JP2017538108A - 変形可能な装置及び方法 - Google Patents
変形可能な装置及び方法 Download PDFInfo
- Publication number
- JP2017538108A JP2017538108A JP2017520341A JP2017520341A JP2017538108A JP 2017538108 A JP2017538108 A JP 2017538108A JP 2017520341 A JP2017520341 A JP 2017520341A JP 2017520341 A JP2017520341 A JP 2017520341A JP 2017538108 A JP2017538108 A JP 2017538108A
- Authority
- JP
- Japan
- Prior art keywords
- support structure
- curved support
- electrode
- curved
- resistance sensor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 41
- 239000000463 material Substances 0.000 claims abstract description 137
- 239000000758 substrate Substances 0.000 claims abstract description 117
- 229920000642 polymer Polymers 0.000 claims description 39
- 230000004044 response Effects 0.000 claims description 12
- 229920002120 photoresistant polymer Polymers 0.000 description 52
- 239000011149 active material Substances 0.000 description 49
- 239000004020 conductor Substances 0.000 description 19
- 238000005452 bending Methods 0.000 description 18
- 239000003989 dielectric material Substances 0.000 description 14
- 239000011810 insulating material Substances 0.000 description 13
- 239000012811 non-conductive material Substances 0.000 description 12
- 238000004544 sputter deposition Methods 0.000 description 8
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 7
- 230000008859 change Effects 0.000 description 7
- 229920001971 elastomer Polymers 0.000 description 7
- 239000000806 elastomer Substances 0.000 description 7
- 229910021389 graphene Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000004065 semiconductor Substances 0.000 description 6
- 238000000926 separation method Methods 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 238000007650 screen-printing Methods 0.000 description 5
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 4
- 239000004642 Polyimide Substances 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 238000000151 deposition Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000007641 inkjet printing Methods 0.000 description 4
- 229920001721 polyimide Polymers 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 238000007740 vapor deposition Methods 0.000 description 4
- 238000001514 detection method Methods 0.000 description 3
- 230000007613 environmental effect Effects 0.000 description 3
- 238000001704 evaporation Methods 0.000 description 3
- 230000008020 evaporation Effects 0.000 description 3
- 238000002161 passivation Methods 0.000 description 3
- 239000002861 polymer material Substances 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- 239000004698 Polyethylene Substances 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 2
- 238000000231 atomic layer deposition Methods 0.000 description 2
- 239000013536 elastomeric material Substances 0.000 description 2
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- 229920000412 polyarylene Polymers 0.000 description 2
- -1 polyethylene Polymers 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 229920002223 polystyrene Polymers 0.000 description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 230000001413 cellular effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 230000000593 degrading effect Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003071 parasitic effect Effects 0.000 description 1
- SLIUAWYAILUBJU-UHFFFAOYSA-N pentacene Chemical compound C1=CC=CC2=CC3=CC4=CC5=CC=CC=C5C=C4C=C3C=C21 SLIUAWYAILUBJU-UHFFFAOYSA-N 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- 229920000301 poly(3-hexylthiophene-2,5-diyl) polymer Polymers 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000011540 sensing material Substances 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 230000035900 sweating Effects 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/0032—Packages or encapsulation
- B81B7/0045—Packages or encapsulation for reducing stress inside of the package structure
- B81B7/0054—Packages or encapsulation for reducing stress inside of the package structure between other parts not provided for in B81B7/0048 - B81B7/0051
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/0283—Stretchable printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/02—Sensors
- B81B2201/0278—Temperature sensors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/02—Sensors
- B81B2201/0292—Sensors not provided for in B81B2201/0207 - B81B2201/0285
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09018—Rigid curved substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09109—Locally detached layers, e.g. in multilayer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09218—Conductive traces
- H05K2201/09263—Meander
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10151—Sensor
Abstract
Description
Claims (15)
- 装置であって、
変形可能な基材と、
抵抗センサの少なくとも一部分を支持するように構成された湾曲支持構造であって、前記抵抗センサは、第一電極、第二電極、及び前記電極間に提供された抵抗センサ材料を具備する、湾曲支持構造と、
前記変形可能な基材が変形した際に前記湾曲支持構造が同一の方式で変形しないように、前記湾曲支持構造を前記変形可能な基材から離隔させるように構成された少なくとも一つの支持部と、
を具備し、
前記抵抗センサは、前記変形可能な基材が変形した際に前記抵抗センサの変形を制限するように、前記湾曲支持構造上において位置決めされている、装置。 - 前記電極は、前記湾曲支持構造の長さに沿って延在している、請求項1に記載の装置。
- 複数の抵抗センサが前記湾曲支持構造上において提供されている、請求項1又は請求項2に記載の装置。
- 複数の湾曲支持構造が提供されている、請求項1から請求項3までのいずれか一項に記載の装置。
- 第一の複数の湾曲支持構造が、第一方向に延在するように提供され、且つ、第二の複数の湾曲構造が、前記第一の複数の湾曲支持構造にオーバーレイするように、且つ、第二方向に延在するように、提供され、前記第二方向は、前記第一方向に対して垂直である、請求項1から請求項4までのいずれか一項に記載の装置。
- 前記第二電極は、第二湾曲構造上において提供されている、請求項5に記載の装置。
- 前記第一湾曲支持構造は、前記第一電極と前記第二電極との間において提供されたポリマー層を具備し、且つ、ビアが、前記第一電極及び前記第二電極を接続するべく、前記ポリマー層を通じて提供されている、請求項6に記載の装置。
- 前記第一湾曲支持構造は、前記抵抗センサ材料及び前記第二電極が前記第一電極によって支持されるように、前記第一電極を具備する、請求項1から請求項7までのいずれか一項に記載の装置。
- 前記第一湾曲支持構造は、ポリマー層を具備し、且つ、前記第一及び第二電極及び前記抵抗センサ材料は、前記ポリマー層によって支持されている、請求項1から請求項7までのいずれか一項に記載の装置。
- 前記抵抗センサは、トランジスタを具備する、請求項1から請求項9までのいずれか一項に記載の装置。
- 前記変形可能な基材は、前記湾曲支持構造及び抵抗センサが提供される空洞を形成している、請求項1から請求項10までのいずれか一項に記載の装置。
- 前記湾曲支持構造の曲率半径は、前記変形可能な基材のプレーンに対して平行であり、且つ、前記湾曲支持構造は、蛇行形状を有し、且つ、前記蛇行形状は、左手側に延在するループが右手側に延在するループによって後続されるように、複数のループを具備する、請求項1から請求項11までのいずれか一項に記載の装置。
- 前記変形可能な基材は、ユーザによって印加された力に応答して変形するように構成されている、請求項1から請求項12までのいずれか一項に記載の装置。
- 請求項1から請求項13までのいずれか一項に記載の装置を具備する電子装置。
- 方法であって、
変形可能な基材を提供するステップと、
抵抗センサの少なくとも一部分を支持するように構成された湾曲支持構造を提供するステップであって、前記抵抗センサは、第一電極、第二電極、及び前記電極間に提供された抵抗センサ材料を具備する、ステップと、
前記変形可能な基材が変形した際に前記湾曲支持構造が同一の方式で変形しないように、前記湾曲支持構造を前記変形可能な基材から離隔させるように構成された少なくとも一つの支持部を提供するステップと、
を具備し、
前記抵抗センサは、前記変形可能な基材が変形した際に前記抵抗センサの変形を制限するように、前記湾曲支持構造上において位置決めされている、方法。
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP14189248.9A EP3010315A1 (en) | 2014-10-16 | 2014-10-16 | A deformable apparatus and method |
EP14189248.9 | 2014-10-16 | ||
EP15153847.7A EP3010316B1 (en) | 2014-10-16 | 2015-02-04 | A deformable apparatus and method |
EP15153847.7 | 2015-02-04 | ||
PCT/FI2015/050680 WO2016059291A1 (en) | 2014-10-16 | 2015-10-12 | A deformable apparatus and method |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2017538108A true JP2017538108A (ja) | 2017-12-21 |
JP6480576B2 JP6480576B2 (ja) | 2019-03-13 |
Family
ID=51743327
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017520341A Active JP6480576B2 (ja) | 2014-10-16 | 2015-10-12 | 変形可能な装置及び方法 |
Country Status (7)
Country | Link |
---|---|
US (1) | US10435289B2 (ja) |
EP (2) | EP3010315A1 (ja) |
JP (1) | JP6480576B2 (ja) |
CN (1) | CN107001027B (ja) |
PH (1) | PH12017500714B1 (ja) |
PL (1) | PL3010316T3 (ja) |
WO (1) | WO2016059291A1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7361429B2 (ja) | 2020-12-31 | 2023-10-16 | 中国科学院蘇州納米技術与納米▲ファン▼生研究所 | 汗センサ及び汗検知システム |
JP7473931B1 (ja) | 2023-12-06 | 2024-04-24 | コフロック株式会社 | 炭化ケイ素を用いた温度測定及び除電構造 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108550587B (zh) | 2018-06-05 | 2020-08-11 | 京东方科技集团股份有限公司 | 柔性显示基板及其制作方法、柔性显示装置 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2014124049A2 (en) * | 2013-02-06 | 2014-08-14 | The Board Of Trustees Of The University Of Illinois | Stretchable electronic systems with containment chambers |
Family Cites Families (55)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100421304B1 (ko) | 1999-07-09 | 2004-03-09 | 엔이씨 도낀 가부시끼가이샤 | 정전용량식 왜곡센서 및 그 사용방법 |
JP2001358422A (ja) | 2000-06-13 | 2001-12-26 | Sony Corp | 電子回路装置 |
US6743982B2 (en) | 2000-11-29 | 2004-06-01 | Xerox Corporation | Stretchable interconnects using stress gradient films |
US6859577B2 (en) | 2001-06-25 | 2005-02-22 | Analog Devices Inc. | Self assembled micro anti-stiction structure |
US6849935B2 (en) | 2002-05-10 | 2005-02-01 | Sarnoff Corporation | Low-cost circuit board materials and processes for area array electrical interconnections over a large area between a device and the circuit board |
JP2005209729A (ja) | 2004-01-20 | 2005-08-04 | Yaskawa Electric Corp | プリント基板実装構造 |
JP2005235997A (ja) | 2004-02-19 | 2005-09-02 | Mitsubishi Electric Corp | プリント基板、電子回路基板及びその製造方法 |
US7521292B2 (en) | 2004-06-04 | 2009-04-21 | The Board Of Trustees Of The University Of Illinois | Stretchable form of single crystal silicon for high performance electronics on rubber substrates |
EP1756591B1 (en) | 2004-06-09 | 2008-03-19 | ETH Zürich | Multi-axis capacitive transducer |
JP2006005026A (ja) | 2004-06-15 | 2006-01-05 | Epson Toyocom Corp | 電子機器、プリント基板ユニット、及びスペーサ |
JP4328970B2 (ja) | 2005-08-02 | 2009-09-09 | セイコーエプソン株式会社 | 半導体装置 |
US7564536B2 (en) | 2005-11-08 | 2009-07-21 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US7395717B2 (en) | 2006-02-10 | 2008-07-08 | Milliken & Company | Flexible capacitive sensor |
KR101262135B1 (ko) | 2006-02-21 | 2013-05-14 | 신닛테츠 수미킨 가가쿠 가부시키가이샤 | 다층 프린트 배선판 및 그 제조방법 |
JP2007250998A (ja) | 2006-03-17 | 2007-09-27 | Seiko Epson Corp | 半導体装置及びその製造方法 |
KR20080043068A (ko) | 2006-11-13 | 2008-05-16 | 삼성전자주식회사 | 칩 온 필름 구조를 갖는 반도체 장치 및 그 제조방법 |
KR100837276B1 (ko) | 2006-12-20 | 2008-06-11 | 삼성전자주식회사 | 인쇄 회로 기판 및 이를 사용하는 반도체 메모리 모듈 |
JP5056051B2 (ja) | 2007-02-19 | 2012-10-24 | パナソニック株式会社 | カード型情報装置 |
JP2008235594A (ja) | 2007-03-20 | 2008-10-02 | Sumitomo Electric Printed Circuit Inc | 配線板接合体およびその製造方法 |
JP2009094099A (ja) | 2007-10-03 | 2009-04-30 | Nec Lcd Technologies Ltd | フレキシブル基板の接続部の構造、フレキシブル基板、フラットパネル表示装置 |
JP4855373B2 (ja) * | 2007-10-30 | 2012-01-18 | ミネベア株式会社 | 曲げセンサ |
US20090158856A1 (en) | 2007-12-23 | 2009-06-25 | Divyasimha Harish | Capacitive strain gauge system and method |
KR101755207B1 (ko) * | 2008-03-05 | 2017-07-19 | 더 보드 오브 트러스티즈 오브 더 유니버시티 오브 일리노이 | 펴고 접을 수 있는 전자장치 |
US8161826B1 (en) | 2009-03-05 | 2012-04-24 | Stryker Corporation | Elastically stretchable fabric force sensor arrays and methods of making |
US8097926B2 (en) | 2008-10-07 | 2012-01-17 | Mc10, Inc. | Systems, methods, and devices having stretchable integrated circuitry for sensing and delivering therapy |
US8342031B2 (en) | 2008-10-27 | 2013-01-01 | The Regents Of The University Of California | Capacitive strain sensor |
US7998797B2 (en) | 2008-12-09 | 2011-08-16 | Infineon Technologies Ag | Semiconductor device |
US8187795B2 (en) * | 2008-12-09 | 2012-05-29 | The Board Of Trustees Of The University Of Illinois | Patterning methods for stretchable structures |
WO2010086034A1 (en) | 2009-01-30 | 2010-08-05 | Interuniversitair Microelektronica Centrum Vzw | Stretchable electronic device |
WO2010086033A1 (en) | 2009-01-30 | 2010-08-05 | Interuniversitair Microelektronica Centrum Vzw | Stretchable electronic device |
JP2010251706A (ja) | 2009-03-25 | 2010-11-04 | Panasonic Corp | 装着用発電モジュール |
US9080622B2 (en) | 2009-04-03 | 2015-07-14 | Eaton Corporation | Hydraulic coupling having self-adjusting anti-rotation hydraulic fluid path |
US8332053B1 (en) | 2009-04-28 | 2012-12-11 | Hrl Laboratories, Llc | Method for fabrication of a stretchable electronic skin |
WO2010131578A1 (ja) | 2009-05-12 | 2010-11-18 | 日本電気株式会社 | 光信号入出力器内蔵半導体装置及びそれを搭載した電子機器 |
US20100307238A1 (en) | 2009-06-05 | 2010-12-09 | The Governors Of The University Of Alberta | Humidity sensor and method of manufacturing the same |
WO2011008459A2 (en) | 2009-06-29 | 2011-01-20 | Infinite Corridor Technology, Llc | Structured material substrates for flexible, stretchable electronics |
US10441185B2 (en) | 2009-12-16 | 2019-10-15 | The Board Of Trustees Of The University Of Illinois | Flexible and stretchable electronic systems for epidermal electronics |
KR101765473B1 (ko) | 2010-06-21 | 2017-08-24 | 삼성전자 주식회사 | 인쇄 회로 기판 및 이를 포함하는 반도체 패키지 |
JP2012069673A (ja) | 2010-09-22 | 2012-04-05 | Sony Corp | フレキシブル基板、フレキシブル基板の実装方法及び照明装置 |
WO2012076612A1 (en) | 2010-12-08 | 2012-06-14 | Condalign As | Method for assembling conductive particles into conductive pathways and sensors thus formed |
WO2012133530A1 (ja) | 2011-03-31 | 2012-10-04 | 日本碍子株式会社 | セラミックス素子の製造方法 |
US20130027344A1 (en) | 2011-07-29 | 2013-01-31 | Sim Kok Choon | Apparatus Including a Touch-Sensitive Interface Including a Serpentine Electrode Pattern |
WO2013019510A1 (en) | 2011-08-01 | 2013-02-07 | President And Fellows Of Harvard College | Mems force sensors fabricated using paper substrates |
CN104024723B (zh) | 2011-11-23 | 2016-08-24 | 3M创新有限公司 | 具有三维结构的柔性发光半导体器件 |
JP5855979B2 (ja) | 2012-03-07 | 2016-02-09 | 日本メクトロン株式会社 | 伸縮性フレキシブル回路基板 |
EP2839270B1 (en) | 2012-03-26 | 2019-11-06 | Technion Research & Development Foundation Limited | A platform unit for combined sensing of pressure, temperature and humidity |
US9554484B2 (en) | 2012-03-30 | 2017-01-24 | The Board Of Trustees Of The University Of Illinois | Appendage mountable electronic devices conformable to surfaces |
US8895864B2 (en) | 2012-03-30 | 2014-11-25 | Nokia Corporation | Deformable apparatus and method |
GB2514738A (en) | 2012-05-04 | 2014-12-03 | Unipixel Displays Inc | High resolution conductive patterns having low variance through optimization of catalyst concentration |
US9247637B2 (en) | 2012-06-11 | 2016-01-26 | Mc10, Inc. | Strain relief structures for stretchable interconnects |
US10840536B2 (en) * | 2013-02-06 | 2020-11-17 | The Board Of Trustees Of The University Of Illinois | Stretchable electronic systems with containment chambers |
EP3828680B1 (en) * | 2013-05-10 | 2024-02-14 | Nokia Technologies Oy | Meandering interconnect on a deformable substrate |
GB2524327A (en) | 2014-03-21 | 2015-09-23 | Nokia Technologies Oy | Flexible electronics apparatus and associated methods |
US10197459B2 (en) * | 2015-12-17 | 2019-02-05 | Facebook Technologies, Llc | Indexable strain sensor |
US10209830B2 (en) * | 2016-03-31 | 2019-02-19 | Apple Inc. | Electronic device having direction-dependent strain elements |
-
2014
- 2014-10-16 EP EP14189248.9A patent/EP3010315A1/en not_active Withdrawn
-
2015
- 2015-02-04 PL PL15153847T patent/PL3010316T3/pl unknown
- 2015-02-04 EP EP15153847.7A patent/EP3010316B1/en active Active
- 2015-10-12 US US15/518,053 patent/US10435289B2/en active Active
- 2015-10-12 WO PCT/FI2015/050680 patent/WO2016059291A1/en active Application Filing
- 2015-10-12 CN CN201580067857.8A patent/CN107001027B/zh active Active
- 2015-10-12 JP JP2017520341A patent/JP6480576B2/ja active Active
-
2017
- 2017-04-17 PH PH12017500714A patent/PH12017500714B1/en unknown
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2014124049A2 (en) * | 2013-02-06 | 2014-08-14 | The Board Of Trustees Of The University Of Illinois | Stretchable electronic systems with containment chambers |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7361429B2 (ja) | 2020-12-31 | 2023-10-16 | 中国科学院蘇州納米技術与納米▲ファン▼生研究所 | 汗センサ及び汗検知システム |
JP7473931B1 (ja) | 2023-12-06 | 2024-04-24 | コフロック株式会社 | 炭化ケイ素を用いた温度測定及び除電構造 |
Also Published As
Publication number | Publication date |
---|---|
CN107001027A (zh) | 2017-08-01 |
PH12017500714A1 (en) | 2017-10-09 |
US20170305741A1 (en) | 2017-10-26 |
US10435289B2 (en) | 2019-10-08 |
EP3010316B1 (en) | 2019-09-25 |
PL3010316T3 (pl) | 2020-03-31 |
EP3010315A1 (en) | 2016-04-20 |
EP3010316A1 (en) | 2016-04-20 |
PH12017500714B1 (en) | 2017-10-09 |
CN107001027B (zh) | 2019-05-21 |
WO2016059291A1 (en) | 2016-04-21 |
JP6480576B2 (ja) | 2019-03-13 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
Choi et al. | Stretchable, transparent, and stretch-unresponsive capacitive touch sensor array with selectively patterned silver nanowires/reduced graphene oxide electrodes | |
US10254902B2 (en) | Touch sensor device including a polymer layer having conductive and non-conductive regions | |
EP2843519B1 (en) | Touch window and touch device including the same | |
US9904395B2 (en) | Pressure sensor comprising first pressure sensitive element and second pressure sensitive element | |
US8893565B2 (en) | Apparatus for sensing | |
US9798412B2 (en) | Touch sensor device | |
KR101850636B1 (ko) | 도전 시트, 정전 용량식 터치 패널 및 표시 장치 | |
JP6480576B2 (ja) | 変形可能な装置及び方法 | |
KR20150088273A (ko) | 은 포함 투명 전도층을 포함한 투영식 정전용량 터치 패널 | |
JP2015198102A (ja) | 伸縮性フレキシブル基板およびその製造方法 | |
US9921697B2 (en) | Touch sensor device and manufacturing method thereof | |
US10185453B2 (en) | Pressure sensor and display device including the same | |
JP6353162B2 (ja) | 変形可能な装置および方法 | |
JP2011108482A (ja) | 導電膜付き電極板及びパネル型入力装置 | |
KR101615812B1 (ko) | 이격된 그래핀 패턴을 갖는 그래핀 터치 센서 및 그 제조 방법 | |
JP2022009270A (ja) | 圧力分布センサ | |
KR20160145234A (ko) | 그래핀을 이용한 능동센서소자, 및 그 제조 방법 | |
TW201342169A (zh) | 電容式觸控裝置及製作方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20180427 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20180508 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20180731 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20190108 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20190207 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6480576 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |