JP2017509768A - ダイシングフィルム粘着層形成用組成物およびダイシングフィルム - Google Patents
ダイシングフィルム粘着層形成用組成物およびダイシングフィルム Download PDFInfo
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- JP2017509768A JP2017509768A JP2016560325A JP2016560325A JP2017509768A JP 2017509768 A JP2017509768 A JP 2017509768A JP 2016560325 A JP2016560325 A JP 2016560325A JP 2016560325 A JP2016560325 A JP 2016560325A JP 2017509768 A JP2017509768 A JP 2017509768A
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/541—Silicon-containing compounds containing oxygen
- C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
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- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
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- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
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Abstract
Description
光硬化型粘着バインダー樹脂100重量部対比、イソシアネート系硬化剤(多官能イソシアネートオリゴマー)2重量部、BYK−Silclean3700(BYK社)0.2重量部、および光開始剤としてダロカーTPO1重量部を混合して、UV硬化型粘着組成物を製造した。前記光硬化型粘着バインダー樹脂としては、アクリル系ベース樹脂の主鎖に、アクリレート官能基を側鎖として20wt%付加した高分子樹脂(Mw300,000)を使用した。
光硬化型粘着バインダー樹脂100重量部対比、イソシアネート系硬化剤(多官能イソシアネートオリゴマー)2重量部、BYK−Silclean394(BYK社)0.2重量部、および光開始剤としてダロカーTPO1重量部を混合して、UV硬化型粘着組成物を製造した。前記光硬化型粘着バインダー樹脂としては、アクリル系ベース樹脂の主鎖に、アクリレート官能基を側鎖として20wt%付加した高分子樹脂(Mw300,000)を使用した。
光硬化型粘着バインダー樹脂100重量部対比、イソシアネート系硬化剤(多官能イソシアネートオリゴマー)2重量部、および光開始剤としてダロカーTPO1重量部を混合して、UV硬化型粘着組成物を製造した。前記光硬化型粘着バインダー樹脂としては、アクリル系ベース樹脂の主鎖に、アクリレート官能基を側鎖として20wt%付加した高分子樹脂(Mw300,000)を使用した。
光硬化型粘着バインダー樹脂100重量部対比、イソシアネート系硬化剤(多官能イソシアネートオリゴマー)2重量部、BYK−Silclean3700(BYK社)5重量部、および光開始剤としてダロカーTPO1重量部を混合して、UV硬化型粘着組成物を製造した。前記光硬化型粘着バインダー樹脂としては、アクリル系ベース樹脂の主鎖に、アクリレート官能基を側鎖として20wt%付加した高分子樹脂(Mw300,000)を使用した。
光硬化型粘着バインダー樹脂100重量部対比、イソシアネート系硬化剤(多官能イソシアネートオリゴマー)2重量部、シリコン化合物オイルL−7500(Silwet社)0.5重量部、および光開始剤としてダロカーTPO1重量部を混合して、UV硬化型粘着組成物を製造した。前記光硬化型粘着バインダー樹脂としては、アクリル系ベース樹脂の主鎖に、アクリレート官能基を側鎖として20wt%付加した高分子樹脂(Mw300,000)を使用した。
前記実施例1〜2および比較例1〜3により製造されたダイシングフィルムの剥離力、タック試験、およびピックアップ成功率を下記のように測定し、結果を下記表1および2に示した。
ダイボンディングフィルムとPSA層との間の剥離力測定のために、接着フィルムを常温でダイシングフィルムと貼り合わせた後、1時間放置し、その後、幅25mmのサンプルを作製して、300mm/minの速度で180度ピール強度を測定し、追加的にUV照射後の値も測定した。前記測定は1サンプルあたり3回以上行って、その平均値を記載した。
25mm幅のダイシングフィルムを準備して、SUS304を被着体にして付着させた。付着して1時間硬化後に、300mm/minの速度で90度ピール強度を測定した。前記測定は1サンプルあたり3回以上行って、その平均値を記載した。
プレート上にダイシングフィルムの粘着層を上に向かせて載せ、直径1インチのボールタイプのプローブ(probe)を用いてタック強度を測定した。この時、プローブに印加される力は800gf、接触時間は0.01秒、プローブを引き離す測定速度は1mm/sであり、測定に使用された機器はTexture Analyzerであった。
前記実施例および比較例により製造されたダイシングフィルムから製造されたダイシングダイボンディングフィルムおよびウエハを70℃の条件でラミネーションさせた。次に、ダイシング装備(NEON社製造)を用いて下記条件でダイシング工程を行った後、ダイシングフィルム面に下記条件で紫外線照射を行った。その後、各チップをダイボンダ(Shinkawa社)で200個ピックアップし、ピックアップされなかった個数を測定してパーセントで表記した。
ブレード:27HEDD
ブレード回転速度:40,000rpm
速度:30mm/s
チップサイズ:10mmx10mm
cut depth:70um
[紫外線照射条件]
ランプ:metal halide type
照度:70mW/cm2(照度測定:UV meter)
照射量:200mJ/cm2以上(照射量測定:UV meter)
[ピックアップ条件]
エキスパンディング:4mm
ピン高さ:0.15mm
ピックアップ強度:100gf
5.ダイシェア強度(Die Shear Strength)
二酸化膜でコーティングされた厚さ500umのウエハを用いて5mmx5mmの大きさに切断した後、ダイシングダイボンディングフィルムと共に60℃の条件でラミネーションし、UVを照射してダイシングフィルムを除去後、チップサイズの接着フィルムだけを残して切断した。10mmx10mmの大きさの下部チップに5mmx5mmの大きさの上部チップを載せた後、130℃のホットプレート上で2kgfの力で2秒間押して付着させた後、125℃で1時間硬化した。このように作製された試験片を175℃で2時間硬化後、250度で上部チップのダイシェア強度を測定した。
Claims (18)
- (メタ)アクリレート系官能基および非極性官能基を含む高分子、フッ素を1以上含む(メタ)アクリレート系高分子、および反応性官能基を含むシリコン変性(メタ)アクリレート系高分子からなる群より選択された1種以上の高分子を含む高分子添加剤と、
粘着バインダーと、
光開始剤とを含み、
前記粘着バインダー対比、前記高分子添加剤の重量比が0.01%〜4.5%である、ダイシングフィルム粘着層形成用組成物。 - 前記フッ素を1以上含む(メタ)アクリレート系高分子は、炭素数1〜10のパーフルオロアルキル基、または炭素数1〜10のフッ素化アルケニル基が置換された(メタ)アクリレート系高分子を含む、請求項1に記載のダイシングフィルム粘着層形成用組成物。
- 前記反応性官能基を含むシリコン変性(メタ)アクリレート系高分子は、ヒドロキシ基、炭素数1〜10のアルキレンアルコール、エポキシ、アミノ基、チオール基、またはカルボキシル基からなる群より選択された1種以上の反応性官能基が1以上置換されたシリコン変性(メタ)アクリレート系高分子を含む、請求項1に記載のダイシングフィルム粘着層形成用組成物。
- 前記高分子添加剤は、アルコール類、エーテル類、アセテート類、およびケトン類からなる群より選択された1種以上の有機溶媒をさらに含む、請求項1に記載のダイシングフィルム粘着層形成用組成物。
- 前記(メタ)アクリレート系官能基および非極性官能基を含む高分子、および前記反応性官能基を含むシリコン変性(メタ)アクリレート系高分子それぞれが、1重量%〜50重量%の有機溶液を基準として10mgKOH/g〜50mgKOH/gの酸価を有する、請求項5に記載のダイシングフィルム粘着層形成用組成物。
- 前記粘着バインダーは、ヒドロキシ基、イソシアネート基、ビニル基、および(メタ)アクリレート基からなる群より選択された1種以上の官能基が1以上置換もしくは非置換の(メタ)アクリレート系重合体または(メタ)アクリレート系共重合体を含む、請求項1に記載のダイシングフィルム粘着層形成用組成物。
- 前記粘着バインダーは、(メタ)アクリレート樹脂の側鎖に、炭素−炭素二重結合を有するアクリレートを付加させた内在型粘着バインダーを含む、請求項1に記載のダイシングフィルム粘着層形成用組成物。
- 前記粘着バインダーは、100,000〜1,500,000の重量平均分子量を有する高分子樹脂を含む、請求項1に記載のダイシングフィルム粘着層形成用組成物。
- 前記光開始剤は、ベンゾインとそのアルキルエーテル類、アセトフェノン類、アントラキノン類、チオキサントン類、ケタール類、ベンゾフェノン類、α−アミノアセトフェノン類、アシルホスフィンオキシド類、およびオキシムエステル類からなる群より選択された1種以上を含む、請求項1に記載のダイシングフィルム粘着層形成用組成物。
- 前記粘着バインダー100重量部対比、前記光開始剤0.01〜8重量部を含む、請求項1に記載のダイシングフィルム粘着層形成用組成物。
- 硬化剤をさらに含む、請求項1に記載のダイシングフィルム粘着層形成用組成物。
- 前記硬化剤は、イソシアネート系化合物、アジリジン系化合物、エポキシ系化合物、および金属キレート系化合物からなる群より選択された1種以上を含む、請求項12に記載のダイシングフィルム粘着層形成用組成物。
- 前記粘着バインダー100重量部対比、前記硬化剤0.1〜30重量部を含む、請求項12に記載のダイシングフィルム粘着層形成用組成物。
- 基材フィルムと、前記基材フィルムの少なくとも一面上に形成された粘着層とを含み、
前記粘着層は、請求項1に記載のダイシングフィルム粘着層形成用組成物を含む、ダイシングフィルム。 - 前記基材フィルムの厚さは、10μm〜200μmであり、
前記粘着層の厚さは、0.5μm〜50μmである、請求項15に記載のダイシングフィルム。 - 請求項15に記載のダイシングフィルムと、前記ダイシングフィルムの少なくとも一面に形成された接着層とを含む、ダイシングダイボンディングフィルム。
- 請求項17に記載のダイシングダイボンディングフィルムと、前記ダイシングダイボンディングフィルムの少なくとも一面に積層されたウエハとを含む半導体ウエハを完全分断または分断可能に部分処理する前処理段階と、
前記前処理段階の後、半導体ウエハをエキスパンディングする段階と、
前記エキスパンディングした半導体ウエハの基材フィルムに紫外線を照射し、前記半導体ウエハの分断によって分離された個別チップをピックアップする段階とを含む、半導体ウエハのダイシング方法。
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JP2010163518A (ja) * | 2009-01-14 | 2010-07-29 | Denki Kagaku Kogyo Kk | 粘着剤、粘着剤を用いた粘着シート、粘着シートを用いたガラス部品の製造方法 |
WO2011065252A1 (ja) * | 2009-11-30 | 2011-06-03 | 電気化学工業株式会社 | 粘着シート及び電子部品 |
JP2011210832A (ja) * | 2010-03-29 | 2011-10-20 | Hitachi Chem Co Ltd | 半導体装置の製造方法 |
JP2012039053A (ja) * | 2010-07-14 | 2012-02-23 | Denki Kagaku Kogyo Kk | 多層粘着シート及び電子部品の製造方法 |
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JP2012084758A (ja) * | 2010-10-14 | 2012-04-26 | Denki Kagaku Kogyo Kk | 電子部品の製造方法 |
JP2013170200A (ja) * | 2012-02-20 | 2013-09-02 | Emulsion Technology Co Ltd | 粘着剤組成物およびこれを用いた粘着シート |
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WO2019235487A1 (ja) * | 2018-06-05 | 2019-12-12 | 積水化学工業株式会社 | 粘着テープ |
JPWO2019235487A1 (ja) * | 2018-06-05 | 2021-04-30 | 積水化学工業株式会社 | 粘着テープ |
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WO2021065515A1 (ja) * | 2019-10-01 | 2021-04-08 | 積水化学工業株式会社 | 粘着テープ |
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JP6393779B2 (ja) | 2018-09-19 |
US20160040043A1 (en) | 2016-02-11 |
TWI534227B (zh) | 2016-05-21 |
US10526513B2 (en) | 2020-01-07 |
TW201529780A (zh) | 2015-08-01 |
CN105143382B (zh) | 2018-05-18 |
KR20150072343A (ko) | 2015-06-29 |
CN105143382A (zh) | 2015-12-09 |
KR101709689B1 (ko) | 2017-02-23 |
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