JP2017517142A - 低背基板のためのパターン間パターン - Google Patents

低背基板のためのパターン間パターン Download PDF

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Publication number
JP2017517142A
JP2017517142A JP2016562244A JP2016562244A JP2017517142A JP 2017517142 A JP2017517142 A JP 2017517142A JP 2016562244 A JP2016562244 A JP 2016562244A JP 2016562244 A JP2016562244 A JP 2016562244A JP 2017517142 A JP2017517142 A JP 2017517142A
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JP
Japan
Prior art keywords
patterned metal
metal layer
substrate
layer
dielectric
Prior art date
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Pending
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JP2016562244A
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English (en)
Japanese (ja)
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JP2017517142A5 (enExample
Inventor
ホン・ボク・ウィ
チン−クァン・キム
ドン・ウク・キム
ジェ・シク・イ
キュ−ピュン・ファン
ヨン・キョ・ソン
Original Assignee
クアルコム，インコーポレイテッド
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Application filed by クアルコム，インコーポレイテッド filed Critical クアルコム，インコーポレイテッド
Publication of JP2017517142A publication Critical patent/JP2017517142A/ja
Publication of JP2017517142A5 publication Critical patent/JP2017517142A5/ja
Pending legal-status Critical Current

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    • H10P50/00—
    • H10W20/01—
    • H10W20/031—
    • H10W20/057—
    • H10W20/063—
    • H10W20/081—
    • H10W20/089—
    • H10W20/435—
    • H10W20/48—
    • H10W70/05—
    • H10W70/685—
    • H10W72/252—
    • H10W90/724—

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Geometry (AREA)
  • Ceramic Engineering (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Structure Of Printed Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP2016562244A 2014-04-15 2015-04-10 低背基板のためのパターン間パターン Pending JP2017517142A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US14/253,798 2014-04-15
US14/253,798 US9269610B2 (en) 2014-04-15 2014-04-15 Pattern between pattern for low profile substrate
PCT/US2015/025435 WO2015160671A1 (en) 2014-04-15 2015-04-10 Pattern between pattern for low profile substrate

Publications (2)

Publication Number Publication Date
JP2017517142A true JP2017517142A (ja) 2017-06-22
JP2017517142A5 JP2017517142A5 (enExample) 2018-05-10

Family

ID=53005702

Family Applications (1)

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JP2016562244A Pending JP2017517142A (ja) 2014-04-15 2015-04-10 低背基板のためのパターン間パターン

Country Status (7)

Country Link
US (1) US9269610B2 (enExample)
EP (1) EP3132469B1 (enExample)
JP (1) JP2017517142A (enExample)
KR (1) KR20160145572A (enExample)
CN (1) CN106575623A (enExample)
BR (1) BR112016023947A2 (enExample)
WO (1) WO2015160671A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109346821A (zh) * 2018-09-19 2019-02-15 中国科学院上海微系统与信息技术研究所 圆片级硅基集成小型化分形天线及其制备方法

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12044965B2 (en) * 2020-02-12 2024-07-23 Hutchinson Technology Incorporated Method for forming components without adding tabs during etching
US20220093505A1 (en) * 2020-09-24 2022-03-24 Intel Corporation Via connections for staggered interconnect lines
US12500162B2 (en) * 2021-12-22 2025-12-16 Intel Corporation Staggered vertically spaced integrated circuit line metallization with differential vias and metal-selective deposition
US20230395506A1 (en) * 2022-06-06 2023-12-07 Intel Corporation Self-aligned staggered integrated circuit interconnect features

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005236018A (ja) * 2004-02-19 2005-09-02 Alps Electric Co Ltd 微細配線構造および微細配線構造の製造方法
JP2006344664A (ja) * 2005-06-07 2006-12-21 Kyocer Slc Technologies Corp 配線基板およびその製造方法

Family Cites Families (15)

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Publication number Priority date Publication date Assignee Title
DE3114679A1 (de) * 1980-04-11 1982-01-14 Hitachi, Ltd., Tokyo Integrierte schaltung mit mehrschichtenverbindungen
JPH0750710B2 (ja) 1990-06-06 1995-05-31 富士ゼロックス株式会社 多層配線構造
KR920017227A (ko) 1991-02-05 1992-09-26 김광호 반도체장치의 층간콘택 구조 및 그 제조방법
US6414367B1 (en) 1999-10-28 2002-07-02 National Semiconductor Corporation Interconnect exhibiting reduced parasitic capacitance variation
JP2002299555A (ja) 2001-03-30 2002-10-11 Seiko Epson Corp 集積回路およびその製造方法
KR100808557B1 (ko) 2002-05-16 2008-02-29 매그나칩 반도체 유한회사 엠아이엠 캐패시터 형성방법
JP4559757B2 (ja) 2004-03-18 2010-10-13 ルネサスエレクトロニクス株式会社 半導体装置およびその製造方法
JP2007194476A (ja) 2006-01-20 2007-08-02 Shinko Electric Ind Co Ltd 多層配線基板の製造方法
US20110215465A1 (en) * 2010-03-03 2011-09-08 Xilinx, Inc. Multi-chip integrated circuit
US8377792B2 (en) * 2010-04-07 2013-02-19 National Semiconductor Corporation Method of forming high capacitance semiconductor capacitors with a single lithography step
WO2012005524A2 (en) * 2010-07-08 2012-01-12 Lg Innotek Co., Ltd. The printed circuit board and the method for manufacturing the same
JP2012094662A (ja) 2010-10-26 2012-05-17 Ngk Spark Plug Co Ltd 多層配線基板の製造方法
US8722505B2 (en) * 2010-11-02 2014-05-13 National Semiconductor Corporation Semiconductor capacitor with large area plates and a small footprint that is formed with shadow masks and only two lithography steps
US8551856B2 (en) * 2011-09-22 2013-10-08 Northrop Grumman Systems Corporation Embedded capacitor and method of fabricating the same
US9012966B2 (en) * 2012-11-21 2015-04-21 Qualcomm Incorporated Capacitor using middle of line (MOL) conductive layers

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005236018A (ja) * 2004-02-19 2005-09-02 Alps Electric Co Ltd 微細配線構造および微細配線構造の製造方法
JP2006344664A (ja) * 2005-06-07 2006-12-21 Kyocer Slc Technologies Corp 配線基板およびその製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109346821A (zh) * 2018-09-19 2019-02-15 中国科学院上海微系统与信息技术研究所 圆片级硅基集成小型化分形天线及其制备方法

Also Published As

Publication number Publication date
WO2015160671A9 (en) 2016-06-09
US9269610B2 (en) 2016-02-23
KR20160145572A (ko) 2016-12-20
EP3132469B1 (en) 2019-01-09
US20150294933A1 (en) 2015-10-15
CN106575623A (zh) 2017-04-19
BR112016023947A2 (pt) 2017-08-15
WO2015160671A1 (en) 2015-10-22
EP3132469A1 (en) 2017-02-22

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