JPWO2020255744A1 - - Google Patents
Info
- Publication number
- JPWO2020255744A1 JPWO2020255744A1 JP2021527586A JP2021527586A JPWO2020255744A1 JP WO2020255744 A1 JPWO2020255744 A1 JP WO2020255744A1 JP 2021527586 A JP2021527586 A JP 2021527586A JP 2021527586 A JP2021527586 A JP 2021527586A JP WO2020255744 A1 JPWO2020255744 A1 JP WO2020255744A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019114147 | 2019-06-19 | ||
PCT/JP2020/022213 WO2020255744A1 (ja) | 2019-06-19 | 2020-06-04 | 研磨パッド、研磨パッドの製造方法及び研磨方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPWO2020255744A1 true JPWO2020255744A1 (ja) | 2020-12-24 |
Family
ID=74040037
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2021527586A Pending JPWO2020255744A1 (ja) | 2019-06-19 | 2020-06-04 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20220226962A1 (ja) |
JP (1) | JPWO2020255744A1 (ja) |
CN (1) | CN114286737A (ja) |
TW (1) | TWI813885B (ja) |
WO (1) | WO2020255744A1 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20230021149A1 (en) * | 2021-07-16 | 2023-01-19 | Taiwan Semiconductor Manufacturing Company, Ltd. | Chemical-mechanical planarization pad and methods of use |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6458475A (en) * | 1987-08-25 | 1989-03-06 | Rodeele Nitta Kk | Grinding pad |
JPH01140959A (ja) * | 1987-11-24 | 1989-06-02 | Sumitomo Electric Ind Ltd | 非接触研磨装置の錫定盤 |
JPH01210259A (ja) * | 1988-02-16 | 1989-08-23 | Toshiba Corp | 研磨装置 |
US5216843A (en) * | 1992-09-24 | 1993-06-08 | Intel Corporation | Polishing pad conditioning apparatus for wafer planarization process |
US5441598A (en) * | 1993-12-16 | 1995-08-15 | Motorola, Inc. | Polishing pad for chemical-mechanical polishing of a semiconductor substrate |
US5489233A (en) * | 1994-04-08 | 1996-02-06 | Rodel, Inc. | Polishing pads and methods for their use |
KR20000025003A (ko) * | 1998-10-07 | 2000-05-06 | 윤종용 | 반도체 기판의 화학 기계적 연마에 사용되는 연마 패드 |
US6656019B1 (en) * | 2000-06-29 | 2003-12-02 | International Business Machines Corporation | Grooved polishing pads and methods of use |
JP4756583B2 (ja) * | 2005-08-30 | 2011-08-24 | 株式会社東京精密 | 研磨パッド、パッドドレッシング評価方法、及び研磨装置 |
US7226345B1 (en) * | 2005-12-09 | 2007-06-05 | The Regents Of The University Of California | CMP pad with designed surface features |
US7357703B2 (en) * | 2005-12-28 | 2008-04-15 | Jsr Corporation | Chemical mechanical polishing pad and chemical mechanical polishing method |
TWI409136B (zh) * | 2006-07-19 | 2013-09-21 | Innopad Inc | 表面具微溝槽之化學機械平坦化墊 |
US7544115B2 (en) * | 2007-09-20 | 2009-06-09 | Novellus Systems, Inc. | Chemical mechanical polishing assembly with altered polishing pad topographical components |
EP2083027B8 (en) * | 2008-01-24 | 2012-05-16 | JSR Corporation | Mechanical polishing pad and chemical mechanical polishing method |
TWM352126U (en) * | 2008-10-23 | 2009-03-01 | Bestac Advanced Material Co Ltd | Polishing pad |
KR101232787B1 (ko) * | 2010-08-18 | 2013-02-13 | 주식회사 엘지화학 | 연마 시스템용 연마 패드 |
US20140342646A1 (en) * | 2011-09-16 | 2014-11-20 | Toray Industries, Inc. | Polishing pad |
JP6228546B2 (ja) * | 2012-09-28 | 2017-11-08 | 富士紡ホールディングス株式会社 | 研磨パッド |
US10071461B2 (en) * | 2014-04-03 | 2018-09-11 | 3M Innovative Properties Company | Polishing pads and systems and methods of making and using the same |
JP6002343B1 (ja) * | 2016-03-25 | 2016-10-05 | 富士紡ホールディングス株式会社 | 研磨ブラシ |
-
2020
- 2020-06-04 JP JP2021527586A patent/JPWO2020255744A1/ja active Pending
- 2020-06-04 CN CN202080039388.XA patent/CN114286737A/zh active Pending
- 2020-06-04 US US17/617,118 patent/US20220226962A1/en active Pending
- 2020-06-04 WO PCT/JP2020/022213 patent/WO2020255744A1/ja active Application Filing
- 2020-06-17 TW TW109120340A patent/TWI813885B/zh active
Also Published As
Publication number | Publication date |
---|---|
KR20210149837A (ko) | 2021-12-09 |
WO2020255744A1 (ja) | 2020-12-24 |
US20220226962A1 (en) | 2022-07-21 |
CN114286737A (zh) | 2022-04-05 |
TW202114816A (zh) | 2021-04-16 |
TWI813885B (zh) | 2023-09-01 |
Similar Documents
Legal Events
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