JP2017505464A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2017505464A5 JP2017505464A5 JP2016563899A JP2016563899A JP2017505464A5 JP 2017505464 A5 JP2017505464 A5 JP 2017505464A5 JP 2016563899 A JP2016563899 A JP 2016563899A JP 2016563899 A JP2016563899 A JP 2016563899A JP 2017505464 A5 JP2017505464 A5 JP 2017505464A5
- Authority
- JP
- Japan
- Prior art keywords
- atmosphere
- photosensitive
- photopolymer
- photopolymer film
- pspi
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 claims 12
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 claims 6
- 229920005575 poly(amic acid) Polymers 0.000 claims 6
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims 5
- 239000001301 oxygen Substances 0.000 claims 5
- 229910052760 oxygen Inorganic materials 0.000 claims 5
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims 4
- 229920002577 polybenzoxazole Polymers 0.000 claims 4
- 239000004642 Polyimide Substances 0.000 claims 3
- 238000000151 deposition Methods 0.000 claims 3
- 229920001721 polyimide Polymers 0.000 claims 3
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 claims 2
- 229910001882 dioxygen Inorganic materials 0.000 claims 2
- 150000002148 esters Chemical class 0.000 claims 2
- 238000010438 heat treatment Methods 0.000 claims 2
- 239000000203 mixture Substances 0.000 claims 2
- 239000002243 precursor Substances 0.000 claims 2
- 239000011347 resin Substances 0.000 claims 2
- 229920005989 resin Polymers 0.000 claims 2
- 239000000758 substrate Substances 0.000 claims 2
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020003625A JP7504595B2 (ja) | 2014-01-13 | 2020-01-14 | 感光性ポリイミドをマイクロ波処理する方法 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201461964748P | 2014-01-13 | 2014-01-13 | |
| US61/964,748 | 2014-01-13 | ||
| PCT/US2015/011107 WO2015106234A1 (en) | 2014-01-13 | 2015-01-13 | Method for microwave processing of photosensitive polyimides |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020003625A Division JP7504595B2 (ja) | 2014-01-13 | 2020-01-14 | 感光性ポリイミドをマイクロ波処理する方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2017505464A JP2017505464A (ja) | 2017-02-16 |
| JP2017505464A5 true JP2017505464A5 (enExample) | 2018-03-01 |
Family
ID=53521286
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016563899A Pending JP2017505464A (ja) | 2014-01-13 | 2015-01-13 | 感光性ポリイミドをマイクロ波処理する方法 |
| JP2020003625A Active JP7504595B2 (ja) | 2014-01-13 | 2020-01-14 | 感光性ポリイミドをマイクロ波処理する方法 |
| JP2022080732A Pending JP2022113685A (ja) | 2014-01-13 | 2022-05-17 | 感光性ポリイミドをマイクロ波処理する方法 |
Family Applications After (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020003625A Active JP7504595B2 (ja) | 2014-01-13 | 2020-01-14 | 感光性ポリイミドをマイクロ波処理する方法 |
| JP2022080732A Pending JP2022113685A (ja) | 2014-01-13 | 2022-05-17 | 感光性ポリイミドをマイクロ波処理する方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US9519221B2 (enExample) |
| JP (3) | JP2017505464A (enExample) |
| KR (1) | KR101842691B1 (enExample) |
| CN (2) | CN105940347B (enExample) |
| SG (2) | SG10201903646WA (enExample) |
| WO (1) | WO2015106234A1 (enExample) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9519221B2 (en) * | 2014-01-13 | 2016-12-13 | Applied Materials, Inc. | Method for microwave processing of photosensitive polyimides |
| JP2019118626A (ja) * | 2017-12-29 | 2019-07-22 | 株式会社三洋物産 | 遊技機 |
| JP2019122460A (ja) * | 2018-01-12 | 2019-07-25 | 株式会社三洋物産 | 遊技機 |
| JP2019136397A (ja) * | 2018-02-14 | 2019-08-22 | 株式会社三洋物産 | 遊技機 |
| JP2019136395A (ja) * | 2018-02-14 | 2019-08-22 | 株式会社三洋物産 | 遊技機 |
| JP2019136398A (ja) * | 2018-02-14 | 2019-08-22 | 株式会社三洋物産 | 遊技機 |
| JP2019136396A (ja) * | 2018-02-14 | 2019-08-22 | 株式会社三洋物産 | 遊技機 |
| JP2019136399A (ja) * | 2018-02-14 | 2019-08-22 | 株式会社三洋物産 | 遊技機 |
| JP2019136400A (ja) * | 2018-02-14 | 2019-08-22 | 株式会社三洋物産 | 遊技機 |
| JP2019136401A (ja) * | 2018-02-14 | 2019-08-22 | 株式会社三洋物産 | 遊技機 |
| CN108582606B (zh) * | 2018-04-13 | 2020-07-03 | 南京航空航天大学 | 大厚度复合材料微波固化工艺方法 |
| US12048948B2 (en) * | 2018-12-26 | 2024-07-30 | Applied Materials, Inc. | Methods for forming microwave tunable composited thin-film dielectric layer |
| CN114787240A (zh) * | 2019-10-04 | 2022-07-22 | 富士胶片电子材料美国有限公司 | 平坦化方法及组合物 |
Family Cites Families (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4093461A (en) * | 1975-07-18 | 1978-06-06 | Gaf Corporation | Positive working thermally stable photoresist composition, article and method of using |
| JP3031434B2 (ja) * | 1991-08-07 | 2000-04-10 | 旭化成工業株式会社 | ポリイミドのパターン形成方法 |
| JPH05119478A (ja) * | 1991-10-29 | 1993-05-18 | Asahi Chem Ind Co Ltd | ポリイミドパターンの製造方法 |
| JPH05224419A (ja) * | 1992-02-07 | 1993-09-03 | Asahi Chem Ind Co Ltd | ポリイミド微細パターンの形成方法 |
| US6159666A (en) * | 1998-01-14 | 2000-12-12 | Fijitsu Limited | Environmentally friendly removal of photoresists used in wet etchable polyimide processes |
| JP3844106B2 (ja) * | 1999-06-09 | 2006-11-08 | 住友ベークライト株式会社 | ポジ型感光性樹脂組成物の硬化方法及びその方法により製作された半導体装置 |
| US6342333B1 (en) * | 1999-09-23 | 2002-01-29 | Hitachi Chemical Dupont Microsystems, L.L.C. | Photosensitive resin composition, patterning method, and electronic components |
| JP4529566B2 (ja) * | 2004-07-13 | 2010-08-25 | 日立化成デュポンマイクロシステムズ株式会社 | マイクロ波硬化用ポジ型感光性樹脂組成物を用いたパターンの製造方法 |
| JP3995253B2 (ja) * | 2004-09-28 | 2007-10-24 | Ｔｄｋ株式会社 | 感光性ポリイミドパターンの形成方法及び該パターンを有する電子素子 |
| JP4618075B2 (ja) * | 2004-09-29 | 2011-01-26 | 日立化成デュポンマイクロシステムズ株式会社 | ネガ型感光性樹脂組成物及びパターン形成方法 |
| JP5099979B2 (ja) * | 2005-04-27 | 2012-12-19 | 日立化成デュポンマイクロシステムズ株式会社 | ネガ型感光性樹脂組成物、パターンの製造方法及び電子部品 |
| JP5137575B2 (ja) * | 2005-08-19 | 2013-02-06 | 旭化成イーマテリアルズ株式会社 | 積層体及びその製造方法 |
| JP5434588B2 (ja) * | 2007-03-12 | 2014-03-05 | 日立化成デュポンマイクロシステムズ株式会社 | 感光性樹脂組成物、該樹脂組成物を用いたパターン硬化膜の製造方法及び電子部品 |
| PT2221666E (pt) * | 2007-11-12 | 2013-10-31 | Hitachi Chemical Co Ltd | Composição de resina fotossensível de tipo positivo, método para a produção de um padrão de revestimento fotossensível e dispositivo semicondutor |
| GB0817563D0 (en) * | 2008-09-25 | 2008-11-05 | Membrane Extraction Tech Ltd | Membrane module |
| JP2012094600A (ja) * | 2010-10-25 | 2012-05-17 | Hitachi Kokusai Electric Inc | 基板処理装置および半導体装置の製造方法 |
| JP2012216715A (ja) * | 2011-04-01 | 2012-11-08 | Hitachi Kokusai Electric Inc | 基板処理装置および半導体装置の製造方法 |
| CN103502889B (zh) * | 2011-06-15 | 2017-07-21 | 日立化成杜邦微系统股份有限公司 | 感光性树脂组合物、使用了该树脂组合物的图案固化膜的制造方法以及电子部件 |
| JP5263424B2 (ja) * | 2012-04-05 | 2013-08-14 | 日立化成株式会社 | ポジ型感光性樹脂組成物、レジストパターンの製造方法及び電子デバイス |
| US9508616B2 (en) * | 2012-05-11 | 2016-11-29 | Applied Materials, Inc. | Method for lower thermal budget multiple cures in semiconductor packaging |
| TWI636075B (zh) * | 2013-05-17 | 2018-09-21 | 富士軟片電子材料美國股份有限公司 | 新穎聚合物及含有該聚合物之熱固性組成物 |
| US9519221B2 (en) * | 2014-01-13 | 2016-12-13 | Applied Materials, Inc. | Method for microwave processing of photosensitive polyimides |
-
2015
- 2015-01-12 US US14/544,482 patent/US9519221B2/en active Active
- 2015-01-13 JP JP2016563899A patent/JP2017505464A/ja active Pending
- 2015-01-13 WO PCT/US2015/011107 patent/WO2015106234A1/en not_active Ceased
- 2015-01-13 CN CN201580004321.1A patent/CN105940347B/zh active Active
- 2015-01-13 SG SG10201903646WA patent/SG10201903646WA/en unknown
- 2015-01-13 CN CN201911140691.4A patent/CN111013967A/zh active Pending
- 2015-01-13 SG SG11201604992QA patent/SG11201604992QA/en unknown
- 2015-01-13 KR KR1020167021874A patent/KR101842691B1/ko not_active Expired - Fee Related
-
2016
- 2016-12-12 US US15/375,773 patent/US10139728B2/en active Active
-
2020
- 2020-01-14 JP JP2020003625A patent/JP7504595B2/ja active Active
-
2022
- 2022-05-17 JP JP2022080732A patent/JP2022113685A/ja active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2020074023A5 (enExample) | ||
| TWI647532B (zh) | 光敏樹脂組成物 | |
| PH12018550034A1 (en) | Resin, composition, cured film, method for manufacturing cured film and semiconductor device | |
| EP3859447A4 (en) | LIGHT SENSITIVE RESIN COMPOSITION, HARDENED FILM, LAMINATE, METHOD FOR MANUFACTURING THE HARDENED FILM AND SEMICONDUCTIVE COMPONENT | |
| BR112012014900A2 (pt) | substrato baseado em processo de fabricação de aditivo | |
| JP2013529724A5 (enExample) | ||
| MY198993A (en) | Photosensitive resin composition and method for forming circuit pattern | |
| TW201612634A (en) | Photosensitive resin composition for touch panel, cured film using the same, and touch panel including such cured film as a component | |
| TWI456348B (zh) | 感光性導電膏及導電圖案的製造方法 | |
| JP2015108116A5 (enExample) | ||
| JP2013532222A5 (enExample) | ||
| PH12013500757A1 (en) | Photosensitive element, method for forming resist pattern, and method for producing printed circuit board | |
| JP6848973B2 (ja) | 感光性樹脂組成物、その硬化物、層間絶縁膜、表面保護膜及び電子部品 | |
| WO2014108546A3 (de) | Schichten oder dreidimensionale formkörper mit zwei bereichen unterschiedlicher primär- und/oder sekundärstruktur, verfahren zur herstellung des formkörpers und materialien zur durchführung dieses verfahrens | |
| RU2017100539A (ru) | Способ получения гибких органо-неорганических слоистых материалов | |
| TW201612643A (en) | Pattern forming method, protective film forming composition, and manufacturing method of electronic device | |
| JP2016065942A5 (enExample) | ||
| TW201425442A (zh) | 非感光性樹脂組成物 | |
| JP2012004349A5 (enExample) | ||
| WO2011037438A3 (ko) | 드라이필름 포토레지스트 | |
| WO2011111965A3 (ko) | Ｏｌｅｄ 디바이스용 감광성 유기 절연재 조성물 | |
| CN106575705A8 (zh) | 用于电子器件的衍生自氧取代的苯并环丁烯的组合物 | |
| JP2006276598A5 (enExample) | ||
| CN105319837B (zh) | 光致抗蚀剂图案形成方法 | |
| TW201529668A (zh) | 顯示元件的硬化膜的製造方法、感放射線性樹脂組成物及其應用、以及加熱裝置 |