JP2017211493A - Exposure equipment, exposure method and manufacturing method of article - Google Patents

Exposure equipment, exposure method and manufacturing method of article Download PDF

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JP2017211493A
JP2017211493A JP2016104552A JP2016104552A JP2017211493A JP 2017211493 A JP2017211493 A JP 2017211493A JP 2016104552 A JP2016104552 A JP 2016104552A JP 2016104552 A JP2016104552 A JP 2016104552A JP 2017211493 A JP2017211493 A JP 2017211493A
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exposure
concave mirror
surface shape
exposure apparatus
measurement
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JP6748482B2 (en
JP2017211493A5 (en
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文靖 大野
Fumiyasu Ono
文靖 大野
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Canon Inc
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Canon Inc
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Priority to CN201710375971.8A priority patent/CN107436539B/en
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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216Mask projection systems
    • G03F7/70258Projection system adjustments, e.g. adjustments during exposure or alignment during assembly of projection system
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70058Mask illumination systems
    • G03F7/7015Details of optical elements
    • G03F7/70175Lamphouse reflector arrangements or collector mirrors, i.e. collecting light from solid angle upstream of the light source
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70058Mask illumination systems
    • G03F7/7015Details of optical elements
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70058Mask illumination systems
    • G03F7/70191Optical correction elements, filters or phase plates for controlling intensity, wavelength, polarisation, phase or the like
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216Mask projection systems
    • G03F7/70241Optical aspects of refractive lens systems, i.e. comprising only refractive elements
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216Mask projection systems
    • G03F7/70358Scanning exposure, i.e. relative movement of patterned beam and workpiece during imaging
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G03F7/70516Calibration of components of the microlithographic apparatus, e.g. light sources, addressable masks or detectors
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605Workpiece metrology
    • G03F7/706835Metrology information management or control
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605Workpiece metrology
    • G03F7/706843Metrology apparatus
    • G03F7/706845Calibration, e.g. tool-to-tool calibration, beam alignment, spot position or focus
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605Workpiece metrology
    • G03F7/706843Metrology apparatus
    • G03F7/706849Irradiation branch, e.g. optical system details, illumination mode or polarisation control
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/708Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/7085Detection arrangement, e.g. detectors of apparatus alignment possibly mounted on wafers, exposure dose, photo-cleaning flux, stray light, thermal load

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Mounting And Adjusting Of Optical Elements (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a technique advantageous for simultaneously realizing throughput and imaging performance.SOLUTION: Exposure equipment for performing scan exposure of a substrate includes: a projection optical system PO configured to project a pattern of an original plate onto a substrate; and a control part 10. The projection optical system PO includes: a plurality of optical members including a pair of a concave mirror 5 and a convex mirror 6; a plurality of adjustment parts 7 configured to apply a force onto plural locations of a rear face of the concave mirror to adjust a surface shape of the concave mirror 5; and a measurement part 8 configured to measure at least one of a location or a posture of an optical member. The control part 10 is configured to control the plurality of adjustment parts 7 so as to adjust the surface shape of the concave mirror 5 while performing the scan exposure according to a measurement result measured by the measurement part 8.SELECTED DRAWING: Figure 1

Description

本発明は、露光装置、露光方法、および、物品の製造方法に関する   The present invention relates to an exposure apparatus, an exposure method, and an article manufacturing method.

FPD(フラットパネルディスプレイ)などの表示用デバイスとして液晶表示パネルが多用されるようになった。液晶表示パネルは露光装置を用いたフォトリソグラフィの手法を用いて製造される。近年、露光装置の高精度化が求められるようになり、投影光学系の収差補正の必要が出てきている。例えば、反射鏡の面形状を変形させることにより収差を補正する技術が提案されている(特許文献1、特許文献2参照)。   Liquid crystal display panels have come to be frequently used as display devices such as FPDs (flat panel displays). The liquid crystal display panel is manufactured using a photolithography technique using an exposure apparatus. In recent years, it has become necessary to increase the accuracy of an exposure apparatus, and it has become necessary to correct aberrations of a projection optical system. For example, a technique for correcting aberration by changing the surface shape of a reflecting mirror has been proposed (see Patent Document 1 and Patent Document 2).

特開2004−056125号公報JP 2004-056125 A 特開2006−128699号公報JP 2006-128699 A

しかし、特許文献1の技術では、投影光学系の収差を計測し、計測された収差を補正するよう面形状を決定するため、多大な計測時間が必要となり、スループットの点で不利である。また、特許文献2の技術では、光学系の特性として光学素子の表面形状の不均一性によって生じるエラーの補正のために、変形可能な反射性デバイスが使用される。しかし、デバイスの高精細化が進むにつれ、光学素子の表面形状の不均一性を含んだ上で十分に調整された投影光学系を使用した露光装置であっても、露光中の光学部材の変位により発生する光学性能の変化も補正する必要がある。   However, the technique of Patent Document 1 is disadvantageous in terms of throughput because it measures the aberration of the projection optical system and determines the surface shape so as to correct the measured aberration. In the technique of Patent Document 2, a deformable reflective device is used for correcting an error caused by non-uniformity of the surface shape of the optical element as a characteristic of the optical system. However, as the resolution of devices increases, even in an exposure apparatus that uses a projection optical system that is well-adjusted with the non-uniformity of the surface shape of the optical element, the displacement of the optical member during exposure It is also necessary to correct the change in optical performance caused by.

本発明は、スループットと結像性能の両立に有利な技術を提供することを目的とする。   It is an object of the present invention to provide a technique that is advantageous for achieving both throughput and imaging performance.

本発明の一側面によれば、基板の走査露光を行う露光装置であって、原版のパターンを前記基板に投影する投影光学系と、制御部とを有し、前記投影光学系は、一対の凹面鏡と凸面鏡とを含む複数の光学部材と、前記凹面鏡の面形状を調整するために前記凹面鏡の裏面の複数箇所に力を加える複数の調整部と、前記光学部材の位置および姿勢の少なくともいずれかを計測する計測部とを含み、前記制御部は、前記計測部によって計測された計測結果に基づき、前記走査露光の実行中に前記凹面鏡の面形状を調整するように前記複数の調整部の制御を行うことを特徴とする露光装置が提供される。   According to an aspect of the present invention, there is provided an exposure apparatus that performs scanning exposure of a substrate, and includes a projection optical system that projects an original pattern onto the substrate, and a control unit, and the projection optical system includes a pair of projection optical systems. At least one of a plurality of optical members including a concave mirror and a convex mirror, a plurality of adjustment units that apply force to a plurality of locations on the back surface of the concave mirror in order to adjust the surface shape of the concave mirror, and the position and posture of the optical member The control unit controls the plurality of adjustment units to adjust the surface shape of the concave mirror during the execution of the scanning exposure based on the measurement result measured by the measurement unit. An exposure apparatus characterized in that is provided.

本発明によれば、スループットと結像性能の両立に有利な技術が提供される。   According to the present invention, a technique advantageous in achieving both throughput and imaging performance is provided.

実施形態における露光装置の概略構成図。1 is a schematic block diagram of an exposure apparatus in an embodiment. 実施形態照明光学系が有するスリットの形状の例を示す図。The figure which shows the example of the shape of the slit which embodiment illumination optical system has. マスク上のパターンの例を示す図。The figure which shows the example of the pattern on a mask. マスク上のパターンの例を示す図。The figure which shows the example of the pattern on a mask. 非点収差の特性例を示す図。The figure which shows the example of a characteristic of astigmatism. 実施形態における凹面鏡の補正処理のフローチャート。The flowchart of the correction process of the concave mirror in embodiment. 凸面鏡の支持構造の例を示す図。The figure which shows the example of the support structure of a convex mirror.

以下、図面を参照して本発明の好適な実施形態について詳細に説明する。なお、本発明は以下の実施形態に限定されるものではなく、以下の実施形態は本発明の実施の具体例を示すにすぎない。また、以下の実施形態の中で説明されている特徴の組み合わせの全てが本発明の課題解決のために必須のものであるとは限らない。   DESCRIPTION OF EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings. In addition, this invention is not limited to the following embodiment, The following embodiment shows only the specific example of implementation of this invention. Moreover, not all combinations of features described in the following embodiments are indispensable for solving the problems of the present invention.

図1は、実施形態における露光装置の概略構成図である。本実施形態の露光装置は、照明光学系ILを含む。照明光学系ILには光源が含まれておりエキシマレーザーや高圧水銀ランプなどから製造するデバイスに最適な光源を選択することが可能である。例えば液晶表示素子の製造には高圧水銀ランプを用いてg線(436nm)、h線(405nm)、i線(365nm)が使用されうる。   FIG. 1 is a schematic block diagram of an exposure apparatus in the embodiment. The exposure apparatus of this embodiment includes an illumination optical system IL. The illumination optical system IL includes a light source, and it is possible to select an optimal light source for a device manufactured from an excimer laser, a high-pressure mercury lamp, or the like. For example, g-line (436 nm), h-line (405 nm), and i-line (365 nm) can be used for manufacturing a liquid crystal display element using a high-pressure mercury lamp.

原版であるマスク1には、例えば液晶表示素子を製造するために必要な回路パターンが描画されている。マスク1はマスクステージ2に搭載されている。マスク1は照明光学系ILからの露光光により照射される。マスク1を透過した露光光は投影光学系POを通り、基板3上にマスク1の像を結像する。   For example, a circuit pattern necessary for manufacturing a liquid crystal display element is drawn on the mask 1 which is an original. The mask 1 is mounted on the mask stage 2. The mask 1 is irradiated with exposure light from the illumination optical system IL. The exposure light transmitted through the mask 1 passes through the projection optical system PO and forms an image of the mask 1 on the substrate 3.

基板3は基板ステージ4に搭載されていて、マスクステージ2と基板ステージ4を同期して走査することにより大きな領域が露光可能となる。基板3には露光光に感度のある感光材が塗布してあり現像プロセスを経ることにより基板上にパターンを形成することが可能である。投影光学系POは一対の凹面鏡5及び凸面鏡6を含む。マスク1から出た露光光は、凹面鏡5で反射され凸面鏡6で反射され再度、凹面鏡5で反射されて、基板3上にマスク1の像が結像される。投影光学系POは、収差の補正を行うために露光光を屈折させる屈折部材9も含み得る。屈折部材9は例えば平行平板を含み、この平行平板を光軸に対して傾けることにより、コマ収差や非点収差、歪曲収差の補正を行うことができる。また、凹面鏡5は一体であっても分割されていてもよい。   The substrate 3 is mounted on the substrate stage 4, and a large area can be exposed by scanning the mask stage 2 and the substrate stage 4 in synchronization. The substrate 3 is coated with a photosensitive material sensitive to exposure light, and a pattern can be formed on the substrate through a development process. Projection optical system PO includes a pair of concave mirror 5 and convex mirror 6. The exposure light emitted from the mask 1 is reflected by the concave mirror 5, reflected by the convex mirror 6, and again reflected by the concave mirror 5, and an image of the mask 1 is formed on the substrate 3. The projection optical system PO may also include a refractive member 9 that refracts exposure light in order to correct aberrations. The refracting member 9 includes, for example, a parallel plate. By tilting the parallel plate with respect to the optical axis, coma aberration, astigmatism, and distortion can be corrected. The concave mirror 5 may be integrated or divided.

図1に示される凹面鏡5と凸面鏡6を含む投影光学系POは、軸外の円弧状良像域が露光に使用可能である。照明光学系ILには円弧状良像域を照明するために、図2に示されるような円弧状の開口を持つスリット11を含んでいる。   In the projection optical system PO including the concave mirror 5 and the convex mirror 6 shown in FIG. 1, an off-axis arcuate good image area can be used for exposure. The illumination optical system IL includes a slit 11 having an arcuate opening as shown in FIG. 2 in order to illuminate the arcuate good image area.

本露光装置の座標系として、基板3からマスク1に向かう方向にZ軸をとり、凸面鏡6から凹面鏡5へ向かう方向にY軸をとり、右手系をなすようにX軸をとる。また、ωxをX軸周りプラスに右ネジが進む回転方向にとる。ωy、ωzもそれぞれY軸周り及びZ軸周りへ同様な定義とする。   As the coordinate system of this exposure apparatus, the Z axis is taken in the direction from the substrate 3 toward the mask 1, the Y axis is taken in the direction from the convex mirror 6 toward the concave mirror 5, and the X axis is taken to form a right hand system. Also, ωx is taken in the rotational direction in which the right screw advances in the positive direction around the X axis. ωy and ωz are similarly defined around the Y axis and the Z axis, respectively.

投影光学系POは、凹面鏡5の面形状を調整するために凹面鏡の裏面の複数箇所に力を加える複数の調整部7(駆動機構)を備える。調整部7には、圧電素子など任意のものが使用可能である。複数の調整部7を駆動させることにより凹面鏡5の反射面の形状を変更することが可能である。面形状が変形するとその形状に従い投影光学系POの光学性能が変化する。したがって、複数の調整部7を制御することにより投影光学系POの光学性能を制御することが可能である。   The projection optical system PO includes a plurality of adjustment units 7 (drive mechanisms) that apply force to a plurality of locations on the back surface of the concave mirror in order to adjust the surface shape of the concave mirror 5. For the adjusting unit 7, an arbitrary element such as a piezoelectric element can be used. It is possible to change the shape of the reflecting surface of the concave mirror 5 by driving the plurality of adjusting units 7. When the surface shape is deformed, the optical performance of the projection optical system PO changes according to the shape. Accordingly, it is possible to control the optical performance of the projection optical system PO by controlling the plurality of adjusting units 7.

投影光学系POは、凸面鏡6の位置および姿勢の少なくともいずれかを計測するための計測部8を備えている。計測部8は、例えばレーザーを用いた測長機で構成されうる。測長機は、最適な配置及び個数を選択することにより、位置(X,Y,Z)および姿勢(ωx、ωy、ωz)の少なくともいずれかを計測することができる。図1に示す計測部8は、凸面鏡6の位置姿勢の計測を行っているが、計測対象とする光学部材は、凸面鏡6の他、凹面鏡5、屈折部材9を含む複数の光学部材のうちの少なくともいずれかであってもよい。また、複数の計測部を用いることにより複数の光学部材の位置姿勢を同時に測ることも可能である。   The projection optical system PO includes a measuring unit 8 for measuring at least one of the position and posture of the convex mirror 6. The measuring unit 8 can be constituted by a length measuring machine using a laser, for example. The length measuring machine can measure at least one of the position (X, Y, Z) and the posture (ωx, ωy, ωz) by selecting an optimal arrangement and number. The measurement unit 8 shown in FIG. 1 measures the position and orientation of the convex mirror 6, but the optical member to be measured is a convex mirror 6, a plurality of optical members including the concave mirror 5 and the refractive member 9. It may be at least one of them. Moreover, it is also possible to measure the position and orientation of a plurality of optical members simultaneously by using a plurality of measuring units.

計測部8は制御部10に接続されている。制御部10は、計測部8からの計測結果を取得し、凸面鏡6の位置姿勢の変化(以下、単に「変位」ともいう。)に対応した光学性能の変化を予測することができる。光学性能は、球面収差や像面湾曲や非点収差、コマ収差、歪曲収差(Distortion)、さらには結像位置のX,Y平面内の一律のずれ等を含みうる。   The measuring unit 8 is connected to the control unit 10. The control unit 10 can obtain a measurement result from the measurement unit 8 and predict a change in optical performance corresponding to a change in the position and orientation of the convex mirror 6 (hereinafter also simply referred to as “displacement”). The optical performance may include spherical aberration, curvature of field, astigmatism, coma aberration, distortion, uniform displacement of the imaging position in the X and Y planes, and the like.

図3および図4に、マスク1上のパターンの例を示す。図3に示されるように、X方向に長いパターンをHパターン、図4に示されるようなY方向に長いパターンをVパターンという。投影光学系POに非点収差が存在するとHパターンとVパターンのZ方向の結像位置(フォーカス位置)に差が生ずる。非点収差が存在することによりHパターンとVパターンのフォーカス位置に差が生じ、結像性能が低下する。   3 and 4 show examples of patterns on the mask 1. As shown in FIG. 3, a pattern long in the X direction is called an H pattern, and a pattern long in the Y direction as shown in FIG. 4 is called a V pattern. When astigmatism is present in the projection optical system PO, a difference occurs in the image forming position (focus position) in the Z direction between the H pattern and the V pattern. Due to the presence of astigmatism, a difference occurs between the focus positions of the H pattern and the V pattern, and the imaging performance deteriorates.

露光装置が設置してある床からの外乱の影響によって投影光学系PO内の各光学部材は本来の位置姿勢からずれる可能性がある。例えば、凸面鏡6は、図7に示されるように、ホルダ61によって保持され、ホルダ61は横方向(X軸方向)に延びる棒状部材であるシャフト62を介して固定部材63によって投影光学系POの筐体を構成するチャンバCの内壁に固定されている。シャフト62が延びる方向は縦方向(Z軸方向)であってもよい。あるいは、ホルダ61は横方向および縦方向(さらには他の方向)にそれぞれ延びる複数のシャフトによって固定されてもよい。凸面鏡6が走査露光時における外乱の影響を受けないためには凸面鏡6の支持剛性が十分に高いことが要求される。しかし、凸面鏡6の周囲は露光光の光路となっているため、シャフト62によって光路を遮ることは最小限に留める必要がある。そのため、シャフト62の剛性を高めるのには限度があり、投影光学系POにおける光学部材の中でもとりわけ凸面鏡6の位置姿勢は、走査露光時における外乱の影響によってずれる可能性が高い。また、凸面鏡6の位置姿勢がずれた場合には、凸面鏡6自体の位置姿勢をもとに戻せばよいのだが、露光光の光路を邪魔しないようにそのような機構を配置するのは困難である。そこで本実施形態では、以下に説明するように、例えば凸面鏡6の位置姿勢の変化に伴う光学特性の変化を補正するように、複数の調整部7を制御して凹面鏡5の面形状を変化させることとした。   Each optical member in the projection optical system PO may deviate from its original position and orientation due to the influence of disturbance from the floor on which the exposure apparatus is installed. For example, as shown in FIG. 7, the convex mirror 6 is held by a holder 61, and the holder 61 is fixed by a fixing member 63 via a shaft 62 that is a rod-shaped member extending in the lateral direction (X-axis direction). It is being fixed to the inner wall of the chamber C which comprises a housing | casing. The direction in which the shaft 62 extends may be the vertical direction (Z-axis direction). Alternatively, the holder 61 may be fixed by a plurality of shafts extending in the horizontal direction and the vertical direction (and in other directions). In order for the convex mirror 6 not to be affected by disturbance during scanning exposure, the support rigidity of the convex mirror 6 is required to be sufficiently high. However, since the periphery of the convex mirror 6 is an optical path for exposure light, it is necessary to keep the optical path from being blocked by the shaft 62 to a minimum. For this reason, there is a limit to increasing the rigidity of the shaft 62, and the position and orientation of the convex mirror 6 among the optical members in the projection optical system PO are likely to be shifted due to the influence of disturbance during scanning exposure. Further, when the position and orientation of the convex mirror 6 is deviated, it is only necessary to restore the position and orientation of the convex mirror 6 itself, but it is difficult to arrange such a mechanism so as not to disturb the optical path of the exposure light. is there. Therefore, in the present embodiment, as described below, for example, the surface shape of the concave mirror 5 is changed by controlling the plurality of adjusting units 7 so as to correct the change in the optical characteristics accompanying the change in the position and orientation of the convex mirror 6. It was decided.

凸面鏡6等の光学部材が本来の位置姿勢からずれると、そのずれ量に従い結像性能が変化する。例えば、凸面鏡6がY方向に変化したときのHパターンとVパターンの結像位置(フォーカス位置)の差を表したグラフが図5となる。図5の横軸は、図2におけるスリットのX方向の位置を表し、縦軸はHパターンとVパターンのフォーカス位置の差(非点収差量)を表している。本実施形態では、凸面鏡6のY方向への変化に対する非点収差の変化量を示したが、X方向やZ方向の変位や光学部材の姿勢ωx,ωy,ωzと他の収差やなど任意の組み合わせが可能である。   When the optical member such as the convex mirror 6 is deviated from the original position and orientation, the imaging performance is changed according to the deviation amount. For example, FIG. 5 is a graph showing the difference between the image forming position (focus position) of the H pattern and the V pattern when the convex mirror 6 changes in the Y direction. The horizontal axis in FIG. 5 represents the position of the slit in the X direction in FIG. 2, and the vertical axis represents the difference in focus position between the H pattern and the V pattern (astigmatism amount). In the present embodiment, the amount of change in astigmatism with respect to the change in the Y direction of the convex mirror 6 is shown. However, the displacement in the X direction and the Z direction, the postures ωx, ωy, ωz of the optical member and other aberrations are arbitrary. Combinations are possible.

実施形態において、凸面鏡6の変位に対する非点収差の発生量の予測は、例えば以下のように行われる。あらかじめ光学シミュレーションにより、変位に対する非点収差の発生量を求めておく。この変位と非点収差の発生量との対応関係は例えば参照テーブルとして制御部10内のメモリに保持される。そして、制御部10は、この対応関係に基づき、計測部8の計測結果に対応する非点収差の発生量を、投影光学系POで発生している非点収差の発生量として予測することができる。あるいは、凸面鏡6の変位を計測部8で計測し、その計測結果をもとに光学シミュレーションを行い、非点収差の発生量を算出することも可能である。   In the embodiment, the prediction of the amount of astigmatism generated with respect to the displacement of the convex mirror 6 is performed as follows, for example. The amount of astigmatism generated with respect to the displacement is obtained in advance by optical simulation. The correspondence between this displacement and the amount of astigmatism generated is held in a memory in the control unit 10 as a reference table, for example. Then, based on this correspondence, the control unit 10 can predict the amount of astigmatism generated corresponding to the measurement result of the measuring unit 8 as the amount of astigmatism generated in the projection optical system PO. it can. Alternatively, it is also possible to measure the displacement of the convex mirror 6 by the measurement unit 8 and perform an optical simulation based on the measurement result to calculate the amount of astigmatism.

次に、制御部10は、予測された収差を補正するための凹面鏡5の面形状を決定する。本実施形態では、非点収差の補正を例に挙げたが、前述のコマ収差や歪曲収差など任意の収差を考慮した面形状を算出することが可能である。また、複数の収差を補正するための面形状を算出することも可能である。算出された収差を補正するための面形状を目標として凹面鏡5の面形状を変形するために、制御部10は複数の調整部7の各々の駆動量を算出する。制御部10は、算出された駆動量で各調整部を駆動させる。これにより凹面鏡5の面形状が所望の面形状へと変形し、凸面鏡6の変位に伴う非点収差が補正されうる。   Next, the control unit 10 determines the surface shape of the concave mirror 5 for correcting the predicted aberration. In the present embodiment, astigmatism correction is taken as an example, but it is possible to calculate a surface shape that takes into account arbitrary aberrations such as the above-mentioned coma and distortion. It is also possible to calculate a surface shape for correcting a plurality of aberrations. In order to deform the surface shape of the concave mirror 5 with the surface shape for correcting the calculated aberration as a target, the control unit 10 calculates the drive amount of each of the plurality of adjustment units 7. The control unit 10 drives each adjustment unit with the calculated drive amount. Thereby, the surface shape of the concave mirror 5 is deformed to a desired surface shape, and astigmatism accompanying the displacement of the convex mirror 6 can be corrected.

上述の補正は、例えば以下のようにして行われうる。まず、非露光中である基板ステージ4のステップ駆動中や基板の交換中に、制御部10は、計測部8の測定結果に基づき凸面鏡6の変位を求め、その変位により発生する収差を予測する。その後、制御部10は、その収差を補正するための凹面鏡5の面形状を決定し、複数の調整部7を駆動させることで、投影光学系POの収差の補正を行う。   The above correction can be performed as follows, for example. First, during step driving of the substrate stage 4 that is not being exposed or during exchange of the substrate, the control unit 10 obtains the displacement of the convex mirror 6 based on the measurement result of the measurement unit 8 and predicts the aberration caused by the displacement. . Thereafter, the control unit 10 determines the surface shape of the concave mirror 5 for correcting the aberration, and drives the plurality of adjusting units 7 to correct the aberration of the projection optical system PO.

以上では、具体的な例として凸面鏡6がY方向に変化した場合の非点収差の補正について述べた。他の例として凸面鏡6が+ωxに姿勢が変化した場合は、結像位置が全体的に+Y方向に変化する。例えば、走査露光中に外乱により±ωx方向に凸面鏡6が振動すると、基板3上での結像位置が±Y方向に振動する。走査露光中に結像位置が振動することにより、像のコントラストが低下し、結像性能が低下する。その補正のために露光中に凸面鏡6の姿勢ωxを常に計測し、その姿勢ωxの変化による結像位置の変化を制御部10で予測を行う。その予測に基づき、その結像位置のずれを補正するための凹面鏡5の面形状を算出し、算出した面形状を目標として複数の調整部7を駆動させることにより凹面鏡5の面形状を変形させる。これらの処理をリアルタイムに行うことにより、基板3上での像の振動を抑えることが可能となる。その結果、コントラストの低下を防ぎ良好な結像性能を得ることが可能となる。   In the above, astigmatism correction when the convex mirror 6 is changed in the Y direction has been described as a specific example. As another example, when the posture of the convex mirror 6 is changed to + ωx, the imaging position is changed in the + Y direction as a whole. For example, when the convex mirror 6 vibrates in the ± ωx direction due to disturbance during scanning exposure, the imaging position on the substrate 3 vibrates in the ± Y direction. When the imaging position is vibrated during the scanning exposure, the contrast of the image is lowered and the imaging performance is lowered. For the correction, the posture ωx of the convex mirror 6 is always measured during exposure, and the control unit 10 predicts the change in the imaging position due to the change in the posture ωx. Based on the prediction, the surface shape of the concave mirror 5 for correcting the deviation of the imaging position is calculated, and the surface shape of the concave mirror 5 is deformed by driving the plurality of adjusting units 7 with the calculated surface shape as a target. . By performing these processes in real time, the vibration of the image on the substrate 3 can be suppressed. As a result, it is possible to prevent a decrease in contrast and obtain good imaging performance.

上述した、計測部8での計測、結像性能(収差)の予測、凹面鏡の面形状の算出、および複数の調整部の駆動は、走査露光の実行中のみならず走査露光の非実行時の任意のタイミングで実施可能である。また、以上で述べたように収差の変化だけでなく、結像位置のX,Y平面内のずれに関しても有効である。   The above-described measurement by the measurement unit 8, prediction of imaging performance (aberration), calculation of the surface shape of the concave mirror, and driving of the plurality of adjustment units are performed not only during scanning exposure but also during non-execution of scanning exposure. It can be implemented at any timing. Further, as described above, not only the change in aberration but also the displacement of the imaging position in the X and Y planes is effective.

本実施形態では、凸面鏡6の変位について述べたが、例えば屈折部材9や駆動機構を備えた凹面鏡5の変位を測る計測部を備えることにより、屈折部材9や凹面鏡5の変位、姿勢変化により生ずる結像性能の変化を同様な方法で補正可能となる。また、凸面鏡6や屈折部材9や凹面鏡5の複数の光学部材の変位を計測し、複数の光学部材が変位することにより投影光学系POの結像性能がどのように変化するか予測することも可能である。複数の光学部材が変位したことにより予測された結像性能の変化をまとめて補正するための凹面鏡5の面形状を算出し、算出された結果から複数の調整部7の駆動量を算出し複数の調整部7を駆動するようにしてもよい。これにより、複数の光学部材で発生した光学性能の変化の補正が可能となる。上述の通り、計測する光学部材と変位の方向や変化を予測する収差は任意に選択し組み合わせることが可能である。   In the present embodiment, the displacement of the convex mirror 6 has been described. However, for example, by providing a measuring unit that measures the displacement of the concave mirror 5 provided with the refracting member 9 and the driving mechanism, it is caused by the displacement and posture change of the refractive member 9 and the concave mirror 5. Changes in imaging performance can be corrected in a similar manner. In addition, the displacement of the plurality of optical members of the convex mirror 6, the refractive member 9, and the concave mirror 5 is measured, and it is predicted how the imaging performance of the projection optical system PO changes due to the displacement of the plurality of optical members. Is possible. The surface shape of the concave mirror 5 for collectively correcting the change in the imaging performance predicted by the displacement of the plurality of optical members is calculated, and the driving amounts of the plurality of adjusting units 7 are calculated from the calculated results. The adjusting unit 7 may be driven. Thereby, the change of the optical performance which generate | occur | produced with the some optical member can be correct | amended. As described above, the optical member to be measured and the aberration for predicting the direction and change of the displacement can be arbitrarily selected and combined.

図6は、制御部10による凹面鏡5の補正処理のフローチャートである。まず、制御部10は、計測部8から取得された計測データに基づき、投影光学系POに含まれる光学部材の位置X,Y,Zや姿勢ωx,ωy,ωzを計測する(S1)。次に、制御部10は、計測された位置姿勢の変化から光学性能(収差)の変化を予測する(S2)。制御部10は、予測された光学性能の変化に基づき、その光学性能の変化を補正するような凹面鏡5の面形状を算出する(S3)。次に制御部10は、算出された面形状を目標として複数の調整部7の各々の駆動量を算出する(S4)。そして、制御部10は、算出された駆動量に従い複数の調整部7を駆動する(S5)。上記したようにこの補正処理は、走査露光の実行中に行われうる。また、上記補正処理は、走査露光の実行中に加え、走査露光の非実行中にも行われてもよい。   FIG. 6 is a flowchart of the correction process of the concave mirror 5 by the control unit 10. First, the control unit 10 measures the positions X, Y, Z and postures ωx, ωy, ωz of optical members included in the projection optical system PO based on the measurement data acquired from the measurement unit 8 (S1). Next, the control unit 10 predicts a change in optical performance (aberration) from the measured change in position and orientation (S2). Based on the predicted change in optical performance, the controller 10 calculates the surface shape of the concave mirror 5 that corrects the change in optical performance (S3). Next, the control unit 10 calculates the drive amount of each of the plurality of adjustment units 7 with the calculated surface shape as a target (S4). And the control part 10 drives the some adjustment part 7 according to the calculated drive amount (S5). As described above, this correction processing can be performed during execution of scanning exposure. The correction process may be performed while scanning exposure is not being performed, as well as when scanning exposure is being performed.

つぎに、上記した実施形態の変形例を説明する。基板の変形などは露光前に計測が可能であり、露光前の計測結果に基づき駆動機構を駆動させ基板の変形による結像性能への影響は補正が可能となる。しかし、投影光学系に含まれる光学部材は、外乱等により常に振動しており、露光前に光学部材の位置などの計測を行い、その結果より収差を予測し、駆動機構を駆動させて光学性能の補正を行うことは困難である。結像性能の補正は例えば、測定対象の光学部材の位置の情報が制御部10にフィードバックされて複数の調整部7が制御されるが、走査速度と振動の速さによっては複数の調整部7をフィードバック制御するのに十分な時間をとることができない場合が生じうる。   Next, a modified example of the above-described embodiment will be described. The deformation of the substrate can be measured before exposure, and the drive mechanism is driven based on the measurement result before exposure, and the influence on the imaging performance due to the deformation of the substrate can be corrected. However, the optical members included in the projection optical system are constantly oscillating due to disturbances, etc., and the position of the optical member is measured before exposure, the aberration is predicted from the result, and the drive mechanism is driven to drive the optical performance. It is difficult to correct this. In the correction of the imaging performance, for example, information on the position of the optical member to be measured is fed back to the control unit 10 and the plurality of adjustment units 7 are controlled. Depending on the scanning speed and the vibration speed, the plurality of adjustment units 7 are controlled. In some cases, sufficient time cannot be taken for feedback control.

走査露光を行う露光装置の場合、マスク1上の一点がスリット11から照射される露光光の下を通過する間に投影光学系POの性能変化の平均値が結像性能の変化として現れる。したがって、露光中すべての収差変化の補正を行わなくても露光結果の補正は可能である。例えば、制御部10は、走査露光によりマスク1の一点が露光領域の所定部分(例えば、半分の領域)を通過する間における計測部8での各計測点での計測結果を取得する。制御部10は、取得した計測値の平均値を計算し、その平均値から収差の変化を予測して、その予測された収差の変化を補正する凹面鏡の面形状を算出する。そして、制御部10は、当該走査露光によりマスク1の一点が露光領域の上記所定部分を除く残りの部分(残りの半分)を通過する間に、算出された面形状を目標として複数の調整部7を駆動するよう各調整部を制御する。これにより、例えば前半半分の収差変化分の補正が行われ、結像性能の低下を抑制することが可能である。以上の例では、露光領域を半分通過する場合の位置の平均値を例としたが、駆動に必要な時間と補正精度から最適な量を算出するようにしてもよい。   In the case of an exposure apparatus that performs scanning exposure, an average value of the performance change of the projection optical system PO appears as a change in imaging performance while one point on the mask 1 passes under the exposure light irradiated from the slit 11. Therefore, it is possible to correct the exposure result without correcting all aberration changes during exposure. For example, the control unit 10 acquires measurement results at each measurement point in the measurement unit 8 while one point of the mask 1 passes through a predetermined portion (for example, a half region) of the exposure region by scanning exposure. The control unit 10 calculates an average value of the acquired measurement values, predicts a change in aberration from the average value, and calculates a surface shape of the concave mirror that corrects the predicted change in aberration. Then, the control unit 10 sets a plurality of adjustment units with the calculated surface shape as a target while one point of the mask 1 passes through the remaining part (the remaining half) of the exposure area except the predetermined part by the scanning exposure. Each adjustment unit is controlled to drive 7. Thereby, for example, correction of the aberration change in the first half is performed, and it is possible to suppress a decrease in imaging performance. In the above example, the average value of the positions when passing through the exposure region half is taken as an example, but an optimal amount may be calculated from the time required for driving and the correction accuracy.

<物品の製造方法の実施形態>
本発明の実施形態に係る物品の製造方法は、例えば、半導体デバイス等のマイクロデバイスや微細構造を有する素子等の物品を製造するのに好適である。本実施形態の物品の製造方法は、基板に塗布された感光剤に上記の露光装置を用いて潜像パターンを形成する工程(基板を露光する工程)と、かかる工程で潜像パターンが形成された基板を現像する工程とを含む。更に、かかる製造方法は、他の周知の工程(酸化、成膜、蒸着、ドーピング、平坦化、エッチング、レジスト剥離、ダイシング、ボンディング、パッケージング等)を含む。本実施形態の物品の製造方法は、従来の方法に比べて、物品の性能・品質・生産性・生産コストの少なくとも1つにおいて有利である。
<Embodiment of Method for Manufacturing Article>
The method for manufacturing an article according to an embodiment of the present invention is suitable for manufacturing an article such as a microdevice such as a semiconductor device or an element having a fine structure. In the method for manufacturing an article according to the present embodiment, a latent image pattern is formed on the photosensitive agent applied to the substrate using the above-described exposure apparatus (a step of exposing the substrate), and the latent image pattern is formed in this step. Developing the substrate. Further, the manufacturing method includes other well-known steps (oxidation, film formation, vapor deposition, doping, planarization, etching, resist stripping, dicing, bonding, packaging, and the like). The method for manufacturing an article according to the present embodiment is advantageous in at least one of the performance, quality, productivity, and production cost of the article as compared with the conventional method.

IL:照明光学系、PO:投影光学系、1:マスク(原版)、2:マスクステージ、3:基板、4:基板ステージ、5:凹面鏡、6:凸面鏡、7:調整部、8:計測部、9:屈折部材、10:制御部 IL: illumination optical system, PO: projection optical system, 1: mask (original), 2: mask stage, 3: substrate, 4: substrate stage, 5: concave mirror, 6: convex mirror, 7: adjustment unit, 8: measurement unit , 9: refractive member, 10: control unit

Claims (10)

基板の走査露光を行う露光装置であって、
原版のパターンを前記基板に投影する投影光学系と、
制御部と、
を有し、
前記投影光学系は、
一対の凹面鏡と凸面鏡とを含む複数の光学部材と、
前記凹面鏡の面形状を調整するために前記凹面鏡の裏面の複数箇所に力を加える複数の調整部と、
前記光学部材の位置および姿勢の少なくともいずれかを計測する計測部と、
を含み、
前記制御部は、前記計測部によって計測された計測結果に基づき、前記走査露光の実行中に前記凹面鏡の面形状を調整するように前記複数の調整部の制御を行う
ことを特徴とする露光装置。
An exposure apparatus that performs scanning exposure of a substrate,
A projection optical system for projecting an original pattern onto the substrate;
A control unit;
Have
The projection optical system is
A plurality of optical members including a pair of concave mirrors and convex mirrors;
A plurality of adjusting portions for applying a force to a plurality of locations on the back surface of the concave mirror in order to adjust the surface shape of the concave mirror;
A measurement unit that measures at least one of the position and orientation of the optical member;
Including
The control unit controls the plurality of adjustment units so as to adjust the surface shape of the concave mirror during the execution of the scanning exposure based on the measurement result measured by the measurement unit. .
前記計測部は、前記凸面鏡の位置および姿勢の少なくともいずれかを計測することを特徴とする請求項1に記載の露光装置。   The exposure apparatus according to claim 1, wherein the measurement unit measures at least one of a position and a posture of the convex mirror. 前記凸面鏡は、前記投影光学系の筐体の内壁に棒状部材を介して固定されていることを特徴とする請求項1又は2に記載の露光装置。   The exposure apparatus according to claim 1, wherein the convex mirror is fixed to an inner wall of a housing of the projection optical system via a rod-shaped member. 前記制御部は、
前記計測部の計測結果に基づき収差を予測し、
前記予測された収差を補正するための前記凹面鏡の面形状を算出し、
前記算出された面形状を目標として前記複数の調整部を制御する
ことを特徴とする請求項1乃至3のいずれか1項に記載の露光装置。
The controller is
Aberration is predicted based on the measurement result of the measurement unit,
Calculating a surface shape of the concave mirror for correcting the predicted aberration;
The exposure apparatus according to any one of claims 1 to 3, wherein the plurality of adjustment units are controlled with the calculated surface shape as a target.
前記制御部は、あらかじめ求められた前記計測部の計測対象である光学部材の変位と収差との対応関係から、前記収差を予測することを特徴とする請求項4に記載の露光装置。   The exposure apparatus according to claim 4, wherein the control unit predicts the aberration from a correspondence relationship between a displacement of the optical member that is a measurement target of the measurement unit and aberration, which is obtained in advance. 前記制御部は、更に、前記走査露光の非実行中にも、前記複数の調整部の制御を行うことを特徴とする請求項1乃至5のいずれか1項に記載の露光装置。   The exposure apparatus according to claim 1, wherein the control unit further controls the plurality of adjustment units even when the scanning exposure is not performed. 前記複数の光学部材は、収差の補正を行うため露光光を屈折させる屈折部材を含むことを特徴とする請求項1乃至6のいずれか1項に記載の露光装置。   The exposure apparatus according to claim 1, wherein the plurality of optical members include a refraction member that refracts exposure light to correct aberrations. 前記計測部は、前記屈折部材の位置および姿勢の少なくともいずれかを計測することを特徴とする請求項7に記載の露光装置。   The exposure apparatus according to claim 7, wherein the measurement unit measures at least one of a position and a posture of the refractive member. 前記計測部は、前記走査露光により前記原版の一点が露光領域の所定部分を通過する間に計測を行い、
前記制御部は、
前記計測の結果に基づき収差を予測し、
前記予測された収差を補正する前記凹面鏡の面形状を算出し、
前記走査露光により前記一点が前記露光領域の前記所定部分を除く残りの部分を通過する間に、前記算出された面形状を目標として前記複数の調整部を制御する
ことを特徴とする請求項1乃至7のいずれか1項に記載の露光装置。
The measurement unit performs measurement while one point of the original passes through a predetermined part of an exposure area by the scanning exposure,
The controller is
Aberration is predicted based on the result of the measurement,
Calculating the surface shape of the concave mirror that corrects the predicted aberration;
2. The plurality of adjustment units are controlled with the calculated surface shape as a target while the one point passes through the remaining portion excluding the predetermined portion of the exposure region by the scanning exposure. 8. The exposure apparatus according to any one of items 7 to 7.
請求項1乃至9のいずれか1項に記載の露光装置を用いて基板を露光する工程と、
前記工程で露光された基板を現像する工程と、
を有することを特徴とする物品の製造方法。
A step of exposing a substrate using the exposure apparatus according to claim 1;
Developing the substrate exposed in the step;
A method for producing an article comprising:
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