KR102265771B1 - 패터닝된 캡슐화를 가지는 하이브리드 칩-온-보드 led 모듈 - Google Patents

패터닝된 캡슐화를 가지는 하이브리드 칩-온-보드 led 모듈 Download PDF

Info

Publication number
KR102265771B1
KR102265771B1 KR1020167022768A KR20167022768A KR102265771B1 KR 102265771 B1 KR102265771 B1 KR 102265771B1 KR 1020167022768 A KR1020167022768 A KR 1020167022768A KR 20167022768 A KR20167022768 A KR 20167022768A KR 102265771 B1 KR102265771 B1 KR 102265771B1
Authority
KR
South Korea
Prior art keywords
light emitting
emitting elements
light
row
over
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020167022768A
Other languages
English (en)
Korean (ko)
Other versions
KR20160111980A (ko
Inventor
와우터 안톤 소어
레네 헬빙
구안 후앙
Original Assignee
루미리즈 홀딩 비.브이.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 루미리즈 홀딩 비.브이. filed Critical 루미리즈 홀딩 비.브이.
Publication of KR20160111980A publication Critical patent/KR20160111980A/ko
Application granted granted Critical
Publication of KR102265771B1 publication Critical patent/KR102265771B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B47/00—Circuit arrangements for operating light sources in general, i.e. where the type of light source is not relevant
    • H05B47/10—Controlling the light source
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
    • H01L25/0753—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00 the devices being arranged next to each other
    • H01L33/50—
    • H01L33/52—
    • H01L33/54—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/10—Controlling the intensity of the light
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0361—Manufacture or treatment of packages of wavelength conversion means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8516—Wavelength conversion means having a non-uniform spatial arrangement or non-uniform concentration, e.g. patterned wavelength conversion layer or wavelength conversion layer with a concentration gradient
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/853—Encapsulations characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/882—Scattering means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • F21Y2105/14—Planar light sources comprising a two-dimensional array of point-like light-generating elements characterised by the overall shape of the two-dimensional array
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H01L2933/0041—
    • H01L2933/0091—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0362—Manufacture or treatment of packages of encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8511—Wavelength conversion means characterised by their material, e.g. binder
    • H10H20/8512—Wavelength conversion materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Led Device Packages (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Optical Filters (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Planar Illumination Modules (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Led Devices (AREA)
KR1020167022768A 2014-01-21 2014-08-26 패터닝된 캡슐화를 가지는 하이브리드 칩-온-보드 led 모듈 Active KR102265771B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201461929530P 2014-01-21 2014-01-21
US61/929,530 2014-01-21
PCT/IB2014/064070 WO2015110875A1 (en) 2014-01-21 2014-08-26 Hybrid chip-on-board led module with patterned encapsulation

Publications (2)

Publication Number Publication Date
KR20160111980A KR20160111980A (ko) 2016-09-27
KR102265771B1 true KR102265771B1 (ko) 2021-06-16

Family

ID=51743498

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020167022768A Active KR102265771B1 (ko) 2014-01-21 2014-08-26 패터닝된 캡슐화를 가지는 하이브리드 칩-온-보드 led 모듈

Country Status (7)

Country Link
US (3) US9905737B2 (enExample)
EP (1) EP3097588B1 (enExample)
JP (2) JP6641291B2 (enExample)
KR (1) KR102265771B1 (enExample)
CN (1) CN105917466B (enExample)
TW (1) TWI656664B (enExample)
WO (1) WO2015110875A1 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102265771B1 (ko) * 2014-01-21 2021-06-16 루미리즈 홀딩 비.브이. 패터닝된 캡슐화를 가지는 하이브리드 칩-온-보드 led 모듈
DE102015207934B4 (de) * 2015-04-29 2025-05-08 Tridonic Gmbh & Co Kg LED-Modul zur Abgabe von Mischlicht, Leuchtvorrichtung umfassend ein solches LED-Modul und Verfahren zur Herstellung eines LED-Moduls zur Abgabe von Mischlicht
US11638382B2 (en) 2016-12-09 2023-04-25 Lg Chem, Ltd. Method for preparing organic electronic device
US20230166894A1 (en) 2020-03-31 2023-06-01 Dai Nippon Printing Co., Ltd. Laminate and packaging container including laminate
EP3944313A1 (en) * 2020-07-20 2022-01-26 Lumileds LLC Light source, signal lamp comprising the light source and method for manufacturing the light source
WO2021231932A1 (en) 2020-05-15 2021-11-18 Lumileds Llc Multi-color light source and methods of manufacture
TWI801756B (zh) * 2020-09-24 2023-05-11 晶元光電股份有限公司 發光模組與由發光模組拼接而成的發光裝置
EP4322217A3 (en) * 2022-08-11 2024-02-28 Ningbo Sunpu Led Co., Ltd. Led human centric lighting device and method for manufacturing same
TWI838209B (zh) * 2023-04-10 2024-04-01 友達光電股份有限公司 發光裝置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101168318B1 (ko) * 2011-12-23 2012-07-25 삼성전자주식회사 발광장치 제조방법 및 형광막 측정장치
JP2012142430A (ja) * 2010-12-28 2012-07-26 Nichia Chem Ind Ltd 発光装置の製造方法及び発光装置
US20130265757A1 (en) * 2012-04-06 2013-10-10 Panasonic Corporation Light-emitting device
JP2015082550A (ja) * 2013-10-22 2015-04-27 パナソニックＩｐマネジメント株式会社 発光モジュール、照明装置および照明器具

Family Cites Families (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6773139B2 (en) * 2001-09-17 2004-08-10 Gelcore Llp Variable optics spot module
JP2005005482A (ja) * 2003-06-12 2005-01-06 Citizen Electronics Co Ltd Ｌｅｄ発光装置及びそれを用いたカラー表示装置
JP2005259847A (ja) * 2004-03-10 2005-09-22 Nitto Denko Corp 光半導体装置の製造方法
US7344952B2 (en) 2005-10-28 2008-03-18 Philips Lumileds Lighting Company, Llc Laminating encapsulant film containing phosphor over LEDs
KR20080070770A (ko) * 2005-11-24 2008-07-30 코닌클리즈케 필립스 일렉트로닉스 엔.브이. 발광 다이오드 구조물과 이의 컬러 온도 출력값 조정 방법및 조정 수단
KR100728134B1 (ko) * 2005-12-30 2007-06-13 김재조 발광 장치
US7777412B2 (en) * 2007-03-22 2010-08-17 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Phosphor converted LED with improved uniformity and having lower phosphor requirements
US8058088B2 (en) * 2008-01-15 2011-11-15 Cree, Inc. Phosphor coating systems and methods for light emitting structures and packaged light emitting diodes including phosphor coating
JP5056520B2 (ja) * 2008-03-21 2012-10-24 東芝ライテック株式会社 照明装置
JP5342867B2 (ja) * 2008-12-19 2013-11-13 スタンレー電気株式会社 半導体発光装置及び駆動方法
TW201036198A (en) * 2009-03-20 2010-10-01 Foxconn Tech Co Ltd Led
US8415692B2 (en) * 2009-07-06 2013-04-09 Cree, Inc. LED packages with scattering particle regions
US8716952B2 (en) * 2009-08-04 2014-05-06 Cree, Inc. Lighting device having first, second and third groups of solid state light emitters, and lighting arrangement
TWM388109U (en) * 2009-10-15 2010-09-01 Intematix Tech Center Corp Light emitting diode apparatus
JP5310536B2 (ja) * 2009-12-25 2013-10-09 豊田合成株式会社 発光装置の製造方法
US8783915B2 (en) * 2010-02-11 2014-07-22 Bridgelux, Inc. Surface-textured encapsulations for use with light emitting diodes
JP2011192703A (ja) * 2010-03-12 2011-09-29 Toshiba Lighting & Technology Corp 発光装置及び照明装置
CN102192424B (zh) * 2010-03-12 2015-08-26 东芝照明技术株式会社 发光装置以及照明装置
US8820950B2 (en) * 2010-03-12 2014-09-02 Toshiba Lighting & Technology Corporation Light emitting device and illumination apparatus
TWI412685B (zh) * 2010-05-24 2013-10-21 台達電子工業股份有限公司 提高輸出色彩演色性之單一封裝發光二極體光源
US20120155076A1 (en) * 2010-06-24 2012-06-21 Intematix Corporation Led-based light emitting systems and devices
US8436549B2 (en) * 2010-08-13 2013-05-07 Bridgelux, Inc. Drive circuit for a color temperature tunable LED light source
US9373606B2 (en) 2010-08-30 2016-06-21 Bridgelux, Inc. Light-emitting device array with individual cells
JP2012109397A (ja) * 2010-11-17 2012-06-07 Panasonic Corp 発光装置
US9000470B2 (en) * 2010-11-22 2015-04-07 Cree, Inc. Light emitter devices
JP3168550U (ja) * 2011-04-05 2011-06-16 柏友照明科技股▲分▼有限公司 光混合式マルチチップパッケージ構造
CN103636010A (zh) * 2011-04-11 2014-03-12 克利公司 包括绿移红色组件的固态照明设备
US8449129B2 (en) * 2011-08-02 2013-05-28 Xicato, Inc. LED-based illumination device with color converting surfaces
JP5810758B2 (ja) * 2011-08-31 2015-11-11 日亜化学工業株式会社 発光装置
TWM422032U (en) * 2011-10-11 2012-02-01 Paragon Sc Lighting Tech Co LED lamp module
JP5407007B2 (ja) 2011-11-29 2014-02-05 シャープ株式会社 発光デバイスの製造方法
JP5895597B2 (ja) * 2012-02-29 2016-03-30 日亜化学工業株式会社 発光装置
TWI584671B (zh) * 2012-03-28 2017-05-21 艾笛森光電股份有限公司 燈具及其發光二極體模組
KR101538603B1 (ko) * 2012-08-13 2015-07-21 코니카 미놀타 가부시키가이샤 형광체 분산액의 제조 방법 및 led 장치의 제조 방법
US8870617B2 (en) * 2013-01-03 2014-10-28 Xicato, Inc. Color tuning of a multi-color LED based illumination device
KR102185099B1 (ko) * 2013-05-20 2020-12-02 루미리즈 홀딩 비.브이. 돔을 가진 칩 규모 발광 디바이스 패키지
US9589852B2 (en) * 2013-07-22 2017-03-07 Cree, Inc. Electrostatic phosphor coating systems and methods for light emitting structures and packaged light emitting diodes including phosphor coating
KR102265771B1 (ko) * 2014-01-21 2021-06-16 루미리즈 홀딩 비.브이. 패터닝된 캡슐화를 가지는 하이브리드 칩-온-보드 led 모듈

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012142430A (ja) * 2010-12-28 2012-07-26 Nichia Chem Ind Ltd 発光装置の製造方法及び発光装置
KR101168318B1 (ko) * 2011-12-23 2012-07-25 삼성전자주식회사 발광장치 제조방법 및 형광막 측정장치
US20130265757A1 (en) * 2012-04-06 2013-10-10 Panasonic Corporation Light-emitting device
JP2015082550A (ja) * 2013-10-22 2015-04-27 パナソニックＩｐマネジメント株式会社 発光モジュール、照明装置および照明器具

Also Published As

Publication number Publication date
WO2015110875A1 (en) 2015-07-30
CN105917466B (zh) 2021-06-15
US10490710B2 (en) 2019-11-26
US9905737B2 (en) 2018-02-27
US20160329472A1 (en) 2016-11-10
TWI656664B (zh) 2019-04-11
JP2020065071A (ja) 2020-04-23
JP6898422B2 (ja) 2021-07-07
US11075327B2 (en) 2021-07-27
EP3097588B1 (en) 2021-02-24
US20200127176A1 (en) 2020-04-23
JP2017506003A (ja) 2017-02-23
JP6641291B2 (ja) 2020-02-05
KR20160111980A (ko) 2016-09-27
US20180175256A1 (en) 2018-06-21
CN105917466A (zh) 2016-08-31
EP3097588A1 (en) 2016-11-30
TW201530828A (zh) 2015-08-01

Similar Documents

Publication Publication Date Title
KR102265771B1 (ko) 패터닝된 캡슐화를 가지는 하이브리드 칩-온-보드 led 모듈
JP5026404B2 (ja) Ｌｅｄパッケージ
JP5810758B2 (ja) 発光装置
US20100117106A1 (en) Led with light-conversion layer
JP2005260229A (ja) オーバーレイ付きｌｅｄ表示装置
JP6093127B2 (ja) 発光装置及びその製造方法
US10297584B2 (en) Chip on board LED device and method
JP5285435B2 (ja) 発光ダイオードモジュール
KR20110059788A (ko) 독립적으로 전기적으로 어드레스가능한 구획을 포함하는 발광 장치
JP6486099B2 (ja) Ｌｅｄ発光モジュール
KR101974348B1 (ko) 발광소자 패키지 및 그 제조방법
JP2014086694A (ja) 発光装置、及び発光装置の製造方法
US20130001597A1 (en) Lighting Device Having a Color Tunable Wavelength Converter
US11398458B2 (en) Multi-color phosphor converted LED package with single cavity
JP2019204812A (ja) 発光装置
KR20100051476A (ko) Ｌｅｄ 패키지
EP4073838B1 (en) Leds and multi-color phosphors
KR20120014285A (ko) Ｌｅｄ 패키지 및 그의 제조 방법
TW201308683A (zh) 發光二極體
KR20110108935A (ko) 발광장치 및 그 제조방법
TWM544123U (zh) 發光二極體封裝結構
CN103814449B (zh) 转换小板、具有这种转换小板的发射辐射的器件和用于制造这种转换小板的方法
JP2020177961A (ja) 発光装置

Legal Events

Date Code Title Description
PA0105 International application

Patent event date: 20160819

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application
PN2301 Change of applicant

Patent event date: 20180214

Comment text: Notification of Change of Applicant

Patent event code: PN23011R01D

PA0201 Request for examination

Patent event code: PA02012R01D

Patent event date: 20190307

Comment text: Request for Examination of Application

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

Comment text: Notification of reason for refusal

Patent event date: 20200610

Patent event code: PE09021S01D

PE0701 Decision of registration

Patent event code: PE07011S01D

Comment text: Decision to Grant Registration

Patent event date: 20210410

GRNT Written decision to grant
PR0701 Registration of establishment

Comment text: Registration of Establishment

Patent event date: 20210610

Patent event code: PR07011E01D

PR1002 Payment of registration fee

Payment date: 20210610

End annual number: 3

Start annual number: 1

PG1601 Publication of registration
PR1001 Payment of annual fee

Payment date: 20240528

Start annual number: 4

End annual number: 4