, when it is desired to reduce the thickness of the LED, the thickness of the collective substrate needs to be 0.2 mm or less. When half dicing is applied to the laminated part of the sealing material and the aggregate substrate with a thickness of 0.2 mm or less, the dicing blade scans the vicinity of the boundary between the sealing material and the aggregate substrate, and the sealing material peels off from the aggregate substrate There is. In this case, even if the light reflecting material is filled in the cut formed by half dicing, it is difficult to obtain strong adhesion between the light reflecting material and the collective substrate. There is an urgent need to improve the adhesion strength between the light reflecting material and the thin aggregate substrate.

JP 2002-368281 A

  The present invention has been made in view of such circumstances, and an object of the present invention is to provide a light emitting device in which a substrate and a light reflecting material are in close contact with each other, and a manufacturing method thereof.

  The light-emitting device of the present invention includes a peripheral portion and a central portion inside the peripheral portion, a substrate in which at least a part of the upper surface of the peripheral portion is lower than the upper surface of the central portion, and a light-emitting element provided on the central portion A light reflecting material provided on the peripheral edge lower than the central portion, a reinforcing material provided in contact with the inner wall of the light reflecting material and the upper surface of the central portion, and the light emitting element and the reinforcement inside the light reflecting material And the adhesive force of the reinforcing material to the upper surface of the substrate is larger than the adhesive force of the sealing material to the upper surface of the substrate.

  In the light emitting device of the present invention, the thickness of the central portion may be 0.1 mm or less. In the light emitting device of the present invention, the reinforcing material may reflect 90% or more of light having a wavelength of 970 nm. In the light emitting device of the present invention, the reinforcing material may have translucency. In the light emitting device of the present invention, the reinforcing material may be composed of a plurality of reinforcing members whose widths become narrower as they are separated from the substrate.

  The method for manufacturing a light emitting device according to the present invention includes a reinforcing material forming step of forming at least parallel rows of reinforcing materials between a plurality of light emitting elements mounted in a grid pattern on a collective substrate, and a plurality of light emitting elements and a reinforcement. A plurality of rectangular parallelepiped-shaped grooves having a width smaller than the minimum width of the reinforcing material, at least along the central portion of the reinforcing material formed in parallel with the sealing step of covering the row of materials with the sealing material. A groove forming step formed over the upper portion, the reinforcing material, and the sealing material, a light reflecting material forming step in which the light reflecting material is filled in the plurality of grooves, A separation step for separating the light emitting device, wherein the adhesive strength of the reinforcing material to the upper surface of the collective substrate is greater than the adhesive strength of the sealing material to the upper surface of the collective substrate, and the separation step is smaller than the width of the light reflecting material. With, cut between the light emitting elements along the central part of the light reflecting material It contains that process.

  In the light emitting device manufacturing method of the present invention, in the reinforcing material forming step, a row of reinforcing materials is formed in a lattice shape between the plurality of light emitting elements, and in the groove forming step, the center of the reinforcing material formed in the lattice shape is formed. A plurality of grooves may be formed along the portion. In the method for manufacturing a light emitting device of the present invention, the reinforcing material includes a laminated portion of the first reinforcing member and a second reinforcing member having a maximum width smaller than the minimum width of the first reinforcing member, and the reinforcing material forming step includes: A process of forming the first reinforcing member and then forming the second reinforcing member on the first reinforcing member may be included.

  In the method for manufacturing the light emitting device of the present invention, the aggregate substrate may have a thickness of 0.1 mm or less and the reinforcing material may have a height of 0.1 mm or more. In the method for manufacturing a light emitting device of the present invention, the thickness of the collective substrate is 0.1 mm or less, the reinforcing material is a resin plate having a thickness of 0.1 mm or more, and the reinforcing material is formed on the collective substrate by an adhesive. A resin plate may be attached.

  In the light emitting device of the present invention, since the reinforcing material having a large adhesive force to the substrate is provided so as to be in contact with the inner wall of the light reflecting material and the upper surface of the substrate, the substrate and the light reflecting material are strongly adhered. Moreover, according to the manufacturing method of the light-emitting device of this invention, the light-emitting device of this invention can be produced simply.

The cross-sectional schematic diagram of the light-emitting device of embodiment of this invention. The cross-sectional schematic diagram for demonstrating the front | former stage of the manufacturing method of the light-emitting device of 1st embodiment of this invention. The cross-sectional schematic diagram for demonstrating the back | latter stage of the manufacturing method of the light-emitting device of 1st embodiment of this invention. The cross-sectional schematic diagram for demonstrating the front | former stage of the manufacturing method of the light-emitting device of 2nd embodiment of this invention. The cross-sectional schematic diagram for demonstrating the back | latter stage of the manufacturing method of the light-emitting device of 2nd embodiment of this invention. Sectional schematic diagram for demonstrating the back | latter stage of the manufacturing method of the light-emitting device of 2nd embodiment of this invention. The cross-sectional schematic diagram of the copper inlay board | substrate for light-emitting devices. The cross-sectional schematic diagram of the copper post board | substrate for light-emitting devices. The cross-sectional schematic diagram of the conventional light-emitting device. The cross-sectional schematic diagram for demonstrating a problem when the conventional half dicing is applied to manufacture of a light-emitting device provided with a thin board | substrate.

  Hereinafter, a light-emitting device and a method for manufacturing the same according to the present invention will be described based on embodiments with reference to the drawings. The drawings schematically show the light-emitting device, the members constituting the light-emitting device, and the peripheral members of the light-emitting device, and the actual dimensions and size ratios thereof are not necessarily the same as the dimensions and dimension ratios on the drawings. Does not match. Further, unless otherwise specified, in this specification, for the sake of convenience, directions such as “up” and “down” are represented with reference to the direction of the light-emitting device shown in FIG. Duplicate description will be omitted as appropriate, and the same reference numerals may be given to the same members.

(Light emitting device)
FIG. 1 shows a cross section of a light emitting device 10 according to an embodiment of the present invention. The light emitting device 10 includes a substrate 12, a light emitting element 14, a light reflecting material 16, a reinforcing material 18, and a sealing material 20. The substrate 12 is a rectangular plate member. Squares are also included in rectangles. The substrate 12 is an insulating member provided with various conductor members on its upper and lower surfaces, and is made of glass epoxy resin, ceramics, glass, or the like. In this embodiment, the laser via / filled plating 22 is formed on the substrate 12. Circuit boards 24, 26, 28 and 30 are provided on the upper and lower surfaces of the laser via / filled plating 22. In the light emitting device of the present invention, the shape, structure, material, and the like of the substrate are not particularly limited.

  The board | substrate 12 is comprised from the peripheral part 12a and the part other than the peripheral part 12a, ie, the center part 12b inside the peripheral part 12a. The upper surface of at least a part of the peripheral edge portion 12a is lower than the upper surface of the central portion 12b. In the present embodiment, the entire upper surface of the peripheral edge portion 12a is lower than the upper surface of the central portion 12b. And the thickness of a center part is 0.1 mm or less. The light emitting element 14 is provided on the central portion 12b via the circuit board 26. Further, the upper electrode of the light emitting element 14 is electrically connected to the circuit board 24 by a wire 32.

The light reflecting material 16 is made of, for example, a light reflecting resin obtained by adding a light reflecting material such as TiO ₂ or ZrO ₂ to a base resin such as a silicone resin or a phenol resin. The light reflecting material 16 is provided on the lower part of the peripheral part 12a than the central part 12b. In this embodiment, since all the upper surfaces of the peripheral part 12a are lower than the upper surface of the center part 12b, the light reflection material 16 is provided on the whole peripheral part 12a.

  Note that the light reflecting material 16 may be provided only on the peripheral edge portion 12 a of the pair of opposite sides of the substrate 12. When such light emitting devices are arranged in the horizontal direction as light sources and mounted on a thin light guide plate on the side, light leakage in the vertical direction of the light emitting device can be suppressed by the light reflecting material 16 in a state where the light is mounted on the side. On the other hand, since the light reflecting material 16 is not in the lateral direction, light is emitted from the front surface of the light emitting device while the light is diffused in the lateral direction. For this reason, it is possible to suppress the amount of light incident on the light guide plate from being reduced even at a point between the two light emitting devices.

  The reinforcing material 18 is provided in contact with the inner wall 16a of the light reflecting material 16 and the upper surface of the central portion 12b. Note that “the reinforcing material is in contact with the upper surface of the central portion” includes that the reinforcing material is bonded to the upper surface of the central portion via an adhesive. The sealing material 20 covers the light emitting element 14 and the reinforcing material 18 inside the light reflecting material 16. The sealing material 20 is for protecting the light emitting element 14 and the wire 32 from dust, moisture, external force, and the like, and is made of, for example, a light transmissive resin such as a silicone resin or an epoxy resin.

  Further, the adhesive force of the reinforcing material 18 to the upper surface of the substrate 12 is larger than the adhesive force of the sealing material 20 to the upper surface of the substrate 12. When the reinforcing material 18 is bonded to the upper surface of the central portion 12b via an adhesive, the adhesive force of the reinforcing material 18 to the upper surface of the substrate 12 is sealed to the upper surface of the substrate 12 in the presence of the adhesive. It is larger than the adhesive strength of the stopper 20. Here, the magnitude of the adhesive strength is determined by tests such as Japanese Industrial Standards (JIS) tensile adhesive strength (JIS K 6849), tensile shear adhesive strength (JIS K 6850), and peel adhesive strength (JIS K 6854). Can be measured by. Since the adhesive force of the reinforcing material 18 to the upper surface of the substrate 12 is larger than the adhesive force of the sealing material 20 to the upper surface of the substrate 12, the reinforcing material 18 is attached to the substrate 12 in the step of providing the light reflecting material 16 on the thin substrate 12 by half dicing. Hard to peel off. As a result, the light reflecting material 16 is in close contact with the substrate 12 and the reinforcing material 18.

  In the present embodiment, the reinforcing member 18 includes a laminated portion of the first reinforcing member 18a and the second reinforcing member 18b. The width of the second reinforcing member 18b is smaller than the width of the first reinforcing member 18a. Thus, since the maximum width of the second reinforcing member 18b is smaller than the minimum width of the first reinforcing member 18a, the light emitted from the light emitting element 14 diffuses upward and is emitted from the opening on the upper surface of the light emitting device 10. This is unlikely to be hindered by the reinforcing material 18. Even when the reinforcing member 18 is composed of three or more reinforcing members whose widths become narrower as the distance from the substrate 12 increases, the light emitted from the light emitting element 14 is not easily blocked by the reinforcing member 18.

  Examples of the material of the reinforcing material 18 include a photoresist material and the same resin as the material of the substrate 12. If the reinforcing material 18 is made of a material that reflects 90% or more of light having a wavelength of 970 nm, the reinforcing material 18 can be used as a light reflecting material, so that the emitted light from the upper surface of the light emitting device 10 can be increased. Further, if the reinforcing material 18 is made of a translucent material, the light emitted from the light emitting element 14 is transmitted through the reinforcing material 18 and reflected by the light reflecting material 10, and from the upper surface of the light emitting device 10. Emitted.

(Light-emitting device manufacturing method 1)
2 and 3 are cross-sectional views for explaining a method for manufacturing the light emitting device 10. The manufacturing method of the light emitting device 10 includes a reinforcing material forming process, an element mounting process, a sealing process, a groove forming process, a light reflecting material forming process, and a separating process. In the reinforcing material forming step, as shown in FIG. 2A, a row of reinforcing materials 18 is formed in a lattice shape between the plurality of light emitting elements 14 mounted on the collective substrate 40 in a lattice shape. The reinforcing member 18 includes a laminated portion of a first reinforcing member 18a and a second reinforcing member 18b having a maximum width smaller than the minimum width of the first reinforcing member 18a. The collective substrate 40 is a double-sided board having a thickness of 0.1 mm, and includes a heat dissipation mechanism having an IVH structure using laser vias. The IVH structure is filled with copper plating by filled plating. The aggregate substrate 40 may have a copper post substrate structure.

  The reinforcing material forming step includes a process of forming the first reinforcing member 18a and then forming the second reinforcing member 18b on the first reinforcing member 18a. The row of the first reinforcing members 18a is, for example, coated with a solder resist (eg, PSR-4000LEW-1 made by Taiyo Ink) on the aggregate substrate 40 by screen printing, and semi-cured by heat treatment at 150 ° C. for 15 minutes. Thereafter, the resist can be covered with a predetermined positive film, and ultraviolet exposure and alkali development can be performed. If this is performed once again, the second reinforcing member 18b can be formed on the first reinforcing member 18a. At this time, the width of the second reinforcing member 18b is made smaller than the width of the first reinforcing member 18a to form, for example, a stair-like reinforcing material 18 having a height of about 0.1 mm.

  Further, this may be repeated to form a stair-shaped reinforcing material 18 having three or more steps. Finally, the reinforcing members 18a and 18b are completely cured by heat treatment at 150 ° C. for 60 minutes. A dry film type solder resist may be used as the material of the reinforcing material 18. Alternatively, the reinforcing material 18 may be formed from a liquid solder resist transparent ink so that the light emitted from the light emitting element 14 is transmitted through the reinforcing material 18 and reflected by the light reflecting material 16. In this embodiment, the rows of the reinforcing members 18 are formed in a lattice shape. However, the rows of the reinforcing members 18 are formed in parallel, and the reinforcing members 18 are disposed on the opposite sides of the pair of the substrates 12 of the light emitting device 10. It may be provided.

  In the element mounting step, as shown in FIG. 2B, after fixing the light emitting element 14 on the circuit board 26 using a die bond paste, the upper surface electrode of the light emitting element 14 and the circuit board 24 are electrically connected by the wire 32. Connect. In the sealing step, as shown in FIG. 2C, the row of the plurality of light emitting elements 14 and the reinforcing material 18 is covered with the sealing material 20. Specifically, the light emitting element 14 and the reinforcing material 18 are covered with a mold resin, and the mold resin is cured by a heat treatment at 160 ° C. for 3 hours. In the groove forming step, as shown in FIG. 3D, a plurality of rectangular parallelepiped grooves 42 having a width smaller than the minimum width of the reinforcing material 18 are formed along the central portion of the row of the reinforcing material 18 by half dicing. And formed over the upper portion of the collective substrate 40, the reinforcing material 18, and the sealing material 20. At this time, the depth of the cut formed in the collective substrate 40 is 0.05 mm or less.

  In the light reflecting material forming step, the light reflecting material 16 is filled into the plurality of grooves 42 as shown in FIG. In the separation step, as shown in FIG. 3F, the plurality of light emitting elements 14 are cut and separated into individual light emitting devices 10. The separation step includes a process of cutting between the plurality of light emitting elements 14 along the central portion of the plurality of light reflecting materials 16 with a width smaller than the width of the light reflecting material 16. At this time, for example, a dicing blade having a width of 0.05 mm can be used. As described above, the method for manufacturing the light emitting device 10 of the present embodiment is particularly suitable when the thin aggregate substrate 40 having a thickness of 0.1 mm or less is used. At this time, if the height of the reinforcing material 18, that is, the total height of the first reinforcing member 18 a and the second reinforcing member 18 b is 0.1 mm or more, the light reflecting material 16 adheres to the substrate 12.

(Light emitting device manufacturing method 2)
4 to 6 are cross-sectional views for explaining a method for manufacturing the light emitting device 50. In the light emitting device 50, instead of the reinforcing material 18 of the light emitting device 10, a reinforcing material 58 that is a resin plate-like member is attached to the substrate 12 with an adhesive 60. Further, the adhesive force of the reinforcing material 58 to the upper surface of the substrate 12 is larger than the adhesive force of the sealing material 20 to the upper surface of the substrate 12. The members constituting the light emitting device 50 are the same as those of the light emitting device 10 except that the reinforcing material 58 and the adhesive 60 are used.

  The reinforcing material forming step of the manufacturing method of the light emitting device 50 is different from the reinforcing material forming step of the manufacturing method of the light emitting device 10. However, the remaining steps of the manufacturing method of the light emitting device 50 are the same as the remaining steps of the manufacturing method of the light emitting device 10. In the reinforcing material forming step, as shown in FIGS. 4A and 4B, a reinforcing material is used by using an adhesive 60 between the plurality of light emitting elements 14 mounted in a lattice pattern on the collective substrate 40. Adhere 58 rows in a grid. At this time, the length of the reinforcing material 58 is adjusted in advance so that the reinforcing material 58 does not overlap at the lattice points.

  As the reinforcing material 58, for example, a resin plate obtained by removing a copper foil portion of a substrate having a thickness of 0.1 mm by etching can be used. The resin plate is preferably made from a heat-resistant transparent resin. A resin plate may be produced by pressing with a mold. The adhesive 60 may be provided in advance on one side of the resin plate, or the adhesive 60 may be printed on the collective substrate 40 by screen printing.

  In the element mounting step, as shown in FIG. 4C, the light emitting element 14 is installed on the circuit board 26, and the upper surface electrode of the light emitting element 14 and the circuit board 24 are electrically connected by the wire 32. In the sealing step, as shown in FIG. 5D, the row of the plurality of light emitting elements 14 and the reinforcing material 58 is covered with the sealing material. In the groove forming step, as shown in FIG. 5 (e), a plurality of rectangular parallelepiped grooves 42 having a width smaller than the minimum width of the reinforcing material 58 are formed along the central portion of the row of the reinforcing material 58 by half dicing. The upper portion of the collective substrate 40, the reinforcing material 58, and the sealing material 20 are formed.

  In the light reflecting material forming step, the light reflecting material 16 is filled into the plurality of grooves 42 as shown in FIG. In the separation step, as shown in FIG. 6G, the plurality of light emitting elements 14 are cut and separated into individual light emitting devices 50. The manufacturing method of the light emitting device 50 of the present embodiment is particularly suitable when the thin aggregate substrate 40 having a thickness of 0.1 mm or less is used. At this time, if the thickness of the reinforcing material 18 is 0.1 mm or more, the light reflecting material 16 adheres to the substrate 12.

  FIG. 9 shows a light emitting device 90 manufactured by a conventional method of forming a light reflecting material 98. The thickness of the collective substrate 92 is 0.4 mm or more. Even if the light emitting element 94 is covered with the sealing material 96 and then cut into half the depth of the collective substrate 92 by half dicing, the thickness of the collective substrate 92 is 0.4 mm or more. The light reflecting material 98 is sufficiently strong because it is in close contact with the collective substrate 92 and the sealing material 96.

  However, as shown in FIG. 10, when the thickness of the substrate 102 is as thin as 0.1 mm, the encapsulant 104 is peeled off from the substrate 102 when cutting is performed by half dicing to about half the depth of the substrate 102. Therefore, it is difficult to ensure the adhesion strength of the light reflecting material 106. Therefore, for the purpose of improving the adhesion strength of the light reflecting material 106, a reinforcing material 18 as shown in FIG. 1 is provided. By providing the reinforcing material 18, half dicing can be performed on the thin substrate 102, and the adhesion strength between the light reflecting material 106 and the substrate 102 is improved.

10, 50, 90, 100 Light emitting device 12 Substrate 12a Peripheral part 12b Center part 14 Light emitting element 16 Light reflecting material 16a Inner wall 18 Reinforcing material 20 Sealing material 22 Laser via filled plating 24, 26, 28, 30 Circuit board 32 Wire 40 collective substrate 42 groove 58 reinforcing material 60 adhesive 70 substrate 72 copper pin 74 copper inlay substrate 80 copper post 82 copper post substrate 92 collective substrate 94 LED element 96 sealing material 98 light reflecting material 102 substrate 104 sealing material 106 light reflecting Material

Claims (10)

A substrate including a peripheral portion and a central portion inside the peripheral portion, wherein the upper surface of at least a part of the peripheral portion is lower than the upper surface of the central portion;
A light emitting device provided on the central portion;
A light reflecting material provided on the peripheral edge lower than the center;
A reinforcing material provided so as to be in contact with the inner wall of the light reflecting material and the upper surface of the central portion;
A sealing material that covers the light emitting element and the reinforcing material inside the light reflecting material;
A light emitting device comprising:
The light emitting device, wherein an adhesive force of the reinforcing material to the upper surface of the substrate is larger than an adhesive force of the sealing material to the upper surface of the substrate. In claim 1,
A light emitting device having a thickness of the central portion of 0.1 mm or less. In claim 1 or 2,
A light emitting device in which the reinforcing material reflects 90% or more of light having a wavelength of 970 nm. In claim 1 or 2,
A light emitting device in which the reinforcing material has translucency. In any one of Claim 1-4,
The light emitting device, wherein the reinforcing material is composed of a plurality of reinforcing members whose widths become narrower as they move away from the substrate. A reinforcing material forming step of forming at least parallel rows of reinforcing materials between the plurality of light emitting elements mounted in a grid pattern on the aggregate substrate;
A sealing step of covering the row of the plurality of light emitting elements and the reinforcing material with a sealing material;
A plurality of rectangular parallelepiped-shaped grooves having a width smaller than the minimum width of the reinforcing material, at least along the central portion of the reinforcing material formed in parallel, the upper portion of the collective substrate, the reinforcing material, and the sealing material A groove forming step to be formed over,
A light reflecting material forming step of filling the light reflecting material in the plurality of grooves;
A separation step of cutting between the plurality of light emitting elements and separating them into individual light emitting devices;
A method of manufacturing a light emitting device having
The adhesive force of the reinforcing material to the upper surface of the collective substrate is greater than the adhesive force of the sealing material to the upper surface of the collective substrate,
The method of manufacturing a light emitting device, wherein the separating step includes a step of cutting between the plurality of light emitting elements along a central portion of the plurality of light reflecting materials with a width smaller than a width of the light reflecting material. In claim 6,
In the reinforcing material forming step, a row of the reinforcing material is formed in a lattice shape between the plurality of light emitting elements,
In the groove forming step, a method of manufacturing a light emitting device, wherein the plurality of grooves are formed along a central portion of the reinforcing material formed in the lattice shape. In claim 6 or 7,
The reinforcing member comprises a laminated portion of a first reinforcing member and a second reinforcing member having a maximum width smaller than the minimum width of the first reinforcing member,
The manufacturing method of the light-emitting device including the process in which the said reinforcement material formation process forms the said 1st reinforcement member, and forms the said 2nd reinforcement member on the said 1st reinforcement member after that. In claim 8,
A method for manufacturing a light emitting device, wherein the aggregate substrate has a thickness of 0.1 mm or less and the reinforcing material has a height of 0.1 mm or more. In claim 6 or 7,
The aggregate substrate has a thickness of 0.1 mm or less,
The reinforcing material is a resin plate having a thickness of 0.1 mm or more;
In the reinforcing material forming step, a method for manufacturing a light emitting device, wherein the resin plate is attached to the aggregate substrate with an adhesive.

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