JP2018011008A - 電子装置用保護カバー - Google Patents
電子装置用保護カバー Download PDFInfo
- Publication number
- JP2018011008A JP2018011008A JP2016140073A JP2016140073A JP2018011008A JP 2018011008 A JP2018011008 A JP 2018011008A JP 2016140073 A JP2016140073 A JP 2016140073A JP 2016140073 A JP2016140073 A JP 2016140073A JP 2018011008 A JP2018011008 A JP 2018011008A
- Authority
- JP
- Japan
- Prior art keywords
- electronic device
- protective cover
- housing
- case
- casing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000001681 protective effect Effects 0.000 claims description 73
- 230000017525 heat dissipation Effects 0.000 claims description 9
- 238000003780 insertion Methods 0.000 claims description 9
- 230000037431 insertion Effects 0.000 claims description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 19
- 239000000428 dust Substances 0.000 abstract description 15
- 230000005855 radiation Effects 0.000 abstract description 8
- 230000002542 deteriorative effect Effects 0.000 abstract description 2
- 230000000694 effects Effects 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 210000000078 claw Anatomy 0.000 description 4
- 238000001816 cooling Methods 0.000 description 4
- 238000007789 sealing Methods 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000006196 drop Substances 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 230000032683 aging Effects 0.000 description 1
- 230000000593 degrading effect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 239000012260 resinous material Substances 0.000 description 1
- 230000029058 respiratory gaseous exchange Effects 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
- 238000004078 waterproofing Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/03—Covers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0004—Casings, cabinets or drawers for electric apparatus comprising several parts forming a closed casing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20127—Natural convection
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Casings For Electric Apparatus (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
電子装置を保護する保護カバーにおいて、該電子装置の放熱性能を低下させることなく、防水性及び防塵性を向上する保護カバーを提供する。
【解決手段】
複数の部材が接続されて構成される筐体(301a、301b、215)と、前記筐体の内部空間に収容された回路基板とを備えた電子装置に装着される保護カバー(101)であって、前記保護カバーは、前記筐体の前記複数の部材同士の接続部の少なくとも一部を覆うと共に、前記筐体の表面の少なくとも一部を露出する開口部102a、102bを備える。
【選択図】図1
Description
本発明の他の態様によると、前記開口部の位置は、前記電子装置の放熱部の位置と対応している。
本発明の他の態様によると、前記保護カバーは、前記放熱部に風を導く導風板を備える。
本発明の他の態様によると、前記保護カバーは、前記電子装置を挿入する挿入口を備える箱状体と、該挿入口を覆う蓋とを含む。
本発明の他の態様によると、前記保護カバーは、板状体である。
本発明の他の態様によると、ベントプラグと該筐体との接続部が含まれる。
本発明の他の態様は、前記保護カバーと、前記電子装置と、で構成される電子装置アセンブリである。
Claims (7)
- 複数の部材が接続されて構成される筐体を備えた電子装置に装着される保護カバーであって、
前記保護カバーは、前記筐体の前記複数の部材同士の接続部の少なくとも一部を覆うと共に、前記筐体の表面の少なくとも一部を露出する開口部を備える、
保護カバー。 - 前記開口部の位置は、前記電子装置の放熱部の位置と対応している、
請求項1に記載の保護カバー。 - 前記保護カバーは、前記放熱部に風を導く導風板を備える、
請求項2に記載の保護カバー。 - 前記保護カバーは、前記電子装置を挿入する挿入口を備える箱状体と、該挿入口を覆う蓋とを含む、
請求項1ないし3のいずれか一項に記載の保護カバー。 - 前記保護カバーは、板状体である、
請求項1ないし3のいずれか一項に記載の保護カバー。 - 前記接続部には、ベントプラグと該筐体との接続部が含まれる、
請求項1ないし5のいずれか一項に記載の保護カバー。 - 請求項1ないし6のいずれか一項に記載された保護カバーと、前記電子装置と、で構成される電子装置アセンブリ。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016140073A JP6389211B2 (ja) | 2016-07-15 | 2016-07-15 | 電子装置用保護カバー |
US15/623,383 US10149397B2 (en) | 2016-07-15 | 2017-06-15 | Protecting cover and electronic device assembly |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016140073A JP6389211B2 (ja) | 2016-07-15 | 2016-07-15 | 電子装置用保護カバー |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2018011008A true JP2018011008A (ja) | 2018-01-18 |
JP6389211B2 JP6389211B2 (ja) | 2018-09-12 |
Family
ID=60941579
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016140073A Expired - Fee Related JP6389211B2 (ja) | 2016-07-15 | 2016-07-15 | 電子装置用保護カバー |
Country Status (2)
Country | Link |
---|---|
US (1) | US10149397B2 (ja) |
JP (1) | JP6389211B2 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112954942A (zh) * | 2021-04-23 | 2021-06-11 | 大连交通大学 | 一种用于计算机自动化系统的易装卸防尘装置及方法 |
KR102625397B1 (ko) * | 2022-10-17 | 2024-01-17 | (주)인텔리안테크놀로지스 | 결로 및 결빙 방지 레이돔 |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7084284B2 (ja) * | 2018-11-28 | 2022-06-14 | 京セラ株式会社 | 電気機器用ケース及び電力制御装置 |
US10687433B1 (en) | 2019-06-12 | 2020-06-16 | Phoenix Contact Development and Manufacturing, Inc. | Electrical component enclosure assembly and method of use |
CN115151119A (zh) * | 2021-03-29 | 2022-10-04 | 北京小米移动软件有限公司 | 电子设备 |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0284392U (ja) * | 1988-12-20 | 1990-06-29 | ||
JPH05259325A (ja) * | 1992-03-10 | 1993-10-08 | Nec Corp | 半導体装置 |
JPH0974641A (ja) * | 1995-09-04 | 1997-03-18 | Sumitomo Wiring Syst Ltd | 電子制御ユニットの収容箱 |
JP2004008281A (ja) * | 2002-06-04 | 2004-01-15 | Hitachi Home & Life Solutions Inc | 洗濯機又は洗濯乾燥機 |
JP2004072907A (ja) * | 2002-08-06 | 2004-03-04 | Sumitomo Wiring Syst Ltd | 電気接続箱 |
JP2004096968A (ja) * | 2002-09-04 | 2004-03-25 | Sumitomo Wiring Syst Ltd | 電気接続箱の排水構造 |
JP2010030385A (ja) * | 2008-07-28 | 2010-02-12 | Keihin Corp | 電子装置の基板の押圧構造 |
JP2014217255A (ja) * | 2013-04-30 | 2014-11-17 | 矢崎総業株式会社 | 電気接続箱 |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5329426A (en) * | 1993-03-22 | 1994-07-12 | Digital Equipment Corporation | Clip-on heat sink |
CA2199239A1 (en) * | 1997-03-05 | 1998-09-05 | Trevor Zapach | Electronic unit |
JPH11299285A (ja) * | 1998-04-16 | 1999-10-29 | Fanuc Ltd | サーボアンプ |
JP3883847B2 (ja) * | 2001-11-19 | 2007-02-21 | 株式会社日立製作所 | 車載用信号処理装置 |
TW557119U (en) * | 2003-01-24 | 2003-10-01 | Delta Electronics Inc | Casing structure capable of dissipating heat for electronic apparatus |
US7085136B2 (en) * | 2004-04-14 | 2006-08-01 | Thermaltake Technology Ltd. | Heat duct-equipped heat-radiating device for power supply |
JP2006229046A (ja) * | 2005-02-18 | 2006-08-31 | Toshiba Corp | 電子機器の放熱装置及び放熱方法 |
JP4445409B2 (ja) * | 2005-02-23 | 2010-04-07 | 株式会社東芝 | 電子機器の放熱装置 |
US7281862B2 (en) * | 2005-03-31 | 2007-10-16 | Intel Corporation | Optical device latching mechanism |
JP2007012941A (ja) * | 2005-06-30 | 2007-01-18 | Toshiba Corp | 電子機器、およびこの電子機器に組み込まれたヒートシンク |
US7724526B2 (en) * | 2008-10-10 | 2010-05-25 | Delphi Technologies, Inc. | Electronic module with heat sink |
TWM394573U (en) * | 2010-07-29 | 2010-12-11 | Ks Terminals Inc | Junction box |
US20120048871A1 (en) * | 2010-08-30 | 2012-03-01 | Teh-Tsung Chiu | Waterproof and breathable plug |
US8881931B2 (en) * | 2010-08-30 | 2014-11-11 | Avc Industrial Corp. | Waterproof and breathable plug |
JP5358544B2 (ja) | 2010-09-22 | 2013-12-04 | 日立オートモティブシステムズ株式会社 | 電子制御装置 |
US20120170224A1 (en) * | 2010-12-29 | 2012-07-05 | Src, Inc. | Circuit board frame with integral heat sink for enhanced thermal transfer |
US8809697B2 (en) * | 2011-05-05 | 2014-08-19 | Carefusion 303, Inc. | Passive cooling and EMI shielding system |
US9165854B2 (en) * | 2012-04-12 | 2015-10-20 | Qualcomm Incorporated | Heat dissipation features, electronic devices incorporating heat dissipation features, and methods of making heat dissipation features |
WO2014144065A2 (en) * | 2013-03-15 | 2014-09-18 | Finsix Corporation | Method and apparatus for controlling heat in power conversion systems |
US20160169594A1 (en) * | 2013-07-29 | 2016-06-16 | Ge Intelligent Platforms, Inc. | Heatspreader with extended surface for heat transfer through a sealed chassis wall |
CN204408824U (zh) * | 2014-12-18 | 2015-06-17 | 热流动力能源科技股份有限公司 | 热交换装置 |
-
2016
- 2016-07-15 JP JP2016140073A patent/JP6389211B2/ja not_active Expired - Fee Related
-
2017
- 2017-06-15 US US15/623,383 patent/US10149397B2/en active Active
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0284392U (ja) * | 1988-12-20 | 1990-06-29 | ||
JPH05259325A (ja) * | 1992-03-10 | 1993-10-08 | Nec Corp | 半導体装置 |
JPH0974641A (ja) * | 1995-09-04 | 1997-03-18 | Sumitomo Wiring Syst Ltd | 電子制御ユニットの収容箱 |
JP2004008281A (ja) * | 2002-06-04 | 2004-01-15 | Hitachi Home & Life Solutions Inc | 洗濯機又は洗濯乾燥機 |
JP2004072907A (ja) * | 2002-08-06 | 2004-03-04 | Sumitomo Wiring Syst Ltd | 電気接続箱 |
JP2004096968A (ja) * | 2002-09-04 | 2004-03-25 | Sumitomo Wiring Syst Ltd | 電気接続箱の排水構造 |
JP2010030385A (ja) * | 2008-07-28 | 2010-02-12 | Keihin Corp | 電子装置の基板の押圧構造 |
JP2014217255A (ja) * | 2013-04-30 | 2014-11-17 | 矢崎総業株式会社 | 電気接続箱 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112954942A (zh) * | 2021-04-23 | 2021-06-11 | 大连交通大学 | 一种用于计算机自动化系统的易装卸防尘装置及方法 |
KR102625397B1 (ko) * | 2022-10-17 | 2024-01-17 | (주)인텔리안테크놀로지스 | 결로 및 결빙 방지 레이돔 |
WO2024085346A1 (ko) * | 2022-10-17 | 2024-04-25 | (주)인텔리안테크놀로지스 | 결로 및 결빙 방지 레이돔 |
Also Published As
Publication number | Publication date |
---|---|
JP6389211B2 (ja) | 2018-09-12 |
US10149397B2 (en) | 2018-12-04 |
US20180020561A1 (en) | 2018-01-18 |
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