JP2017508647A5 - - Google Patents
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- JP2017508647A5 JP2017508647A5 JP2016565101A JP2016565101A JP2017508647A5 JP 2017508647 A5 JP2017508647 A5 JP 2017508647A5 JP 2016565101 A JP2016565101 A JP 2016565101A JP 2016565101 A JP2016565101 A JP 2016565101A JP 2017508647 A5 JP2017508647 A5 JP 2017508647A5
- Authority
- JP
- Japan
- Prior art keywords
- layer
- structured surface
- thermally stable
- sacrificial template
- item
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
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- 239000010410 layer Substances 0.000 claims description 111
- 239000002344 surface layer Substances 0.000 claims description 12
- 239000000758 substrate Substances 0.000 claims description 9
- 238000000034 method Methods 0.000 claims description 8
- 239000011800 void material Substances 0.000 claims description 6
- 238000010030 laminating Methods 0.000 claims description 4
- 230000015572 biosynthetic process Effects 0.000 claims description 2
- 239000000463 material Substances 0.000 description 3
- 230000006978 adaptation Effects 0.000 description 2
- 229920000058 polyacrylate Polymers 0.000 description 2
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052788 barium Inorganic materials 0.000 description 1
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 229910052735 hafnium Inorganic materials 0.000 description 1
- VBJZVLUMGGDVMO-UHFFFAOYSA-N hafnium atom Chemical compound [Hf] VBJZVLUMGGDVMO-UHFFFAOYSA-N 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 239000012702 metal oxide precursor Substances 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 229920001558 organosilicon polymer Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052712 strontium Inorganic materials 0.000 description 1
- CIOAGBVUUVVLOB-UHFFFAOYSA-N strontium atom Chemical compound [Sr] CIOAGBVUUVVLOB-UHFFFAOYSA-N 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US14/159,300 | 2014-01-20 | ||
| US14/159,300 US9246134B2 (en) | 2014-01-20 | 2014-01-20 | Lamination transfer films for forming articles with engineered voids |
| PCT/US2015/011375 WO2015108953A1 (en) | 2014-01-20 | 2015-01-14 | Lamination transfer films for forming articles with engineered voids |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2017508647A JP2017508647A (ja) | 2017-03-30 |
| JP2017508647A5 true JP2017508647A5 (OSRAM) | 2018-02-22 |
Family
ID=53543388
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016565101A Withdrawn JP2017508647A (ja) | 2014-01-20 | 2015-01-14 | 人工的な空隙を有する物品を形成するための積層転写フィルム |
Country Status (8)
| Country | Link |
|---|---|
| US (3) | US9246134B2 (OSRAM) |
| EP (1) | EP3097596A4 (OSRAM) |
| JP (1) | JP2017508647A (OSRAM) |
| KR (1) | KR102305074B1 (OSRAM) |
| CN (1) | CN105917485B (OSRAM) |
| SG (1) | SG11201605933YA (OSRAM) |
| TW (1) | TW201541678A (OSRAM) |
| WO (1) | WO2015108953A1 (OSRAM) |
Families Citing this family (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9780335B2 (en) | 2012-07-20 | 2017-10-03 | 3M Innovative Properties Company | Structured lamination transfer films and methods |
| US9711744B2 (en) | 2012-12-21 | 2017-07-18 | 3M Innovative Properties Company | Patterned structured transfer tape |
| US20140175707A1 (en) | 2012-12-21 | 2014-06-26 | 3M Innovative Properties Company | Methods of using nanostructured transfer tape and articles made therefrom |
| TWI632705B (zh) * | 2013-12-03 | 2018-08-11 | 皇家飛利浦有限公司 | 製造陶瓷透光屏障單元的方法、屏障單元、光源及照明器 |
| US9246134B2 (en) * | 2014-01-20 | 2016-01-26 | 3M Innovative Properties Company | Lamination transfer films for forming articles with engineered voids |
| EP3096945B1 (en) * | 2014-01-20 | 2019-08-14 | 3M Innovative Properties Company | Lamination transfer films for forming reentrant structures |
| JP2017508641A (ja) | 2014-01-22 | 2017-03-30 | スリーエム イノベイティブ プロパティズ カンパニー | グレイジング用微小光学体 |
| TW201539736A (zh) | 2014-03-19 | 2015-10-16 | 3M Innovative Properties Co | 用於藉白光成色之 oled 裝置的奈米結構 |
| EP2941980A1 (de) * | 2014-05-05 | 2015-11-11 | D. Swarovski KG | Verbundkörper aus Faserverbundwerkstoff und dekorativem Element |
| US9472788B2 (en) * | 2014-08-27 | 2016-10-18 | 3M Innovative Properties Company | Thermally-assisted self-assembly method of nanoparticles and nanowires within engineered periodic structures |
| US9586385B2 (en) * | 2014-08-27 | 2017-03-07 | 3M Innovative Properties Company | Inorganic multilayer lamination transfer films |
| EP3209841B1 (en) | 2014-10-20 | 2021-04-07 | 3M Innovative Properties Company | Insulated glazing units and microoptical layer comprising microstructured diffuser and methods |
| US10569496B2 (en) * | 2015-03-02 | 2020-02-25 | Panasonic Intellectual Property Management Co., Ltd. | Transfer film and method for manufacturing transfer film |
| US10518512B2 (en) | 2015-03-31 | 2019-12-31 | 3M Innovative Properties Company | Method of forming dual-cure nanostructure transfer film |
| US10106643B2 (en) | 2015-03-31 | 2018-10-23 | 3M Innovative Properties Company | Dual-cure nanostructure transfer film |
| WO2017056055A1 (en) * | 2015-10-01 | 2017-04-06 | Idemitsu Kosan Co., Ltd. | Benzimidazolo[1,2-a]benzimidazole carrying triazine groups for organic light emitting diodes |
| DE102015015452A1 (de) | 2015-12-02 | 2017-06-08 | Forschungszentrum Jülich GmbH | Verfahren zum Planarisieren von Nanostrukturen |
| KR20180089538A (ko) | 2015-12-28 | 2018-08-08 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 미세구조화 층을 갖는 물품 |
| KR20180089541A (ko) | 2015-12-28 | 2018-08-08 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 미세구조화 층을 갖는 물품 |
| JP2018067414A (ja) * | 2016-10-18 | 2018-04-26 | ＯＬＥＤ Ｍａｔｅｒｉａｌ Ｓｏｌｕｔｉｏｎｓ株式会社 | 電子デバイス用基板のマザー基板 |
| KR102355529B1 (ko) * | 2017-08-07 | 2022-01-26 | 삼성디스플레이 주식회사 | 유기 전계 발광 표시 장치 |
| KR102538050B1 (ko) | 2018-06-06 | 2023-05-30 | 코닝 인코포레이티드 | 광 추출 장치 및 oled 디스플레이 |
| US12161013B2 (en) | 2019-09-18 | 2024-12-03 | 3M Innovative Properties Company | Articles including nanostructured surfaces and enclosed voids, and methods of making same |
| EP4090636A1 (en) | 2020-01-17 | 2022-11-23 | Corning Incorporated | Reduced coating diameter chlorine-doped silica optical fibers with low loss and microbend sensitivity |
| WO2022039971A1 (en) * | 2020-08-20 | 2022-02-24 | Applied Materials, Inc. | Oled light field architectures |
| CN115956405A (zh) * | 2020-08-28 | 2023-04-11 | 3M创新有限公司 | 包括纳米结构化表面和封闭空隙的制品、其制备方法和光学元件 |
| CN117677999A (zh) * | 2022-05-30 | 2024-03-08 | 京东方科技集团股份有限公司 | 显示面板及其制作方法 |
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| JP3444053B2 (ja) | 1995-10-13 | 2003-09-08 | ソニー株式会社 | 薄膜半導体装置 |
| EP0945254B1 (en) | 1998-03-17 | 2004-12-22 | Chi Mei Optoelectronics Corporation | Material comprising an anti-reflective coating on a flexible glass substrate |
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| US6376590B2 (en) | 1999-10-28 | 2002-04-23 | 3M Innovative Properties Company | Zirconia sol, process of making and composite material |
| US6521324B1 (en) * | 1999-11-30 | 2003-02-18 | 3M Innovative Properties Company | Thermal transfer of microstructured layers |
| DE10034737C2 (de) * | 2000-07-17 | 2002-07-11 | Fraunhofer Ges Forschung | Verfahren zur Herstellung einer permanenten Entformungsschicht durch Plasmapolymerisation auf der Oberfläche eines Formteilwerkzeugs, ein nach dem Verfahren herstellbares Formteilwerkzeug und dessen Verwendung |
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| MY128644A (en) | 2000-08-31 | 2007-02-28 | Georgia Tech Res Inst | Fabrication of semiconductor devices with air gaps for ultra low capacitance interconnections and methods of making same |
| JP2002093315A (ja) | 2000-09-14 | 2002-03-29 | Matsushita Electric Ind Co Ltd | プラズマディスプレイパネルのリブ形成方法と装置 |
| US6858253B2 (en) | 2001-05-31 | 2005-02-22 | 3M Innovative Properties Company | Method of making dimensionally stable composite article |
| US6849558B2 (en) * | 2002-05-22 | 2005-02-01 | The Board Of Trustees Of The Leland Stanford Junior University | Replication and transfer of microstructures and nanostructures |
| JP4574145B2 (ja) | 2002-09-13 | 2010-11-04 | ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． | エアギャップ形成 |
| US7294934B2 (en) | 2002-11-21 | 2007-11-13 | Intel Corporation | Low-K dielectric structure and method |
| KR100563059B1 (ko) | 2003-11-28 | 2006-03-24 | 삼성에스디아이 주식회사 | 유기 전계 발광 디스플레이 장치 및 이의 제조에 사용되는레이저 열전사용 도너 필름 |
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| DE102005017170B4 (de) * | 2005-04-13 | 2010-07-01 | Ovd Kinegram Ag | Transferfolie, Verfahren zu deren Herstellung sowie Mehrschichtkörper und dessen Verwendung |
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| AU2006282042B2 (en) | 2005-06-17 | 2011-12-22 | The University Of North Carolina At Chapel Hill | Nanoparticle fabrication methods, systems, and materials |
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| US8268067B2 (en) | 2009-10-06 | 2012-09-18 | 3M Innovative Properties Company | Perfluoropolyether coating composition for hard surfaces |
| WO2011088161A1 (en) * | 2010-01-13 | 2011-07-21 | 3M Innovative Properties Company | Optical films with microstructured low refractive index nanovoided layers and methods therefor |
| WO2011155582A1 (ja) | 2010-06-11 | 2011-12-15 | 株式会社日立ハイテクノロジーズ | 微細構造転写用スタンパ及び微細構造転写装置 |
| WO2012007575A1 (en) | 2010-07-16 | 2012-01-19 | Agc Glass Europe | Transluscent conductive substrate for organic light emitting devices |
| US8469551B2 (en) * | 2010-10-20 | 2013-06-25 | 3M Innovative Properties Company | Light extraction films for increasing pixelated OLED output with reduced blur |
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| MY164197A (en) | 2010-12-09 | 2017-11-30 | Asahi Kasei E Materials Corp | Fine-structure laminate, method for preparing fine-structure laminate, and production method for fine-structure laminate |
| KR20130133820A (ko) * | 2010-12-28 | 2013-12-09 | 우베 고산 가부시키가이샤 | 다결정 실리콘 잉곳 주조용 주형 및 그 제조 방법, 그리고 다결정 실리콘 잉곳 주조용 주형의 이형재용 질화규소 분말 및 그것을 함유한 슬러리 |
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| KR101931336B1 (ko) | 2012-04-16 | 2018-12-20 | 엘지디스플레이 주식회사 | 평판 표시장치의 보호필름 부착용 전사필름 및 전사필름을 이용한 평판 표시장치의 제조 방법 |
| US9780335B2 (en) | 2012-07-20 | 2017-10-03 | 3M Innovative Properties Company | Structured lamination transfer films and methods |
| TWI485452B (zh) * | 2012-10-31 | 2015-05-21 | Compal Electronics Inc | 複合導光板的製造方法 |
| TWI489179B (zh) * | 2012-12-14 | 2015-06-21 | Wistron Corp | 製造導光板的方法、治具以及相關的導光板 |
| US20140175707A1 (en) | 2012-12-21 | 2014-06-26 | 3M Innovative Properties Company | Methods of using nanostructured transfer tape and articles made therefrom |
| US9711744B2 (en) * | 2012-12-21 | 2017-07-18 | 3M Innovative Properties Company | Patterned structured transfer tape |
| US20140242343A1 (en) * | 2013-02-27 | 2014-08-28 | 3M Innovative Properties Company | Lamination transfer films for forming embedded nanostructures |
| US9246134B2 (en) * | 2014-01-20 | 2016-01-26 | 3M Innovative Properties Company | Lamination transfer films for forming articles with engineered voids |
-
2014
- 2014-01-20 US US14/159,300 patent/US9246134B2/en active Active
-
2015
- 2015-01-14 JP JP2016565101A patent/JP2017508647A/ja not_active Withdrawn
- 2015-01-14 EP EP15737078.4A patent/EP3097596A4/en not_active Withdrawn
- 2015-01-14 WO PCT/US2015/011375 patent/WO2015108953A1/en not_active Ceased
- 2015-01-14 KR KR1020167022386A patent/KR102305074B1/ko active Active
- 2015-01-14 CN CN201580004794.1A patent/CN105917485B/zh not_active Expired - Fee Related
- 2015-01-14 SG SG11201605933YA patent/SG11201605933YA/en unknown
- 2015-01-19 TW TW104101712A patent/TW201541678A/zh unknown
- 2015-12-04 US US14/959,770 patent/US9419250B2/en active Active
-
2016
- 2016-07-11 US US15/206,757 patent/US9731473B2/en active Active
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