CN107436539A - The manufacture method of exposure device and article - Google Patents
The manufacture method of exposure device and article Download PDFInfo
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- CN107436539A CN107436539A CN201710375971.8A CN201710375971A CN107436539A CN 107436539 A CN107436539 A CN 107436539A CN 201710375971 A CN201710375971 A CN 201710375971A CN 107436539 A CN107436539 A CN 107436539A
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- exposure
- concave mirror
- exposure device
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70258—Projection system adjustments, e.g. adjustments during exposure or alignment during assembly of projection system
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70058—Mask illumination systems
- G03F7/7015—Details of optical elements
- G03F7/70175—Lamphouse reflector arrangements or collector mirrors, i.e. collecting light from solid angle upstream of the light source
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70058—Mask illumination systems
- G03F7/70191—Optical correction elements, filters or phase plates for controlling intensity, wavelength, polarisation, phase or the like
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70241—Optical aspects of refractive lens systems, i.e. comprising only refractive elements
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/7085—Detection arrangement, e.g. detectors of apparatus alignment possibly mounted on wafers, exposure dose, photo-cleaning flux, stray light, thermal load
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Mounting And Adjusting Of Optical Elements (AREA)
Abstract
The present invention relates to the manufacture method of a kind of exposure device and article.The exposure device for carrying out the scan exposure of substrate has：Projection optical system, the pattern of master is projected into the substrate；And control unit.Projection optical system includes：Include multiple optical components including concave mirror and convex mirror；Multiple adjustment portions, in order to adjust the face shape of concave mirror, to multiple position applying powers at the back side of concave mirror；And measurement portion, measure the optical component position and posture at least some.Control unit carries out the control of multiple adjustment portions according to the measurement result measured by measurement portion, to adjust the face shape of concave mirror in the implementation procedure of scan exposure.
Description
Technical field
The present invention relates to the manufacture method of exposure device and article.
Background technology
It is more and more to use liquid crystal display panel as display equipment such as FPD (flat-panel monitor).Liquid crystal display panel
Manufactured using the gimmick for the photoetching that make use of exposure device.In recent years, it is desirable to which the high precision int of exposure device is, it is necessary to be thrown
The aberration correction of shadow optical system.Such as, it is proposed that by making the face shape distortion of speculum come the technology (reference of aberration correction
Patent document 1, patent document 2).
Patent document 1：Japanese Unexamined Patent Publication 2004-056125 publications
Patent document 2：Japanese Unexamined Patent Publication 2006-128699 publications
The content of the invention
But in the technology of patent document 1, due to the picture to measure the aberration of projection optical system and correction is measured
The mode of difference determines face shape, is unfavorable in this point with regard to operating efficiency so needing substantial amounts of time of measuring.In addition,
In the technology of patent document 2, in order to correct the characteristic as optical system due to optical element surface configuration it is uneven
Property and caused deviation, the reflectivity device that use can deform.But development is refined with the superfinishing of device, even if using
The inhomogeneities of surface configuration comprising optical element is sufficiently carried out the exposure of the projection optical system after adjustment inside
Device, it is also desirable to the change of correction caused optical property due to the displacement of the optical component in exposure process.
The present invention is provided with beneficial to while realizes operating efficiency and the technology of imaging performance.
According to an aspect of the present invention, there is provided a kind of exposure device, the scan exposure of substrate is carried out, wherein, the exposure
Electro-optical device has：Projection optical system, the pattern of master is projected into the substrate；And control unit, the projection optics system
System includes：Include multiple optical components including concave mirror and convex mirror；Multiple adjustment portions, in order to adjust the face of the concave mirror
Shape, to multiple position applying powers at the back side of the concave mirror；And measurement portion, measure the optical component position and
In posture at least some, the control unit carries out the multiple adjustment according to the measurement result measured by the measurement portion
The control in portion, to adjust the face shape of the concave mirror in the implementation procedure of the scan exposure.
According to another aspect of the present invention, there is provided a kind of manufacture method of article, wherein, the manufacture method tool of the article
Have：1st process, substrate is exposed using exposure device；And the 2nd process, make the substrate exposed in the 1st process
Development, the manufacture method manufacture article according to the substrate to develop in the 2nd process, the exposure device be into
The exposure device of the scan exposure of the row substrate, has：Projection optical system, the pattern of master is projected into the substrate；
And control unit, the projection optical system include：Include multiple optical components including concave mirror and convex mirror；Multiple adjustment
Portion, in order to adjust the face shape of the concave mirror, to multiple position applying powers at the back side of the concave mirror；And measurement portion,
Measure the optical component position and posture at least some, the control unit is measured according to by the measurement portion
Measurement result carry out the control of the multiple adjustment portion, it is described recessed to adjust in the implementation procedure of the scan exposure
The face shape of face mirror.
In accordance with the invention it is possible to it is provided with beneficial to while realizes operating efficiency and the technology of imaging performance.
The further feature and advantage of the present invention is clear by referring to the following explanation of accompanying drawing.In addition, in the accompanying drawings,
Identical Ref. No. is added to identical or same structure.
Brief description of the drawings
Accompanying drawing include in the description, form one part, embodiments of the present invention are shown, with its describe together be used for
Illustrate the principle of the present invention.
Fig. 1 is the summary construction diagram of the exposure device in embodiment.
Fig. 2 is the figure of the example for the shape for showing slit possessed by the lamp optical system of embodiment.
Fig. 3 is the figure for the example for showing the pattern on mask.
Fig. 4 is the figure for the example for showing the pattern on mask.
Fig. 5 is the figure for the characteristic example for showing astigmatism.
Fig. 6 is the flow chart of the correction process of the concave mirror in embodiment.
Fig. 7 is the figure of the example for the supporting construction for showing convex mirror.
Embodiment
Hereinafter, referring to the drawings, the preferred embodiment of the present invention is explained.In addition, the present invention be not limited to it is following
Embodiment, following embodiment only represent the present invention implementation specific example.In addition, following embodiment it
All combinations of the feature of middle explanation are not necessarily to solve combination necessary to the problem of the present invention.
Fig. 1 is the summary construction diagram of the exposure device in embodiment.The exposure device of present embodiment includes illumination light
System IL.Lamp optical system IL has light source, can be selected from excimer laser, high-pressure mercury-vapor lamp etc. for manufactured
The optimal light source of device.Such as high-pressure mercury-vapor lamp is used when manufacturing liquid crystal display cells, so as to use g lines
(436nm), h lines (405nm), i lines (365nm).
Mask 1 as master, which is for example described, to be had to manufacture liquid crystal display cells and required circuit pattern.Mask 1 is taken
It is loaded in mask mounting table 2.Mask 1 is by the light irradiation of the exposure from lamp optical system IL.The light of the exposure of transmission mask 1 leads to
Projection optical system PO is crossed, by the picture imaging of mask 1 on the substrate 3.
Substrate 3 is equipped on substrate-placing platform 4, mask mounting table 2 is synchronously scanned with substrate-placing platform 4, so as to
Big region is exposed.Substrate 3, which is coated with, has the photosensitive material of sensitivity to the light of exposure, by developing process from
And pattern can be formed on substrate.Projection optical system PO includes a pair of concave mirrors 5 and convex mirror 6.Come out from mask 1
The light of exposure is reflected by concave mirror 5, reflected by convex mirror 6, is then reflected again by concave mirror 5, the picture of mask 1 is imaged on base
On plate 3.Projection optical system PO can also include refractive component 9, and the refractive component 9 makes exposure to carry out the correction of aberration
Anaclasis.Refractive component 9 is for example including parallel flat, by making the parallel flat to carry out broom shape with respect to inclined light shaft
Aberration or astigmatism, the correction of distortion aberration.In addition, concave mirror 5 both can be integral or divided.
Arc-shaped outside the axle of the projection optical system PO for including concave mirror 5 and convex mirror 6 shown in Fig. 1 is good as scope energy
It is enough in exposure.In order to good as scope is illuminated to arc-shaped, lamp optical system IL includes with circle as shown in Figure 2
The slit 11 of arc shaped opening.
As the coordinate system of this exposure device, Z axis will be taken as from substrate 3 towards the direction of mask 1, will be from the court of convex mirror 6
Y-axis is taken as to the direction of concave mirror 5, X-axis is taken in a manner of forming right-handed coordinate system.In addition, it will be taken as around the direction of rotation of X-axis
ω x, the direction of rotation are the positive direction of rotation that dextrorotation screw advances.On ω y, ω z, also opposing connection Y-axis and about the z axis
Same definition is respectively adopted.
Projection optical system PO possesses multiple adjustment portions 7 (drive mechanism), and the plurality of adjustment portion 7 is in order to adjust concave mirror 5
Face shape, to multiple position applying powers at the back side of concave mirror.Adjustment portion 7 can use the arbitrary elements such as piezoelectric element.
By driving multiple adjustment portions 7, the shape of the reflecting surface of concave mirror 5 can be changed.When shape deforms face to face, throw
Shadow optical system PO optical property changes according to its shape.Therefore, by controlling multiple adjustment portions 7, can control
Projection optical system PO optical property.
Projection optical system PO possesses measurement portion 8, in position and posture of the measurement portion 8 for measuring convex mirror 6
At least some.Such as measurement portion 8 can be by being formed using the linear measure longimetry machine of laser.Linear measure longimetry machine passes through selection
Optimal configuration and number, can be in measurement position (X, Y, Z) and posture (ω x, ω y, ω z) at least some.Fig. 1
Shown measurement portion 8 carries out the measurement of the posture of convex mirror 6, but as measurement object optical component except that can be convex
Outside face mirror 6, can also be including concave mirror 5, refractive component 9 multiple optical components at least some.In addition, pass through
Use multiple measurement portions, additionally it is possible to while measure the posture of multiple optical components.
Measurement portion 8 is connected to control unit 10.Control unit 10 can obtain the measurement result from measurement portion 8, prediction with it is convex
The change of the posture of face mirror 6 (hreinafter referred to as " conjugates ".) corresponding to optical property change.Optical property can wrap
Spherical aberration, curvature of the image, astigmatism, coma aberration, distortion aberration (Distortion) and image space are included in X, Y plane
As skew etc..
Fig. 3 and Fig. 4 shows the example of the pattern on mask 1.As shown in figure 3, pattern long in the X direction is referred to as H
Pattern, long pattern in Y-direction as shown in Figure 4 is referred to as V patterns.When astigmatism be present in projection optical system PO, H-pattern
And V patterns produce deviation in the image space (focal position) of Z-direction.Due to astigmatism be present in the focal position and V of H-pattern
The focal position of pattern produces deviation so as to which imaging performance declines.
Due to the interference effect from the floor for setting exposure device, each optical component in projection optical system PO has can
It can be offset from original posture.For example, as shown in fig. 7, convex mirror 6 is kept frame 61 keeps, retainer 61 is via conduct
The axle 62 of the bar-like member extended in transverse direction (X-direction) is fixed in using fixed component 63 and forms projection optical system PO
Framework cavity C inwall.The direction that axle 62 extends can also be longitudinal direction (Z-direction).Or retainer 61 can also profit
Fixed used in the multiple axles laterally and on longitudinal direction (and then other directions) each extended over.In order to avoid convex mirror 6 is swept
Retouch interference effect during exposure, it is desirable to which the supporting rigidity of convex mirror 6 is fully high.But around convex mirror 6 it is the light of exposure
Light path, so needing this case that axle 62 is covered into light path to be limited to Min..Therefore, it is to have in terms of the rigidity of axle 62 is improved
Limit, the posture of the optical component especially convex mirror 6 in projection optical system PO by interference effect during scan exposure and
The possibility to shift is high.In addition, in the case where the posture of convex mirror 6 shifts, make the position of of convex mirror 6 itself
Posture recovery is put, but is difficult to the light path that such mechanism is configured to not influence to the light of exposure.Therefore, in present embodiment
In, as described below, such as be set to control multiple adjustment portions 7, make the face change in shape of concave mirror 5, with cause correction with
The change for changing associated optical characteristics of the posture of convex mirror 6.
When the grade optical component of convex mirror 6 shifts from original posture, imaging performance according to its offset and
Change.For example, Fig. 5 is the image space (focal position) and V patterns for representing H-pattern when convex mirror 6 changes in the Y direction
Image space (focal position) difference curve map.Fig. 5 transverse axis represents the position of the X-direction of the slit in Fig. 2, longitudinal axis table
Show the difference (astigmatism amount) of the focal position of H-pattern and the focal position of V patterns.In the present embodiment, show for convex surface
The variable quantity of the astigmatism of change in the Y-direction of mirror 6 but it is also possible to be X-direction, the displacement of Z-direction, optical component posture ω
X, any combination of ω y, ω z and other aberrations etc..
In embodiments, the prediction of the yield of the astigmatism conjugated for convex mirror 6 is for example carried out as described below.In advance
First pass through the yield that optical simulation obtains the astigmatism for displacement.The corresponding relation of the yield of the displacement and astigmatism is for example made
To be held in the memory in control unit 10 with reference to form.Moreover, control unit 10 can be based on the corresponding relation, will be with measurement portion
The Output forecast of astigmatism corresponding to 8 measurement result is the yield of the caused astigmatism in projection optical system PO.Or
Measurement portion 8 can also be utilized to measure the displacement of convex mirror 6, optical simulation is carried out according to its measurement result, calculates the generation of astigmatism
Amount.
Next, control unit 10 determines the face shape of the concave mirror 5 for correcting the aberration predicted.In present embodiment
In, the example of correction astigmatism is enumerated, but the face shape for considering any aberration such as foregoing coma aberration, distortion aberration can be calculated
Shape.In addition it is possible to calculate the face shape for correcting multiple aberrations.In order to for correcting the face shape of aberration calculated
Make the face shape distortion of concave mirror 5 for target, control unit 10 calculates multiple 7 respective drive volumes of adjustment portion.Control unit 10 according to
The drive volume calculated drives each adjustment portion.Thus, the face shape distortion of concave mirror 5 is into desired face shape, can correct with
Convex mirror 6 conjugates associated astigmatism.
Above-mentioned correction can for example be carried out as follows.First, the stepping of the substrate-placing platform 4 during non-exposed
During driving or in the Renewal process of substrate, control unit 10 obtains the displacement of convex mirror 6 according to the measurement result of measurement portion 8,
Prediction caused aberration due to the displacement.Afterwards, control unit 10 determines the face shape of the concave mirror 5 for correcting the aberration,
Multiple adjustment portions 7 are driven, so as to carry out the correction of projection optical system PO aberration.
More than, as specific example, describe the correction of astigmatism when convex mirror 6 changes in the Y direction.As other
Example, when the posture of convex mirror 6 is changing to+ω x, image space integrally changes in +Y direction.For example, exposed when in scanning
In photoreduction process due to interference and convex mirror 6 on ± ω x directions when vibrating, the image space on substrate 3 shakes in ± Y-direction
It is dynamic.Due to during scan exposure image space vibrate, as contrast decline, imaging performance decline.In order to carry out the school
Just, the posture ω x of convex mirror 6 are measured all the time in exposure process, caused by the change that posture ω x are predicted using control unit 10
The change of image space.According to the prediction, the face shape of the concave mirror 5 of skew for correcting the image space is calculated, in terms of
The face calculated is shaped as the multiple adjustment portions 7 of target drives, so that the face shape distortion of concave mirror 5.By carrying out this in real time
A little processing, can suppress the vibration of the picture on substrate 3.As a result, the decline of contrast can be prevented and obtain good imaging
Performance.
The above-mentioned measurement carried out by measurement portion 8, the prediction of imaging performance (aberration), concave mirror face shape calculating and
The driving of multiple adjustment portions can not only be implemented in the implementation procedure of scan exposure, but also can be held in the non-of scan exposure
Arbitrary timing during row is implemented.In addition, as described above, it is not only effective for the change of aberration, and with regard to image space
It is for skew in X, Y plane and effective.
In the present embodiment, the displacement of convex mirror 6 is described, but for example by setting measurement refractive component 9 and possessing
The measurement portion of the displacement of the concave mirror 5 of drive mechanism, can be with same method correction due to refractive component 9 and concave mirror 5
Displacement, the change of postural change and caused imaging performance.In addition it is possible to measure convex mirror 6, refractive component 9, concave mirror 5
The displacement of this multiple optical component, predict due to multiple optical components occur displacement and projection optical system PO imaging performance such as
What changes.It can also calculate for collectively correcting due to the change for the imaging performance that displacement occurs for multiple optical components and predicts
The face shape of the concave mirror 5 of change, multiple adjustment portions 7 are driven according to the drive volume of the multiple adjustment portions 7 of result calculating calculated.
Thereby, it is possible to correct the change of the optical property as caused by multiple optical components.As described above, the optical component to be measured with it is pre-
Selection combination can arbitrarily be carried out by surveying the direction of displacement and the aberration of change.
Fig. 6 is the flow chart of the correction process of the concave mirror 5 carried out by control unit 10.First, control unit 10 is according to from survey
The measurement data that amount portion 8 is got, position X, Y, Z and posture ω x of the optical component that measurement projection optical system PO is included,
ωy、ωz(S1).Next, control unit 10 predicts the change of optical property (aberration) according to the change for the posture measured
Change (S2).Control unit 10 calculates recessed as the change for correcting the optical property according to the change of the optical property predicted
The face shape (S3) of face mirror 5.Next, control unit 10 is shaped as target with the face calculated, it is respective to calculate multiple adjustment portions 7
Drive volume (S4).Then, control unit 10 drives multiple adjustment portions 7 (S5) according to the drive volume calculated.As described above, the correction
Processing can be carried out in the implementation procedure of scan exposure.In addition, above-mentioned correction process is except can be in the execution of scan exposure
During carry out outside, can also be carried out during the non-executing of scan exposure.
Next, illustrate the variation of above-mentioned embodiment.Deformation of substrate etc. can measure before exposure, can
The influence to imaging performance according to caused by the measurement result before exposure makes drive mechanism driving come the deformation of correction substrate.But
It is that the optical component that projection optical system is included is vibrated all the time due to interference etc., it is difficult to carries out optical component before exposure
Position etc. measurement and drive drive mechanism according to its prediction of result aberration and carry out the correction of optical property.On imaging
The correction of performance, such as the information of the position of the optical component of measure object are fed back to control unit 10, control multiple adjustment portions
7, but may produce to obtain due to sweep speed and the speed of vibration and feedback control is carried out to multiple adjustment portions 7 enough
The situation of time.
In the case where being scanned the exposure device of exposure, a point on mask 1 from slit 11 by irradiating
During under the light of exposure, the average value of projection optical system PO performance change embodies as the change of imaging performance.
Therefore, even if the correction changed without aberration whole in exposure process, still is able to be exposed the correction of result.For example,
Control unit 10 obtain based on scan exposure and a point of mask 1 by the established part of exposure area (for example, the area of half
Domain) during in the measurement result of each measurement point measured by measurement portion 8.The measured value that the calculating of control unit 10 is got
Average value, the change of aberration is predicted according to the average value, calculate the face shape of the concave mirror for the change for correcting the aberration predicted
Shape.Then, control unit 10 based on the scan exposure and a point of mask 1 by exposure area except above-mentioned established part
Outside remaining part (remaining half) during, control each adjustment portion so that with the face calculated be shaped as target come
Drive multiple adjustment portions 7.Thus, for example, can carry out half as first half aberration variable quantity correction, suppress into
As the decline of performance.In the example above, by by the average value of the position in the case of half exposure area as an example,
But optimal amount can also be calculated according to the time needed for driving and correction accuracy.
<The embodiment of the manufacture method of article>
The manufacture method of the article of embodiments of the present invention is for example suitable for manufacturing microdevice or the tools such as semiconductor devices
There is element of microstructure and other items.The manufacture method of the article of present embodiment includes using the emulsion coated on substrate
Above-mentioned exposure device and form the process (process being exposed to substrate) of latent image pattern and to being formed in above-mentioned operation
The process that the substrate for having latent image pattern is developed.And then such manufacture method include other well known process (oxidation, into
Film, evaporation, doping, planarization, etching, resist stripping, cutting, bonding, encapsulation etc.).The manufacture of the article of present embodiment
Method is favourable in terms of at least one in the performance of article, quality, productivity ratio, production cost compared to conventional method
's.
Associatedly illustrate the present invention with exemplary embodiment, but the present invention should be understood to be not limited to it is disclosed
Exemplary embodiment.Ensuing claims should be given with broadest explanation, to include structure and work(
All variations of energy and the scope of equalization.
Claims (10)
1. a kind of exposure device, the scan exposure of substrate is carried out, wherein, the exposure device has：
Projection optical system, the pattern of master is projected into the substrate；And
Control unit,
The projection optical system includes：
Include multiple optical components including concave mirror and convex mirror；
Multiple adjustment portions, in order to adjust the face shape of the concave mirror, to multiple position applying powers at the back side of the concave mirror；
And
Measurement portion, measure the optical component position and posture at least some,
The control unit carries out the control of the multiple adjustment portion according to the measurement result measured by the measurement portion, to cause
The face shape of the concave mirror is adjusted in the implementation procedure of the scan exposure.
2. exposure device according to claim 1, wherein,
The measurement portion measure the convex mirror position and posture at least some.
3. exposure device according to claim 1, wherein,
The convex mirror is fixed on the inwall of the framework of the projection optical system across bar-like member.
4. exposure device according to claim 1, wherein,
The control unit predicts aberration according to the measurement result of the measurement portion, calculates for correcting the aberration predicted
The face shape of the concave mirror, target is shaped as with the face calculated to control the multiple adjustment portion.
5. exposure device according to claim 4, wherein,
The control unit is according to the displacement of the optical component of the measurement object of measurement portion as described in and aberration obtained in advance
Corresponding relation predicts the aberration.
6. exposure device according to claim 1, wherein,
The control unit and then the control that the multiple adjustment portion is also carried out during the non-executing of the scan exposure.
7. exposure device according to claim 1, wherein,
The multiple optical component includes refractive component, and the refractive component rolls over the light of exposure to carry out the correction of aberration
Penetrate.
8. exposure device according to claim 7, wherein,
The measurement portion measure the refractive component position and posture at least some.
9. exposure device according to claim 1, wherein,
The measurement portion based on the scan exposure and the phase of established part that a point of the master passes through exposure area
Between measure,
The control unit is calculated for being corrected to the aberration predicted according to the prediction of result aberration of the measurement
The face shape of the concave mirror, based on the scan exposure and one point by the exposure area except the rule
During determining the remaining part outside part, target is shaped as with the face calculated to control the multiple adjustment portion.
10. a kind of manufacture method of article, wherein, the manufacture method of the article has：
1st process, substrate is exposed using exposure device；And
2nd process, the substrate for making to expose in the 1st process develop,
The manufacture method manufactures article according to the substrate to develop in the 2nd process,
The exposure device is the exposure device for the scan exposure for carrying out the substrate, is had：
Projection optical system, the pattern of master is projected into the substrate；And
Control unit,
The projection optical system includes：
Include multiple optical components including concave mirror and convex mirror；
Multiple adjustment portions, in order to adjust the face shape of the concave mirror, to multiple position applying powers at the back side of the concave mirror；
And
Measurement portion, measure the optical component position and posture at least some,
The control unit carries out the control of the multiple adjustment portion according to the measurement result measured by the measurement portion, to cause
The face shape of the concave mirror is adjusted in the implementation procedure of the scan exposure.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016-104552 | 2016-05-25 | ||
| JP2016104552A JP6748482B2 (en) | 2016-05-25 | 2016-05-25 | Exposure apparatus and method for manufacturing article |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107436539A true CN107436539A (en) | 2017-12-05 |
| CN107436539B CN107436539B (en) | 2023-09-22 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110286562A (en) * | 2018-03-19 | 2019-09-27 | 佳能株式会社 | Exposure device, exposure method and article manufacturing method |
| CN111736298A (en) * | 2019-03-25 | 2020-10-02 | 佳能株式会社 | Optical device, exposure device, and article manufacturing method |
| CN112445082A (en) * | 2019-09-04 | 2021-03-05 | 佳能株式会社 | Exposure apparatus and article manufacturing method |
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| JP6896404B2 (en) * | 2016-11-30 | 2021-06-30 | キヤノン株式会社 | Exposure equipment and manufacturing method of articles |
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Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060056083A1 (en) * | 2003-05-21 | 2006-03-16 | Yuji Sudoh | Retainer, exposure apparatus, and device fabrication method |
| CN101135772A (en) * | 2007-10-11 | 2008-03-05 | 上海交通大学 | variable focal point micro-flat mirror driven by electrostatic and method of manufacturing the same |
| WO2008122313A1 (en) * | 2007-04-05 | 2008-10-16 | Carl Zeiss Smt Ag | Optical element module with imaging error and position correction |
| CN101523294A (en) * | 2006-08-14 | 2009-09-02 | 卡尔蔡司Smt股份公司 | Catadioptric projection objective with pupil mirror. projection exposure apparatus and method |
| CN101995775A (en) * | 2009-08-07 | 2011-03-30 | 佳能株式会社 | Exposure apparatus and device manufacturing method |
| CN102165371A (en) * | 2008-09-25 | 2011-08-24 | 卡尔蔡司Smt有限责任公司 | Projection exposure apparatus with optimized adjustment possibility |
| JP2012123971A (en) * | 2010-12-07 | 2012-06-28 | Canon Inc | Charged particle beam lens |
| CN104459986A (en) * | 2013-09-13 | 2015-03-25 | 上海微电子装备有限公司 | Micro deformation aberration correction device |
| CN104919371A (en) * | 2012-11-12 | 2015-09-16 | 株式会社尼康 | Exposure apparatus and exposure method, and device manufacturing method |
| JP2016092309A (en) * | 2014-11-07 | 2016-05-23 | キヤノン株式会社 | Optical device, projection optical system, exposure device, and manufacturing method of article |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11345761A (en) * | 1998-05-29 | 1999-12-14 | Nikon Corp | Scanning type aligner |
| JP2004056125A (en) | 2002-06-20 | 2004-02-19 | Nikon Corp | Reflective projection optical system with discrete actuator |
| US6803994B2 (en) * | 2002-06-21 | 2004-10-12 | Nikon Corporation | Wavefront aberration correction system |
| JP2005228922A (en) * | 2004-02-13 | 2005-08-25 | Canon Inc | Aligner |
| US7184124B2 (en) * | 2004-10-28 | 2007-02-27 | Asml Holding N.V. | Lithographic apparatus having an adjustable projection system and device manufacturing method |
| JP2011119551A (en) * | 2009-12-04 | 2011-06-16 | Nikon Corp | Optical member deformation apparatus, optical system, aligner, method of manufacturing device |
| JP5632685B2 (en) * | 2010-09-03 | 2014-11-26 | キヤノン株式会社 | Exposure apparatus and device manufacturing method |
| JP2013037300A (en) * | 2011-08-11 | 2013-02-21 | Canon Inc | Exposure device and exposure method |
| JP2014135368A (en) * | 2013-01-09 | 2014-07-24 | Canon Inc | Exposure device, measurement method and method of manufacturing device |
| JP6371576B2 (en) * | 2014-05-02 | 2018-08-08 | キヤノン株式会社 | Optical apparatus, projection optical system, exposure apparatus, and article manufacturing method |
| JP2016092366A (en) * | 2014-11-11 | 2016-05-23 | キヤノン株式会社 | Optical device, projection optical system, exposure device, and manufacturing method of article |
-
2016
- 2016-05-25 JP JP2016104552A patent/JP6748482B2/en active Active
-
2017
- 2017-05-24 KR KR1020170063874A patent/KR102169893B1/en active IP Right Grant
- 2017-05-25 CN CN201710375971.8A patent/CN107436539B/en active Active
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060056083A1 (en) * | 2003-05-21 | 2006-03-16 | Yuji Sudoh | Retainer, exposure apparatus, and device fabrication method |
| CN101523294A (en) * | 2006-08-14 | 2009-09-02 | 卡尔蔡司Smt股份公司 | Catadioptric projection objective with pupil mirror. projection exposure apparatus and method |
| WO2008122313A1 (en) * | 2007-04-05 | 2008-10-16 | Carl Zeiss Smt Ag | Optical element module with imaging error and position correction |
| CN101135772A (en) * | 2007-10-11 | 2008-03-05 | 上海交通大学 | variable focal point micro-flat mirror driven by electrostatic and method of manufacturing the same |
| CN102165371A (en) * | 2008-09-25 | 2011-08-24 | 卡尔蔡司Smt有限责任公司 | Projection exposure apparatus with optimized adjustment possibility |
| CN101995775A (en) * | 2009-08-07 | 2011-03-30 | 佳能株式会社 | Exposure apparatus and device manufacturing method |
| JP2012123971A (en) * | 2010-12-07 | 2012-06-28 | Canon Inc | Charged particle beam lens |
| CN104919371A (en) * | 2012-11-12 | 2015-09-16 | 株式会社尼康 | Exposure apparatus and exposure method, and device manufacturing method |
| CN104459986A (en) * | 2013-09-13 | 2015-03-25 | 上海微电子装备有限公司 | Micro deformation aberration correction device |
| JP2016092309A (en) * | 2014-11-07 | 2016-05-23 | キヤノン株式会社 | Optical device, projection optical system, exposure device, and manufacturing method of article |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110286562A (en) * | 2018-03-19 | 2019-09-27 | 佳能株式会社 | Exposure device, exposure method and article manufacturing method |
| CN110286562B (en) * | 2018-03-19 | 2022-03-25 | 佳能株式会社 | Exposure apparatus, exposure method, and article manufacturing method |
| CN108983414A (en) * | 2018-08-30 | 2018-12-11 | 京东方科技集团股份有限公司 | Optical mirror, optical mirror system and exposure machine |
| CN108983414B (en) * | 2018-08-30 | 2024-01-30 | 京东方科技集团股份有限公司 | Optical reflector, optical reflector system and exposure machine |
| CN111736298A (en) * | 2019-03-25 | 2020-10-02 | 佳能株式会社 | Optical device, exposure device, and article manufacturing method |
| CN111736298B (en) * | 2019-03-25 | 2023-01-13 | 佳能株式会社 | Optical device, exposure device, and article manufacturing method |
| TWI793403B (en) * | 2019-03-25 | 2023-02-21 | 日商佳能股份有限公司 | Optical device, exposure device, and article manufacturing method |
| CN112445082A (en) * | 2019-09-04 | 2021-03-05 | 佳能株式会社 | Exposure apparatus and article manufacturing method |
| CN112445082B (en) * | 2019-09-04 | 2024-03-19 | 佳能株式会社 | Exposure apparatus and article manufacturing method |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2017211493A (en) | 2017-11-30 |
| KR102169893B1 (en) | 2020-10-26 |
| JP6748482B2 (en) | 2020-09-02 |
| CN107436539B (en) | 2023-09-22 |
| KR20170133275A (en) | 2017-12-05 |
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