JP2017514307A5 - - Google Patents

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Publication number
JP2017514307A5
JP2017514307A5 JP2016563462A JP2016563462A JP2017514307A5 JP 2017514307 A5 JP2017514307 A5 JP 2017514307A5 JP 2016563462 A JP2016563462 A JP 2016563462A JP 2016563462 A JP2016563462 A JP 2016563462A JP 2017514307 A5 JP2017514307 A5 JP 2017514307A5
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JP
Japan
Prior art keywords
substrate
buffing pad
compressible
buffing
subpad
Prior art date
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Application number
JP2016563462A
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English (en)
Japanese (ja)
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JP6556756B2 (ja
JP2017514307A (ja
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Priority claimed from US14/260,210 external-priority patent/US9844800B2/en
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Publication of JP2017514307A publication Critical patent/JP2017514307A/ja
Publication of JP2017514307A5 publication Critical patent/JP2017514307A5/ja
Application granted granted Critical
Publication of JP6556756B2 publication Critical patent/JP6556756B2/ja
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JP2016563462A 2014-04-23 2015-04-17 化学機械平坦化後の基板洗浄のためのシステム、方法、及び装置 Active JP6556756B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US14/260,210 US9844800B2 (en) 2014-04-23 2014-04-23 Systems, methods and apparatus for post-chemical mechanical planarization substrate cleaning
US14/260,210 2014-04-23
PCT/US2015/026552 WO2015164220A1 (en) 2014-04-23 2015-04-17 Systems, methods and apparatus for post-chemical mechanical planarization substrate cleaning

Publications (3)

Publication Number Publication Date
JP2017514307A JP2017514307A (ja) 2017-06-01
JP2017514307A5 true JP2017514307A5 (enExample) 2018-06-07
JP6556756B2 JP6556756B2 (ja) 2019-08-07

Family

ID=54333040

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016563462A Active JP6556756B2 (ja) 2014-04-23 2015-04-17 化学機械平坦化後の基板洗浄のためのシステム、方法、及び装置

Country Status (6)

Country Link
US (1) US9844800B2 (enExample)
JP (1) JP6556756B2 (enExample)
KR (1) KR102396676B1 (enExample)
CN (1) CN106233432B (enExample)
TW (1) TWI652752B (enExample)
WO (1) WO2015164220A1 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG10201906815XA (en) * 2014-08-26 2019-08-27 Ebara Corp Substrate processing apparatus
US11664213B2 (en) * 2019-12-26 2023-05-30 Taiwan Semiconductor Manufacturing Company, Ltd. Bevel edge removal methods, tools, and systems
US11545371B2 (en) * 2020-06-23 2023-01-03 Applied Materials, Inc. Platen shield cleaning system
US12138732B2 (en) * 2020-12-14 2024-11-12 Applied Materials, Inc. Polishing system apparatus and methods for defect reduction at a substrate edge
CN113078078A (zh) * 2021-03-19 2021-07-06 长鑫存储技术有限公司 晶圆清洗方法及晶圆清洗装置
US20240316598A1 (en) * 2023-03-20 2024-09-26 Applied Materials, Inc. Compression gap control for pad-based chemical buff post cmp cleaning

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5551986A (en) * 1995-02-15 1996-09-03 Taxas Instruments Incorporated Mechanical scrubbing for particle removal
JPH08250455A (ja) * 1995-02-15 1996-09-27 Texas Instr Inc <Ti> 化学機械的に研磨される半導体ウェーハ面から汚染粒子を除去する方法および装置
JP4048396B2 (ja) * 1998-04-21 2008-02-20 旭硝子株式会社 板状材への加圧方法及び加圧装置
US6413388B1 (en) 2000-02-23 2002-07-02 Nutool Inc. Pad designs and structures for a versatile materials processing apparatus
US6269510B1 (en) * 1999-01-04 2001-08-07 International Business Machines Corporation Post CMP clean brush with torque monitor
US6217426B1 (en) * 1999-04-06 2001-04-17 Applied Materials, Inc. CMP polishing pad
US7232752B2 (en) 2001-04-24 2007-06-19 United Microelectronics Corp. Method of removing contaminants from a silicon wafer after chemical-mechanical polishing operation
JP2003039305A (ja) * 2001-08-01 2003-02-13 Minolta Co Ltd 研磨装置
JPWO2004105113A1 (ja) * 2003-05-26 2006-07-20 株式会社ニコン Ｃｍｐ研磨用研磨体、ｃｍｐ研磨装置、ｃｍｐ研磨方法、及び半導体デバイスの製造方法
US7288165B2 (en) * 2003-10-24 2007-10-30 Applied Materials, Inc. Pad conditioning head for CMP process
US7655565B2 (en) * 2005-01-26 2010-02-02 Applied Materials, Inc. Electroprocessing profile control
JP2006303180A (ja) * 2005-04-20 2006-11-02 Matsushita Electric Ind Co Ltd 基板の固定方法
US7344989B2 (en) 2005-08-19 2008-03-18 Nec Electronics America, Inc. CMP wafer contamination reduced by insitu clean
JP4814677B2 (ja) * 2006-03-31 2011-11-16 株式会社荏原製作所 基板保持装置および研磨装置
JP2007305745A (ja) * 2006-05-10 2007-11-22 Nikon Corp 研磨体、研磨装置、これを用いた半導体デバイス製造方法およびこの方法により製造される半導体デバイス
KR101004432B1 (ko) * 2008-06-10 2010-12-28 세메스 주식회사 매엽식 기판 처리 장치
CN201887033U (zh) * 2010-11-12 2011-06-29 北大方正集团有限公司 治具及清洗机
KR102229920B1 (ko) * 2013-10-25 2021-03-19 어플라이드 머티어리얼스, 인코포레이티드 화학 기계적 평탄화 후의 기판 버프 사전 세정을 위한 시스템, 방법 및 장치

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