JP2021138916A5 - - Google Patents

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Publication number
JP2021138916A5
JP2021138916A5 JP2020213860A JP2020213860A JP2021138916A5 JP 2021138916 A5 JP2021138916 A5 JP 2021138916A5 JP 2020213860 A JP2020213860 A JP 2020213860A JP 2020213860 A JP2020213860 A JP 2020213860A JP 2021138916 A5 JP2021138916 A5 JP 2021138916A5
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JP
Japan
Prior art keywords
resin composition
phenolic antioxidant
hindered phenolic
curable resin
composition according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2020213860A
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English (en)
Japanese (ja)
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JP2021138916A (ja
JP7574074B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to TW110101764A priority Critical patent/TWI881018B/zh
Priority to CN202110230781.3A priority patent/CN113359388A/zh
Priority to KR1020210027961A priority patent/KR20210113063A/ko
Publication of JP2021138916A publication Critical patent/JP2021138916A/ja
Publication of JP2021138916A5 publication Critical patent/JP2021138916A5/ja
Application granted granted Critical
Publication of JP7574074B2 publication Critical patent/JP7574074B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2020213860A 2020-03-06 2020-12-23 硬化性樹脂組成物、ドライフィルム、硬化物および電子部品 Active JP7574074B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
TW110101764A TWI881018B (zh) 2020-03-06 2021-01-18 硬化性樹脂組成物、乾膜、硬化物及電子零件
CN202110230781.3A CN113359388A (zh) 2020-03-06 2021-03-02 固化性树脂组合物、干膜、固化物和电子部件
KR1020210027961A KR20210113063A (ko) 2020-03-06 2021-03-03 경화성 수지 조성물, 드라이 필름, 경화물 및 전자 부품

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020039156 2020-03-06
JP2020039156 2020-03-06

Publications (3)

Publication Number Publication Date
JP2021138916A JP2021138916A (ja) 2021-09-16
JP2021138916A5 true JP2021138916A5 (enExample) 2023-11-30
JP7574074B2 JP7574074B2 (ja) 2024-10-28

Family

ID=77667961

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2020213860A Active JP7574074B2 (ja) 2020-03-06 2020-12-23 硬化性樹脂組成物、ドライフィルム、硬化物および電子部品

Country Status (2)

Country Link
JP (1) JP7574074B2 (enExample)
KR (1) KR20210113063A (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023120492A1 (ja) * 2021-12-22 2023-06-29 太陽インキ製造株式会社 硬化性組成物、硬化物、および、プリント配線板
TW202440657A (zh) * 2023-03-08 2024-10-16 日商住友化學股份有限公司 組成物、積層體及顯示裝置
JP7627320B1 (ja) * 2023-10-31 2025-02-05 太陽ホールディングス株式会社 透明樹脂組成物、ドライフィルム、硬化物および電子部品
JP7627321B1 (ja) * 2023-10-31 2025-02-05 太陽ホールディングス株式会社 樹脂組成物、ドライフィルム、硬化物、及び、発光素子実装基板

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011030580A1 (ja) 2009-09-10 2011-03-17 積水化学工業株式会社 感光性組成物及びプリント配線板
JP6463079B2 (ja) 2014-03-18 2019-01-30 太陽インキ製造株式会社 硬化性樹脂組成物、ドライフィルム、硬化物およびプリント配線板
JP5696956B2 (ja) 2014-08-29 2015-04-08 日立金属株式会社 非ハロゲン難燃樹脂組成物を用いた電線およびケーブル

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