JP7574074B2 - 硬化性樹脂組成物、ドライフィルム、硬化物および電子部品 - Google Patents

硬化性樹脂組成物、ドライフィルム、硬化物および電子部品 Download PDF

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Publication number
JP7574074B2
JP7574074B2 JP2020213860A JP2020213860A JP7574074B2 JP 7574074 B2 JP7574074 B2 JP 7574074B2 JP 2020213860 A JP2020213860 A JP 2020213860A JP 2020213860 A JP2020213860 A JP 2020213860A JP 7574074 B2 JP7574074 B2 JP 7574074B2
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Japan
Prior art keywords
curable resin
manufactured
resin composition
mass
hindered phenol
Prior art date
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JP2020213860A
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English (en)
Japanese (ja)
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JP2021138916A5 (enExample
JP2021138916A (ja
Inventor
晋一朗 福田
英和 宮部
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Taiyo Holdings Co Ltd
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Taiyo Holdings Co Ltd
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Filing date
Publication date
Application filed by Taiyo Holdings Co Ltd filed Critical Taiyo Holdings Co Ltd
Priority to TW110101764A priority Critical patent/TWI881018B/zh
Priority to CN202110230781.3A priority patent/CN113359388A/zh
Priority to KR1020210027961A priority patent/KR20210113063A/ko
Publication of JP2021138916A publication Critical patent/JP2021138916A/ja
Publication of JP2021138916A5 publication Critical patent/JP2021138916A5/ja
Application granted granted Critical
Publication of JP7574074B2 publication Critical patent/JP7574074B2/ja
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
    • C08K5/3477—Six-membered rings
    • C08K5/3492—Triazines
    • C08K5/34924—Triazines containing cyanurate groups; Tautomers thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/46—Polymerisation initiated by wave energy or particle radiation
    • C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C08F290/06—Polymers provided for in subclass C08G
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/005—Stabilisers against oxidation, heat, light, ozone
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/13—Phenols; Phenolates
    • C08K5/134—Phenols containing ester groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C08L101/02—Compositions of unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
    • C08L101/04—Compositions of unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups containing halogen atoms
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials For Photolithography (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
JP2020213860A 2020-03-06 2020-12-23 硬化性樹脂組成物、ドライフィルム、硬化物および電子部品 Active JP7574074B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
TW110101764A TWI881018B (zh) 2020-03-06 2021-01-18 硬化性樹脂組成物、乾膜、硬化物及電子零件
CN202110230781.3A CN113359388A (zh) 2020-03-06 2021-03-02 固化性树脂组合物、干膜、固化物和电子部件
KR1020210027961A KR20210113063A (ko) 2020-03-06 2021-03-03 경화성 수지 조성물, 드라이 필름, 경화물 및 전자 부품

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020039156 2020-03-06
JP2020039156 2020-03-06

Publications (3)

Publication Number Publication Date
JP2021138916A JP2021138916A (ja) 2021-09-16
JP2021138916A5 JP2021138916A5 (enExample) 2023-11-30
JP7574074B2 true JP7574074B2 (ja) 2024-10-28

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JP2020213860A Active JP7574074B2 (ja) 2020-03-06 2020-12-23 硬化性樹脂組成物、ドライフィルム、硬化物および電子部品

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Country Link
JP (1) JP7574074B2 (enExample)
KR (1) KR20210113063A (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023120492A1 (ja) * 2021-12-22 2023-06-29 太陽インキ製造株式会社 硬化性組成物、硬化物、および、プリント配線板
TW202440657A (zh) * 2023-03-08 2024-10-16 日商住友化學股份有限公司 組成物、積層體及顯示裝置
JP7627320B1 (ja) * 2023-10-31 2025-02-05 太陽ホールディングス株式会社 透明樹脂組成物、ドライフィルム、硬化物および電子部品
JP7627321B1 (ja) * 2023-10-31 2025-02-05 太陽ホールディングス株式会社 樹脂組成物、ドライフィルム、硬化物、及び、発光素子実装基板

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014225478A (ja) 2014-08-29 2014-12-04 日立金属株式会社 非ハロゲン難燃樹脂組成物を用いた電線およびケーブル
JP2015193786A (ja) 2014-03-18 2015-11-05 太陽インキ製造株式会社 硬化性樹脂組成物、ドライフィルム、硬化物およびプリント配線板

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011030580A1 (ja) 2009-09-10 2011-03-17 積水化学工業株式会社 感光性組成物及びプリント配線板

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015193786A (ja) 2014-03-18 2015-11-05 太陽インキ製造株式会社 硬化性樹脂組成物、ドライフィルム、硬化物およびプリント配線板
JP2014225478A (ja) 2014-08-29 2014-12-04 日立金属株式会社 非ハロゲン難燃樹脂組成物を用いた電線およびケーブル

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JP2021138916A (ja) 2021-09-16
KR20210113063A (ko) 2021-09-15

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