JP2017506003A5 - - Google Patents

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Publication number
JP2017506003A5
JP2017506003A5 JP2016564436A JP2016564436A JP2017506003A5 JP 2017506003 A5 JP2017506003 A5 JP 2017506003A5 JP 2016564436 A JP2016564436 A JP 2016564436A JP 2016564436 A JP2016564436 A JP 2016564436A JP 2017506003 A5 JP2017506003 A5 JP 2017506003A5
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JP
Japan
Prior art keywords
light emitting
emitting elements
optical module
encapsulant
module according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2016564436A
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English (en)
Japanese (ja)
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JP2017506003A (ja
JP6641291B2 (ja
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Priority claimed from PCT/IB2014/064070 external-priority patent/WO2015110875A1/en
Publication of JP2017506003A publication Critical patent/JP2017506003A/ja
Publication of JP2017506003A5 publication Critical patent/JP2017506003A5/ja
Priority to JP2019237634A priority Critical patent/JP6898422B2/ja
Application granted granted Critical
Publication of JP6641291B2 publication Critical patent/JP6641291B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2016564436A 2014-01-21 2014-08-26 パターン付けされた封止材を伴うハイブリッドチップオンボードｌｅｄモジュール Active JP6641291B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2019237634A JP6898422B2 (ja) 2014-01-21 2019-12-27 パターン付けされた封止材を伴うハイブリッドチップオンボードｌｅｄモジュール

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201461929530P 2014-01-21 2014-01-21
US61/929,530 2014-01-21
PCT/IB2014/064070 WO2015110875A1 (en) 2014-01-21 2014-08-26 Hybrid chip-on-board led module with patterned encapsulation

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2019237634A Division JP6898422B2 (ja) 2014-01-21 2019-12-27 パターン付けされた封止材を伴うハイブリッドチップオンボードｌｅｄモジュール

Publications (3)

Publication Number Publication Date
JP2017506003A JP2017506003A (ja) 2017-02-23
JP2017506003A5 true JP2017506003A5 (enExample) 2017-10-05
JP6641291B2 JP6641291B2 (ja) 2020-02-05

Family

ID=51743498

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2016564436A Active JP6641291B2 (ja) 2014-01-21 2014-08-26 パターン付けされた封止材を伴うハイブリッドチップオンボードｌｅｄモジュール
JP2019237634A Active JP6898422B2 (ja) 2014-01-21 2019-12-27 パターン付けされた封止材を伴うハイブリッドチップオンボードｌｅｄモジュール

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2019237634A Active JP6898422B2 (ja) 2014-01-21 2019-12-27 パターン付けされた封止材を伴うハイブリッドチップオンボードｌｅｄモジュール

Country Status (7)

Country Link
US (3) US9905737B2 (enExample)
EP (1) EP3097588B1 (enExample)
JP (2) JP6641291B2 (enExample)
KR (1) KR102265771B1 (enExample)
CN (1) CN105917466B (enExample)
TW (1) TWI656664B (enExample)
WO (1) WO2015110875A1 (enExample)

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DE102015207934B4 (de) * 2015-04-29 2025-05-08 Tridonic Gmbh & Co Kg LED-Modul zur Abgabe von Mischlicht, Leuchtvorrichtung umfassend ein solches LED-Modul und Verfahren zur Herstellung eines LED-Moduls zur Abgabe von Mischlicht
US11638382B2 (en) 2016-12-09 2023-04-25 Lg Chem, Ltd. Method for preparing organic electronic device
US20230166894A1 (en) 2020-03-31 2023-06-01 Dai Nippon Printing Co., Ltd. Laminate and packaging container including laminate
EP3944313A1 (en) * 2020-07-20 2022-01-26 Lumileds LLC Light source, signal lamp comprising the light source and method for manufacturing the light source
WO2021231932A1 (en) 2020-05-15 2021-11-18 Lumileds Llc Multi-color light source and methods of manufacture
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EP4322217A3 (en) * 2022-08-11 2024-02-28 Ningbo Sunpu Led Co., Ltd. Led human centric lighting device and method for manufacturing same
TWI838209B (zh) * 2023-04-10 2024-04-01 友達光電股份有限公司 發光裝置

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