JP2017510470A5 - - Google Patents
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- JP2017510470A5 JP2017510470A5 JP2016560455A JP2016560455A JP2017510470A5 JP 2017510470 A5 JP2017510470 A5 JP 2017510470A5 JP 2016560455 A JP2016560455 A JP 2016560455A JP 2016560455 A JP2016560455 A JP 2016560455A JP 2017510470 A5 JP2017510470 A5 JP 2017510470A5
- Authority
- JP
- Japan
- Prior art keywords
- layer
- working surface
- polishing
- land area
- contact angle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000005498 polishing Methods 0.000 claims description 18
- 239000010410 layer Substances 0.000 claims description 17
- 239000011148 porous material Substances 0.000 claims description 5
- 238000005296 abrasive Methods 0.000 claims description 2
- 229920000642 polymer Polymers 0.000 claims 5
- 239000002344 surface layer Substances 0.000 claims 3
- 230000000875 corresponding Effects 0.000 claims 1
- 239000000463 material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 239000002131 composite material Substances 0.000 description 1
- 238000004049 embossing Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229920002959 polymer blend Polymers 0.000 description 1
Description
いくつかの実施形態において、研磨層は単一のシートであり得る。単一のシートは、材料の単一層のみを含み（すなわち、ラミネートなどの多層構造ではない）、材料の単一層は単一の組成を有する。この組成は、多成分、例えば、ポリマーブレンド、又はポリマー無機複合物などの多成分を含み得る。単一のシートを、研磨層として使用することは、研磨層を形成するために必要なプロセス工程の数を最小化することによる、コストの利益をもたらし得る。単一のシートを含む研磨層は、成形及びエンボス加工が挙げられるがこれらに限定されない、当該技術分野において既知の技術から作製され得る。正確に成形された突起部、正確に成形された細孔、及び任意によりマクロチャネルを、単一の工程において形成する能力のために、単一のシートが好まれる。
Claims (3)
- 作業表面、及び前記作業表面と反対側の第２表面を有する研磨層を備える研磨パッドであって、
前記作業表面は、ランド領域、並びに複数の正確に成形された細孔、及び複数の正確に成形された突起部の少なくとも一方を含み、
前記ランド領域の厚さは約５ｍｍよりも小さく、前記研磨層はポリマーを含み、
前記研磨層は、前記複数の正確に成形された突起部の表面、前記複数の正確に成形された細孔の表面、及び前記ランド領域の表面の少なくとも１つの上に、複数のナノメートルサイズのトポグラフィ特徴部を含み、
前記研磨層は、単一のポリマーシートである、研磨パッド。 - 作業表面、及び前記作業表面と反対側の第２表面を有する研磨層を備える研磨パッドであって、
前記作業表面は、ランド領域、並びに複数の正確に成形された細孔、及び複数の正確に成形された突起部の少なくとも一方を含み、
前記ランド領域の厚さは約５ｍｍよりも小さく、前記研磨層はポリマーを含み、
前記作業表面は、二次表面層、及びバルク層を含み、前記二次表面層の後退接触角及び前進接触角の少なくとも一方が、前記バルク層の対応する後退接触角、又は前進接触角よりも少なくとも約２０°小さい、研磨パッド。 - 作業表面、及び前記作業表面と反対側の第２表面を有する研磨層を備える研磨パッドであって、
前記作業表面は、ランド領域、並びに複数の正確に成形された細孔、及び複数の正確に成形された突起部の少なくとも一方を含み、
前記ランド領域の厚さは約５ｍｍよりも小さく、前記研磨層はポリマーを含み、
前記作業表面は、二次表面層及びバルク層を含み、前記作業表面の後退接触角は、約５０°未満であり、
前記研磨層は、単一のポリマーシートである、研磨パッド。
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201461974848P | 2014-04-03 | 2014-04-03 | |
| US61/974,848 | 2014-04-03 | ||
| US201462052729P | 2014-09-19 | 2014-09-19 | |
| US62/052,729 | 2014-09-19 | ||
| PCT/US2015/023576 WO2015153601A1 (en) | 2014-04-03 | 2015-03-31 | Polishing pads and systems and methods of making and using the same |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2017510470A JP2017510470A (ja) | 2017-04-13 |
| JP2017510470A5 true JP2017510470A5 (ja) | 2019-07-04 |
| JP6656162B2 JP6656162B2 (ja) | 2020-03-04 |
Family
ID=52823890
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016560455A Active JP6656162B2 (ja) | 2014-04-03 | 2015-03-31 | 研磨パッド及びシステム、並びにその作製方法及び使用方法 |
| JP2016560383A Active JP6640106B2 (ja) | 2014-04-03 | 2015-03-31 | 研磨パッド及びシステム、並びにその作製方法及び使用方法 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016560383A Active JP6640106B2 (ja) | 2014-04-03 | 2015-03-31 | 研磨パッド及びシステム、並びにその作製方法及び使用方法 |
Country Status (8)
| Country | Link |
|---|---|
| US (2) | US10252396B2 (ja) |
| EP (2) | EP3126093B1 (ja) |
| JP (2) | JP6656162B2 (ja) |
| KR (2) | KR102347711B1 (ja) |
| CN (2) | CN106163740B (ja) |
| SG (2) | SG11201608134YA (ja) |
| TW (2) | TWI652142B (ja) |
| WO (2) | WO2015153597A1 (ja) |
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-
2015
- 2015-03-31 KR KR1020167030479A patent/KR102347711B1/ko active IP Right Grant
- 2015-03-31 SG SG11201608134YA patent/SG11201608134YA/en unknown
- 2015-03-31 JP JP2016560455A patent/JP6656162B2/ja active Active
- 2015-03-31 CN CN201580018328.9A patent/CN106163740B/zh active Active
- 2015-03-31 WO PCT/US2015/023572 patent/WO2015153597A1/en active Application Filing
- 2015-03-31 SG SG11201608219WA patent/SG11201608219WA/en unknown
- 2015-03-31 CN CN201580017813.4A patent/CN106132630B/zh active Active
- 2015-03-31 KR KR1020167030482A patent/KR102350350B1/ko active IP Right Grant
- 2015-03-31 WO PCT/US2015/023576 patent/WO2015153601A1/en active Application Filing
- 2015-03-31 US US15/129,639 patent/US10252396B2/en active Active
- 2015-03-31 US US15/300,125 patent/US10071461B2/en active Active
- 2015-03-31 EP EP15716349.4A patent/EP3126093B1/en active Active
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