JP2017505464A5 - - Google Patents
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- Publication number
- JP2017505464A5 JP2017505464A5 JP2016563899A JP2016563899A JP2017505464A5 JP 2017505464 A5 JP2017505464 A5 JP 2017505464A5 JP 2016563899 A JP2016563899 A JP 2016563899A JP 2016563899 A JP2016563899 A JP 2016563899A JP 2017505464 A5 JP2017505464 A5 JP 2017505464A5
- Authority
- JP
- Japan
- Prior art keywords
- atmosphere
- photosensitive
- photopolymer
- photopolymer film
- pspi
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 claims 12
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 claims 6
- 229920005575 poly(amic acid) Polymers 0.000 claims 6
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims 5
- 239000001301 oxygen Substances 0.000 claims 5
- 229910052760 oxygen Inorganic materials 0.000 claims 5
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims 4
- 229920002577 polybenzoxazole Polymers 0.000 claims 4
- 239000004642 Polyimide Substances 0.000 claims 3
- 238000000151 deposition Methods 0.000 claims 3
- 229920001721 polyimide Polymers 0.000 claims 3
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 claims 2
- 229910001882 dioxygen Inorganic materials 0.000 claims 2
- 150000002148 esters Chemical class 0.000 claims 2
- 238000010438 heat treatment Methods 0.000 claims 2
- 239000000203 mixture Substances 0.000 claims 2
- 239000002243 precursor Substances 0.000 claims 2
- 239000011347 resin Substances 0.000 claims 2
- 229920005989 resin Polymers 0.000 claims 2
- 239000000758 substrate Substances 0.000 claims 2
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020003625A JP7504595B2 (ja) | 2014-01-13 | 2020-01-14 | 感光性ポリイミドをマイクロ波処理する方法 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201461964748P | 2014-01-13 | 2014-01-13 | |
| US61/964,748 | 2014-01-13 | ||
| PCT/US2015/011107 WO2015106234A1 (en) | 2014-01-13 | 2015-01-13 | Method for microwave processing of photosensitive polyimides |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020003625A Division JP7504595B2 (ja) | 2014-01-13 | 2020-01-14 | 感光性ポリイミドをマイクロ波処理する方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2017505464A JP2017505464A (ja) | 2017-02-16 |
| JP2017505464A5 true JP2017505464A5 (enExample) | 2018-03-01 |
Family
ID=53521286
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016563899A Pending JP2017505464A (ja) | 2014-01-13 | 2015-01-13 | 感光性ポリイミドをマイクロ波処理する方法 |
| JP2020003625A Active JP7504595B2 (ja) | 2014-01-13 | 2020-01-14 | 感光性ポリイミドをマイクロ波処理する方法 |
| JP2022080732A Pending JP2022113685A (ja) | 2014-01-13 | 2022-05-17 | 感光性ポリイミドをマイクロ波処理する方法 |
Family Applications After (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020003625A Active JP7504595B2 (ja) | 2014-01-13 | 2020-01-14 | 感光性ポリイミドをマイクロ波処理する方法 |
| JP2022080732A Pending JP2022113685A (ja) | 2014-01-13 | 2022-05-17 | 感光性ポリイミドをマイクロ波処理する方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US9519221B2 (enExample) |
| JP (3) | JP2017505464A (enExample) |
| KR (1) | KR101842691B1 (enExample) |
| CN (2) | CN105940347B (enExample) |
| SG (2) | SG10201903646WA (enExample) |
| WO (1) | WO2015106234A1 (enExample) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9519221B2 (en) * | 2014-01-13 | 2016-12-13 | Applied Materials, Inc. | Method for microwave processing of photosensitive polyimides |
| JP2019118626A (ja) * | 2017-12-29 | 2019-07-22 | 株式会社三洋物産 | 遊技機 |
| JP2019122460A (ja) * | 2018-01-12 | 2019-07-25 | 株式会社三洋物産 | 遊技機 |
| JP2019136396A (ja) * | 2018-02-14 | 2019-08-22 | 株式会社三洋物産 | 遊技機 |
| JP2019136399A (ja) * | 2018-02-14 | 2019-08-22 | 株式会社三洋物産 | 遊技機 |
| JP2019136401A (ja) * | 2018-02-14 | 2019-08-22 | 株式会社三洋物産 | 遊技機 |
| JP2019136395A (ja) * | 2018-02-14 | 2019-08-22 | 株式会社三洋物産 | 遊技機 |
| JP2019136400A (ja) * | 2018-02-14 | 2019-08-22 | 株式会社三洋物産 | 遊技機 |
| JP2019136397A (ja) * | 2018-02-14 | 2019-08-22 | 株式会社三洋物産 | 遊技機 |
| JP2019136398A (ja) * | 2018-02-14 | 2019-08-22 | 株式会社三洋物産 | 遊技機 |
| CN108582606B (zh) * | 2018-04-13 | 2020-07-03 | 南京航空航天大学 | 大厚度复合材料微波固化工艺方法 |
| US12048948B2 (en) * | 2018-12-26 | 2024-07-30 | Applied Materials, Inc. | Methods for forming microwave tunable composited thin-film dielectric layer |
| EP4041803A4 (en) * | 2019-10-04 | 2022-11-30 | FUJIFILM Electronic Materials U.S.A., Inc. | FLATTENING METHOD AND COMPOSITION |
Family Cites Families (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4093461A (en) * | 1975-07-18 | 1978-06-06 | Gaf Corporation | Positive working thermally stable photoresist composition, article and method of using |
| JP3031434B2 (ja) * | 1991-08-07 | 2000-04-10 | 旭化成工業株式会社 | ポリイミドのパターン形成方法 |
| JPH05119478A (ja) * | 1991-10-29 | 1993-05-18 | Asahi Chem Ind Co Ltd | ポリイミドパターンの製造方法 |
| JPH05224419A (ja) * | 1992-02-07 | 1993-09-03 | Asahi Chem Ind Co Ltd | ポリイミド微細パターンの形成方法 |
| US6159666A (en) * | 1998-01-14 | 2000-12-12 | Fijitsu Limited | Environmentally friendly removal of photoresists used in wet etchable polyimide processes |
| JP3844106B2 (ja) * | 1999-06-09 | 2006-11-08 | 住友ベークライト株式会社 | ポジ型感光性樹脂組成物の硬化方法及びその方法により製作された半導体装置 |
| US6342333B1 (en) * | 1999-09-23 | 2002-01-29 | Hitachi Chemical Dupont Microsystems, L.L.C. | Photosensitive resin composition, patterning method, and electronic components |
| JP4529566B2 (ja) * | 2004-07-13 | 2010-08-25 | 日立化成デュポンマイクロシステムズ株式会社 | マイクロ波硬化用ポジ型感光性樹脂組成物を用いたパターンの製造方法 |
| JP3995253B2 (ja) * | 2004-09-28 | 2007-10-24 | Ｔｄｋ株式会社 | 感光性ポリイミドパターンの形成方法及び該パターンを有する電子素子 |
| JP4618075B2 (ja) * | 2004-09-29 | 2011-01-26 | 日立化成デュポンマイクロシステムズ株式会社 | ネガ型感光性樹脂組成物及びパターン形成方法 |
| JP5099979B2 (ja) * | 2005-04-27 | 2012-12-19 | 日立化成デュポンマイクロシステムズ株式会社 | ネガ型感光性樹脂組成物、パターンの製造方法及び電子部品 |
| US20090233120A1 (en) * | 2005-08-19 | 2009-09-17 | Mutsuhiro Maruyama | Laminate and Process for Producing the Same |
| KR101438857B1 (ko) * | 2007-03-12 | 2014-09-05 | 히다치 가세이듀퐁 마이쿠로시스데무즈 가부시키가이샤 | 감광성 수지 조성물, 그 수지 조성물을 이용한 패턴 경화막의 제조방법 및 전자부품 |
| JP4770985B2 (ja) * | 2007-11-12 | 2011-09-14 | 日立化成工業株式会社 | ポジ型感光性樹脂組成物、レジストパターンの製造方法、半導体装置及び電子デバイス |
| GB0817563D0 (en) * | 2008-09-25 | 2008-11-05 | Membrane Extraction Tech Ltd | Membrane module |
| JP2012094600A (ja) * | 2010-10-25 | 2012-05-17 | Hitachi Kokusai Electric Inc | 基板処理装置および半導体装置の製造方法 |
| JP2012216715A (ja) * | 2011-04-01 | 2012-11-08 | Hitachi Kokusai Electric Inc | 基板処理装置および半導体装置の製造方法 |
| KR101910220B1 (ko) * | 2011-06-15 | 2018-10-19 | 히다치 가세이듀퐁 마이쿠로시스데무즈 가부시키가이샤 | 감광성 수지 조성물, 그 수지 조성물을 사용한 패턴 경화막의 제조 방법 및 전자 부품 |
| JP5263424B2 (ja) * | 2012-04-05 | 2013-08-14 | 日立化成株式会社 | ポジ型感光性樹脂組成物、レジストパターンの製造方法及び電子デバイス |
| US9508616B2 (en) * | 2012-05-11 | 2016-11-29 | Applied Materials, Inc. | Method for lower thermal budget multiple cures in semiconductor packaging |
| JP6538027B2 (ja) * | 2013-05-17 | 2019-07-03 | フジフイルム エレクトロニック マテリアルズ ユー．エス．エー．， インコーポレイテッド | 新規ポリマー及びそれを含有する熱硬化性組成物 |
| US9519221B2 (en) * | 2014-01-13 | 2016-12-13 | Applied Materials, Inc. | Method for microwave processing of photosensitive polyimides |
-
2015
- 2015-01-12 US US14/544,482 patent/US9519221B2/en active Active
- 2015-01-13 WO PCT/US2015/011107 patent/WO2015106234A1/en not_active Ceased
- 2015-01-13 SG SG10201903646WA patent/SG10201903646WA/en unknown
- 2015-01-13 CN CN201580004321.1A patent/CN105940347B/zh active Active
- 2015-01-13 SG SG11201604992QA patent/SG11201604992QA/en unknown
- 2015-01-13 JP JP2016563899A patent/JP2017505464A/ja active Pending
- 2015-01-13 CN CN201911140691.4A patent/CN111013967A/zh active Pending
- 2015-01-13 KR KR1020167021874A patent/KR101842691B1/ko not_active Expired - Fee Related
-
2016
- 2016-12-12 US US15/375,773 patent/US10139728B2/en active Active
-
2020
- 2020-01-14 JP JP2020003625A patent/JP7504595B2/ja active Active
-
2022
- 2022-05-17 JP JP2022080732A patent/JP2022113685A/ja active Pending
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