TWI652752B - 用於化學機械平坦化後的基板清洗的系統、方法及設備 - Google Patents

用於化學機械平坦化後的基板清洗的系統、方法及設備 Download PDF

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Publication number
TWI652752B
TWI652752B TW104112734A TW104112734A TWI652752B TW I652752 B TWI652752 B TW I652752B TW 104112734 A TW104112734 A TW 104112734A TW 104112734 A TW104112734 A TW 104112734A TW I652752 B TWI652752 B TW I652752B
Authority
TW
Taiwan
Prior art keywords
polishing pad
substrate
pad
assembly
polishing
Prior art date
Application number
TW104112734A
Other languages
English (en)
Chinese (zh)
Other versions
TW201603165A (zh
Inventor
努尼佳史帝文Ｍ
布朗布萊恩Ｊ
Original Assignee
美商應用材料股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 美商應用材料股份有限公司 filed Critical 美商應用材料股份有限公司
Publication of TW201603165A publication Critical patent/TW201603165A/zh
Application granted granted Critical
Publication of TWI652752B publication Critical patent/TWI652752B/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/10—Cleaning by methods involving the use of tools characterised by the type of cleaning tool
    • B08B1/14—Wipes; Absorbent members, e.g. swabs or sponges
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
    • B08B1/32—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members
    • B08B1/36—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members rotating about an axis orthogonal to the surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02096—Cleaning only mechanical cleaning
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
TW104112734A 2014-04-23 2015-04-21 用於化學機械平坦化後的基板清洗的系統、方法及設備 TWI652752B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US14/260,210 US9844800B2 (en) 2014-04-23 2014-04-23 Systems, methods and apparatus for post-chemical mechanical planarization substrate cleaning
US14/260,210 2014-04-23

Publications (2)

Publication Number Publication Date
TW201603165A TW201603165A (zh) 2016-01-16
TWI652752B true TWI652752B (zh) 2019-03-01

Family

ID=54333040

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104112734A TWI652752B (zh) 2014-04-23 2015-04-21 用於化學機械平坦化後的基板清洗的系統、方法及設備

Country Status (6)

Country Link
US (1) US9844800B2 (enExample)
JP (1) JP6556756B2 (enExample)
KR (1) KR102396676B1 (enExample)
CN (1) CN106233432B (enExample)
TW (1) TWI652752B (enExample)
WO (1) WO2015164220A1 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG10201906815XA (en) * 2014-08-26 2019-08-27 Ebara Corp Substrate processing apparatus
US11664213B2 (en) * 2019-12-26 2023-05-30 Taiwan Semiconductor Manufacturing Company, Ltd. Bevel edge removal methods, tools, and systems
US11545371B2 (en) * 2020-06-23 2023-01-03 Applied Materials, Inc. Platen shield cleaning system
US12138732B2 (en) * 2020-12-14 2024-11-12 Applied Materials, Inc. Polishing system apparatus and methods for defect reduction at a substrate edge
CN113078078A (zh) * 2021-03-19 2021-07-06 长鑫存储技术有限公司 晶圆清洗方法及晶圆清洗装置
US20240316598A1 (en) * 2023-03-20 2024-09-26 Applied Materials, Inc. Compression gap control for pad-based chemical buff post cmp cleaning

Family Cites Families (18)

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Publication number Priority date Publication date Assignee Title
US5551986A (en) * 1995-02-15 1996-09-03 Taxas Instruments Incorporated Mechanical scrubbing for particle removal
JPH08250455A (ja) * 1995-02-15 1996-09-27 Texas Instr Inc <Ti> 化学機械的に研磨される半導体ウェーハ面から汚染粒子を除去する方法および装置
JP4048396B2 (ja) * 1998-04-21 2008-02-20 旭硝子株式会社 板状材への加圧方法及び加圧装置
US6413388B1 (en) 2000-02-23 2002-07-02 Nutool Inc. Pad designs and structures for a versatile materials processing apparatus
US6269510B1 (en) * 1999-01-04 2001-08-07 International Business Machines Corporation Post CMP clean brush with torque monitor
US6217426B1 (en) * 1999-04-06 2001-04-17 Applied Materials, Inc. CMP polishing pad
US7232752B2 (en) 2001-04-24 2007-06-19 United Microelectronics Corp. Method of removing contaminants from a silicon wafer after chemical-mechanical polishing operation
JP2003039305A (ja) * 2001-08-01 2003-02-13 Minolta Co Ltd 研磨装置
JPWO2004105113A1 (ja) * 2003-05-26 2006-07-20 株式会社ニコン Ｃｍｐ研磨用研磨体、ｃｍｐ研磨装置、ｃｍｐ研磨方法、及び半導体デバイスの製造方法
US7288165B2 (en) * 2003-10-24 2007-10-30 Applied Materials, Inc. Pad conditioning head for CMP process
US7655565B2 (en) * 2005-01-26 2010-02-02 Applied Materials, Inc. Electroprocessing profile control
JP2006303180A (ja) * 2005-04-20 2006-11-02 Matsushita Electric Ind Co Ltd 基板の固定方法
US7344989B2 (en) 2005-08-19 2008-03-18 Nec Electronics America, Inc. CMP wafer contamination reduced by insitu clean
JP4814677B2 (ja) * 2006-03-31 2011-11-16 株式会社荏原製作所 基板保持装置および研磨装置
JP2007305745A (ja) * 2006-05-10 2007-11-22 Nikon Corp 研磨体、研磨装置、これを用いた半導体デバイス製造方法およびこの方法により製造される半導体デバイス
KR101004432B1 (ko) * 2008-06-10 2010-12-28 세메스 주식회사 매엽식 기판 처리 장치
CN201887033U (zh) * 2010-11-12 2011-06-29 北大方正集团有限公司 治具及清洗机
KR102229920B1 (ko) * 2013-10-25 2021-03-19 어플라이드 머티어리얼스, 인코포레이티드 화학 기계적 평탄화 후의 기판 버프 사전 세정을 위한 시스템, 방법 및 장치

Also Published As

Publication number Publication date
US20150306637A1 (en) 2015-10-29
US9844800B2 (en) 2017-12-19
WO2015164220A1 (en) 2015-10-29
JP6556756B2 (ja) 2019-08-07
KR20160145810A (ko) 2016-12-20
JP2017514307A (ja) 2017-06-01
CN106233432A (zh) 2016-12-14
KR102396676B1 (ko) 2022-05-12
TW201603165A (zh) 2016-01-16
CN106233432B (zh) 2019-09-06

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