KR20220121707A - Exposure apparatus, exposure method, and method of manufacturing article - Google Patents

Abstract

An exposure device for exposing a substrate through an original plate includes: a stage moving while holding the substrate; a surface plate on which the stage is mounted; a projection optical system for projecting a pattern of the original plate onto the substrate; a measurement part for measuring a position in the height direction of the substrate held on the stage; and a control part. The control part causes the measurement part to measure the position in the height direction in a measurement period set to an integral multiple of a vibration period of the surface plate vibrated by the movement of the stage and controls a distance between the projection optical system and the stage holding the substrate to be exposed on the basis of the position in the height direction of the substrate measured by the measurement part. Provided is the exposure device which reduces the influence of vibration of a surface plate, and is advantageous for achieving highly accurate exposure.

Description

Exposure apparatus, exposure method, and manufacturing method of an article TECHNICAL FIELD

The present invention relates to an exposure apparatus, an exposure method, and a method for manufacturing an article.

DESCRIPTION OF RELATED ART Generally, in the photolithography process of manufacturing devices, such as a semiconductor element, the exposure apparatus which transfers the pattern of an original plate to a board|substrate by exposing a board|substrate through an original plate (mask or a reticle) is used. As such an exposure apparatus, in general, an exposure apparatus (stepper) employing a step-and-repeat method and an exposure apparatus (scanner) employing a step-and-scan method are known.

A stepper is a low-cost device compared to a scanner, and is used in a process that does not require resolution or high-precision superimposition. In the stepper, after driving the substrate stage holding the substrate below the projection optical system (exposure position), the position in the height direction of the substrate (distance from the projection optical system) is measured with a focus sensor, and the substrate stage is moved according to the measured value. By driving, the substrate is brought into focus with respect to the projection optical system. A technique related to measurement of such a position in the height direction of a substrate is proposed in Japanese Patent Laid-Open No. 11-87233.

However, in the stepper, the measurement value of the focus sensor includes an error resulting from the vibration of the substrate stage holding the substrate to be measured. Among these errors, the control deviation of the substrate stage can be corrected by removing it from the measured value, but unobservable components such as vibration of the surface on which the substrate stage is placed cannot be corrected, so it leads to defocus. Since the stepper needs to be realized as a low-cost device, it is not realistic to provide a sensor for measuring the vibration of the surface plate and control it in real time.

Then, this invention provides the exposure apparatus which reduces the influence of the vibration of a surface plate, and is advantageous for realizing high-precision exposure.

An exposure apparatus as one aspect of the present invention is an exposure apparatus that exposes a substrate through an original plate, a stage holding and moving the substrate, a surface plate on which the stage is placed, and projecting the pattern of the original plate onto the substrate a projection optical system, a measurement unit for measuring a position in the height direction of the substrate held on the stage, and a control unit, wherein the control unit has a measurement period set to an integer multiple of an oscillation period of the surface plate vibrated by movement of the stage wherein the position in the height direction is measured by the measurement unit, and the distance between the projection optical system and the stage holding the substrate to be exposed is determined based on the position in the height direction of the substrate measured by the measurement unit. characterized by controlling.

Further objects or other aspects of the present invention will become apparent by means of the embodiments described hereinafter with reference to the accompanying drawings.

ADVANTAGE OF THE INVENTION According to this invention, the exposure apparatus advantageous for realizing high-precision exposure by reducing the influence of the vibration of a surface plate, for example can be provided.

1 is a schematic diagram showing the configuration of an exposure apparatus as an aspect of the present invention.
FIG. 2 is a flowchart for explaining exposure processing by the exposure apparatus shown in FIG. 1. FIG.
Fig. 3 is a diagram showing an example of variation in the height position of the substrate.
4 is a diagram showing an example of the measurement error amount included in the measurement value of the measurement unit.
5 is a diagram showing an example of the measurement error amount included in the measurement value of the measurement unit.
6 is a flowchart for explaining a process for setting a measurement period of the measurement unit.
7 is a diagram showing an example of an exposure layout.
Fig. 8 is a diagram showing an example of variation in the height position of the substrate.
9 is a diagram showing an example of the measurement error amount included in the measurement value of the measurement unit.

EMBODIMENT OF THE INVENTION Hereinafter, embodiment is described in detail with reference to an accompanying drawing. In addition, the following embodiment does not limit the invention concerning a claim. Although a plurality of features are described in the embodiment, it cannot be said that all of these plurality of features are essential to the invention, and a plurality of features may be arbitrarily combined. In addition, in the accompanying drawings, the same reference numbers are attached to the same or the same structure, and the overlapping description is abbreviate|omitted.

Fig. 1 is a schematic diagram showing the configuration of an exposure apparatus 1 as one aspect of the present invention. The exposure apparatus 1 is a lithographic apparatus that is used in a manufacturing process of a device such as a semiconductor element and exposes a substrate through an original plate to form a pattern on the substrate. The exposure apparatus 1 is an exposure apparatus (stepper) of a step-and-repeat system in this embodiment. Here, the step-and-repeat system is an exposure system in which the substrate is step-moved for every batch exposure of the shot region of the substrate, and the next shot region is moved to the exposure position (exposure region).

The exposure apparatus 1 includes an illumination optical system 102 , a projection optical system 104 , a stage 105 that holds and moves a substrate S, a measurement unit 106 , a structure 107 , and an inter-plane sensor ( 108 , a control unit 109 , and a surface plate 110 on which the stage 105 is placed. In addition, in this specification and an accompanying drawing, the direction parallel to the surface of the board|substrate S is shown by the XX coordinate system called X-plane. The directions parallel to each of the X-axis, Y-axis, and Z-axis in the X-Y coordinate system are called the X-direction, Y-direction and Z-direction, and each of the rotation around the X-axis, the rotation around the Y-axis, and the rotation around the Z-axis is θX , θY and θZ.

The illumination optical system 102 illuminates the original plate 103 by guiding the light from the light source 101 . The light source 101 includes, for example, an i-line mercury lamp, an excimer laser, or the like. On the original plate 103, a pattern to be transferred to the substrate S is drawn. The projection optical system 104 projects the pattern (pattern image) of the original plate 103 onto the substrate S.

In the exposure apparatus 1 , the light passing through the original plate 103 passes through the projection optical system 104 and forms an image on the substrate held by the stage 105 . The pattern image projected onto the substrate S reacts with a photosensitive material such as a resist applied on the substrate S, and thus, by developing the substrate S, a pattern is formed on the substrate. In addition, as described above, all shot regions of the substrate S are removed by step-moving the stage 105 holding the substrate S and sequentially exposing the shot regions of the substrate S (that is, repeating the step movement and exposure). It is possible to expose

The position and posture of the stage 105 are measured by a position measuring device including an interferometer, an encoder, or the like, and are managed with high precision under the control of the control unit 109 based on the measured values. In this way, by managing the position and posture of the stage 105, it becomes possible to realize highly accurate superimposition.

The measurement unit 106 measures the position of the substrate S held by the stage 105 in the height direction (Z direction) (hereinafter referred to as “the height position of the substrate S”). When exposing the substrate S, it is necessary to match the height position or inclination of the substrate S with the position on the pattern projected from the projection optical system 104, that is, to bring the substrate S into focus with respect to the imaging plane of the projection optical system 104. there is Therefore, the measurement unit 106 measures the height position of the substrate S, and based on the measured value, the substrate S is moved under the control of the control unit 109 so that the substrate S is focused on the image forming plane of the projection optical system 104 . At least one of the position and posture of the stage 105 to be held is controlled.

Although the measurement unit 106 is constituted by a focus sensor that performs optical detection in the present embodiment, it is not limited thereto, and other detection methods using a capacitive sensor, a pressure sensor, or the like may be employed. In addition to the height of the substrate S, in order to obtain the inclination of the substrate S, a plurality of measurement points (measurement points) at which the height position is measured by the measurement unit 106 are provided in the exposure area on the substrate.

The projection optical system 104 and the measurement unit 106 are held by the structure 107 floating through the vibration damping device so as not to be affected by the disturbance vibration. The sensor 108 between the surfaces includes, for example, a displacement sensor, and measures the distance between the structure 107 and the surface 110 . Here, the position of the projection optical system 104 with respect to the structure 107 is guaranteed, and the position of the stage 105 with respect to the surface plate 110 is guaranteed. Therefore, the distance between the projection optical system 104 and the stage 105 can be obtained by measuring the distance between the structure 107 and the surface plate 110 with the surface-to-table sensor 108 .

The control unit 109 is constituted by a computer including a CPU, a memory, or the like, and collectively controls each unit of the exposure apparatus 1 according to a program stored in the storage unit to operate the exposure apparatus 1 . . The control unit 109 includes information regarding the height and inclination of the substrate S obtained by the measurement unit 106 and information regarding (variation in) the distance between the projection optical system 104 and the stage 105 obtained by the face-to-face sensor 108 . Based on , the (movement) of the stage 105 is controlled. The control unit 109 controls the exposure of the entire substrate S by repeating exposure of a shot region on the substrate while moving the stage 105 stepwise, for example, so as to perform exposure in a so-called step-and-repeat method. do.

With reference to Fig. 2, the operation of the exposure apparatus 1, specifically, the exposure process (exposure method) of exposing the substrate S through the original plate 103 to transfer the pattern of the original plate 103 onto the substrate S will be described. do. Such exposure processing is performed by the control part 109 controlling each part of the exposure apparatus 1 collectively.

In S201, the substrate S is loaded into the exposure apparatus 1 . Specifically, the substrate S is loaded into the exposure apparatus 1 via a substrate transfer unit (not shown), and the substrate S is held on the stage 105 .

In S202, the stage 105 holding the substrate S is moved to the exposure position. For example, the stage 105 holding the substrate S is moved so that the shot region on the substrate (the shot region exposed therefrom) is positioned at the exposure position below the projection optical system 104 .

In S203 , the height position of the substrate S held by the stage 105 positioned at the exposure position below the projection optical system 104 is measured by the measurement unit 106 .

In S204, alignment (focus alignment) in the height direction of the board|substrate S is performed. Specifically, based on the height position of the substrate S measured in S203, at least one of the position and posture of the stage 105 holding the substrate S is selected so that the substrate S is focused on the imaging plane of the projection optical system 104 . control In other words, the distance between the projection optical system 104 and the stage 105 is controlled so that the stage 105 is moved and the substrate S is focused on the imaging plane of the projection optical system 104 .

In S205, through the original plate 103, the substrate S to which the focus has been performed in S204 is exposed.

In S206, it is determined whether exposure has been performed over the entire substrate S, that is, whether exposure has been performed for all shot regions on the substrate. When exposure is not performed over the entire substrate S, processing proceeds to S202 in order to expose an unexposed shot region on the substrate. On the other hand, when exposure is being performed over the entire substrate S, the exposure process is finished.

Here, with respect to such an exposure process, the influence which vibration from the floor surface on which the exposure apparatus 1 is installed and the movement of the stage 105 holding the board|substrate S exerts is demonstrated. The stage 105 is placed on the surface plate 110 as described above. The surface plate 110 is affected by vibration from the floor on which the exposure apparatus 1 is installed, a reaction force of the movement of the stage 105 , etc., and mainly vibrates at a frequency based on the inherent value of the surface plate 110 . . Accordingly, in S203 , the measurement value (height position of the substrate S) obtained by the measurement unit 106 includes an error due to the vibration of the stage 105 propagated through the surface plate 110 . Similarly, even while the substrate S is being exposed (S205), the vibration of the stage 105 is affected. The stage 105 is controlled by the control unit 109 so that focusing is performed, but since the vibration of the surface plate 110 is unobservable, defocus occurs due to its influence.

With reference to FIG. 3 , the defocus caused by the vibration of the surface plate 110 will be described in detail. Fig. 3 is a diagram showing a change in the height position of the substrate S after the stage 105 is moved to the exposure position. Referring to FIG. 3 , the natural frequency of the surface plate 110 is changed over a long period of time by receiving a reaction force generated by the movement of the stage 105 or vibration from the floor, and the height position of the substrate S (stage 105 ) is changed over a long period of time. It can be seen that it fluctuates (oscillates) at the frequency f of Mp is a measurement period during which the measurement unit 106 measures the height position of the substrate S. After moving the stage 105 to the exposure position, in a state in which the height position of the substrate S held by the stage 105 is fluctuating due to vibration from the surface plate 110 , the measurement unit 106 is configured to Measuring the height position. Ef is an exposure period in which the substrate S is exposed after focusing the substrate S based on the height position of the substrate S measured by the measurement unit 106 . Also in the exposure period E, similarly to the measurement period Mp, the substrate S is exposed in a state in which the height position of the substrate S held by the stage 105 fluctuates due to the vibration from the surface plate 110 .

4 shows each measurement start when the measurement period Mp is set to 0.4 x (1/f) in the case where the height position of the surface plate 110, ie, the substrate S, vibrates at the amplitude A and the frequency f. It is a diagram showing the amount of measurement error according to timing. In addition, the measurement start timing is the start timing of the measurement period Mp at which the measurement part 106 starts measurement of the height position of the board|substrate S. Referring to Fig. 4, when the height position of the substrate S is oscillating at the amplitude A, a period that does not coincide with the oscillation period 1/f, which is the reciprocal of the frequency f, is set as the measurement period Mp. The measurement error amount varies according to the start timing. Accordingly, the measurement value obtained by measuring the height position of the substrate S by the measurement unit 106 includes a measurement error as shown in Fig. 4, which causes defocusing in focusing of the substrate S.

Therefore, in the present embodiment, by acquiring in advance the vibration period and frequency of the surface plate 110 on which the stage 105 is placed, and setting the measurement period Mp according to the vibration period and frequency of the surface plate 110 , the measurement unit 106 Reduce the influence of measurement error included in the measurement value of In other words, by averaging the measurement errors included in the measurement values of the measurement unit 106 (cancelling each other) and focusing the substrate S accordingly, the influence of the vibration of the unobservable surface plate 110 is reduced.

Fig. 5 shows that when the measurement period Mp is set to t1 (incongruent with oscillation period (1/f)), t2 (inconsistent with oscillation period (1/f)), and t3 (congruent with oscillation period (1/f)) It is a diagram showing the measurement error amount according to each measurement start timing. Referring to Fig. 5, by setting the measurement period Mp to an integer multiple of 1/f of the vibration period of the surface plate 110, the measurement error amount is averaged and reduced (zero) regardless of the measurement start timing. Able to know. Accordingly, in the present embodiment, the measurement period Mp is set to an integer multiple (t3) of the vibration period 1/f of the surface plate 110 .

Also, when exposing the substrate S (S205), by setting the exposure period E to an integer multiple of the vibration period 1/f of the surface plate 110, the height position of the substrate S caused by the vibration of the surface plate 110 is The influence of fluctuations is also averaged (reduced), and further improvement in precision can be realized. At this time, in accordance with the exposure period E set to an integer multiple of the vibration period 1/f of the surface plate 110 , the intensity of light exposing the substrate S may be controlled so that the exposure amount on the substrate S becomes the target exposure amount.

Next, with reference to FIG. 6, an example of the process of acquiring the vibration period of the surface plate 110 and setting the measurement period Mp in which the measuring part 106 measures the height position of the board|substrate S is demonstrated. Such processing is performed, for example, in the preparation period before the main exposure period (before exposure of the substrate S is performed) in which the exposure processing shown in Fig. 2 is performed. Since the surface plate 110 is a large structure, the frequency of its vibration is generally 100 Hz or less. On the other hand, in the present embodiment, since the focus sensor configured as the measurement unit 106 has a measurement band of, for example, 2 kHz or more, it is sufficiently high speed than twice the maximum frequency of vibration that can occur in the surface plate 110 . can be measured with

In S601, similarly to S201, the substrate S is loaded into the exposure apparatus 1 . In S602, similarly to S202, the stage 105 holding the substrate S is moved to the exposure position.

In S603, the fluctuation|variation in the height position of the board|substrate S resulting from the vibration of the surface plate 110 is acquired. Specifically, while moving the stage 105 so that the substrate S is positioned under the projection optical system 104 or after moving the stage 105 for a predetermined period of time, the stage 105 is The height position of the substrate S held in the substrate S is continuously measured at high speed. Accordingly, it is possible to obtain a change in the height position of the substrate S due to the vibration of the surface plate 110 affected by vibration from the floor on which the exposure apparatus 1 is installed, a reaction force of movement of the stage 105, or the like. have.

In S604, the vibration period 1/f of the surface plate 110 (or the frequency f of the vibration of the surface plate 110) is calculated|required from the fluctuation|variation in the height position of the board|substrate S acquired in S603.

In S605, the measurement period Mp during which the measurement unit 106 measures the height position of the substrate S is an integer multiple of the oscillation period of the surface plate 110 obtained in S604 ((1/f)×n (n=1,2,3) ,...)). In addition, from the viewpoint of throughput, it is clear that it is advantageous to set the measurement period Mp to one period (one time) of the vibration period of the surface plate 110 . However, depending on the response characteristics of the focus sensor configured as the measurement unit 106 , a case where the measurement speed is slower than the vibration period of the surface plate 110 may be considered. In this case, the measurement period Mp may be set to an integer multiple of the oscillation period of the surface plate 110 so that the measurement speed is satisfied and the measurement period Mp is the shortest.

In this embodiment, although the vibration period (frequency of vibration (excellent frequency)) of the surface plate 110 is acquired using the measurement part 106, it is not limited to this. For example, on the basis of the vibration frequency of the stage 105 or the sensor 108 between the surfaces, from the vibrations propagating through the connecting portions connecting the respective parts of the exposure apparatus 1, the unique excellent frequency component of the surface plate 110 is obtained. By separating, the vibration period of the surface plate 110 may be obtained. Further, the vibration period of the surface plate 110 may be obtained by estimating the vibration of the surface plate 110 based on the design value of the stage 105 and the design value of the surface plate 110 .

In addition, in this embodiment, in the preparation period of this exposure period WHEREIN: Although the case where the oscillation period of the surface plate 110 is calculated|required was demonstrated, the timing which calculates|requires the oscillation period of the surface plate 110 is not limited. For example, after loading the first substrate among the plurality of substrates included in the lot into the exposure apparatus 1, in the period before exposing the first substrate (for example, the period between S202 and S203) The vibration period of the surface plate 110 may be calculated|required. In this case, the period before exposing the leading substrate (for example, the period during which the steps S201 and S202 are performed) is regarded as the preparation period, and the period for actually exposing the leading substrate (eg, S203 to S205). period) is considered as this exposure period.

In addition, when it is estimated from the measurement value of the measurement part 106 that the vibration period of the surface plate 110 calculated|required in advance changes with time, what is necessary is just to adjust the measurement period Mp according to the change with time.

In this way, according to the exposure apparatus 1 of the present embodiment, by setting the measurement period Mp or the exposure period Ep to an integer multiple of the vibration period of the surface plate 110 , the influence of vibration of the surface plate 110 is reduced, and high precision. of exposure can be realized.

In addition, since the vibration of the surface plate 110 is caused by the reaction force of the movement of the stage 105, the frequency of vibration of the surface plate 110 after moving the stage 105 to the exposure position is that of the shot region of the substrate S. It is calculated|required all at once by a layout (exposure layout). As shown in Fig. 7, it is considered that the stage 105 is moved so that the shot region located at the exposure position becomes the shot region Sb from the shot region Sa. Fig. 8 is a diagram showing variations in the height position of the substrate S after the stage 105 is moved so that the shot region located at the exposure position becomes the shot region Sb from the shot region Sb. The movement time T0 of the stage 105 required to change the shot area located at the exposure position from the shot area Sb to the shot area Sb is the size of the shot area (movement distance of the stage 105 ) and the movement of the stage 105 . From the speed, the time is determined by the exposure layout. Since the vibration of the surface plate 110 generates vibration by the reaction force of the movement of the stage 105, the vibration of the surface plate 110 is obtained for each shot region, and after the stage 105 is moved, the The oscillation phase can also be obtained.

As described above, it is possible to obtain the vibration phase of the surface plate 110 from the fluctuation of the height position of the substrate S, the moving distance and the moving speed of the stage 105 . By obtaining the vibration phase of the surface plate 110 , the time T1 from when the stage 105 moves to the exposure position until measurement of the height position of the substrate S is started is the maximum or minimum amplitude of vibration of the surface plate 110 . It can be set to the timing (phase angle of 90 degrees or 270 degrees). Accordingly, it becomes possible to set the measurement period Mp during which the measurement unit 106 measures the height position of the substrate S to 1/2 of the vibration period 1/f of the surface plate 110, thereby shortening the measurement period Mp. can do. Fig. 9 is a diagram showing the measurement error amount according to each measurement start timing when the measurement period Mp is set to 1/2f with respect to the vibration (amplitude A, frequency f) of the surface plate 110 . In Fig. 9, 901, 902, 903, 904, 905, and 906 indicate timings at which the amplitude of vibration of the surface plate 110 becomes maximum or minimum. Measurement included in the measurement value of the measurement unit 106 by setting the start timing of the measurement period Mp at which the measurement unit 106 starts measurement of the height position of the substrate S to the timing 901 , 902 , 903 , 904 , 905 or 906 . It can be made small by averaging the errors.

In this way, the measurement period Mp is set to 1/2 of the vibration period of the surface plate 110, and the start timing of the measurement period Mp is set to a timing at which the vibration amplitude of the surface plate 110 is maximum or minimum. It is possible. In this case, while the measurement period Mp is shortened, the measurement errors included in the measurement values of the measurement unit 106 are averaged, and the influence of the vibration of the unobservable surface plate 110 can be reduced.

The manufacturing method of the article|goods in embodiment of this invention is suitable for manufacture of articles|goods, such as a flat panel display, a liquid crystal display element, a semiconductor element, and MMS, for example. Such a manufacturing method includes the process of exposing the board|substrate to which the photosensitive agent was apply|coated using the exposure apparatus 1 mentioned above, and the process of developing the exposed photosensitive agent. Further, an etching process, an ion implantation process, etc. are performed on the substrate using the developed photosensitizer pattern as a mask to form a circuit pattern on the substrate. These steps of exposure, development, etching, etc. are repeated to form a circuit pattern composed of a plurality of layers on the substrate. In a subsequent process, dicing (processing) is performed with respect to the board|substrate on which the circuit pattern was formed, and chip mounting, bonding, and an inspection process are performed. In addition, such a manufacturing method may include other well-known processes (oxidation, film formation, vapor deposition, doping, planarization, resist stripping, etc.). The method for manufacturing an article according to the present embodiment is advantageous in at least one of the performance, quality, productivity, and production cost of the article as compared with the prior art.

The invention is not limited to the above embodiments, and various changes and modifications are possible without departing from the spirit and scope of the invention. Accordingly, the claims are attached to clarify the scope of the invention.

Claims (17)

An exposure apparatus for exposing a substrate through an original plate,
a stage for holding and moving the substrate;
a surface plate on which the stage is placed;
a projection optical system for projecting the pattern of the original plate onto the substrate;
a measuring unit for measuring a position in the height direction of the substrate held on the stage;
having a control,
The control unit is
The position in the height direction is measured by the measurement unit in a measurement period set to an integer multiple of the vibration period of the surface plate that vibrates by the movement of the stage,
The exposure apparatus according to claim 1, wherein a distance between the projection optical system and the stage holding the substrate to be exposed is controlled based on a position in the height direction of the substrate measured by the measurement unit.
The method of claim 1,
The exposure apparatus according to claim 1, wherein the control unit sets the measurement period to an integer multiple of an oscillation period of the surface plate before exposing the substrate.
3. The method of claim 2,
The control unit measures the height direction of the substrate held by the stage for a predetermined period while moving the stage or after moving the stage so that the substrate is positioned below the projection optical system, in the measurement unit. The exposure apparatus according to claim 1, wherein the oscillation period is obtained from a change in the position in the height direction of the substrate in the predetermined period.
The method of claim 1,
After controlling the distance, the control unit exposes the substrate in an exposure period set to an integer multiple of an oscillation period of the surface plate.
5. The method of claim 4,
The exposure apparatus according to claim 1, wherein the control unit sets the exposure period to an integer multiple of an oscillation period of the surface plate before exposing the substrate.
5. The method of claim 4,
The exposure apparatus according to claim 1, wherein the control unit controls the intensity of light for exposing the substrate so that the exposure amount of the substrate becomes a target exposure amount in accordance with the exposure period set to an integer multiple of the vibration period of the surface plate.
3. The method of claim 2,
The said control part calculates|requires the said vibration period by estimating the vibration of the said surface plate by movement of the said stage based on the design value of the said stage and the design value of the said surface plate, The exposure apparatus characterized by the above-mentioned.
The method of claim 1,
The said exposure apparatus is an exposure apparatus of a step-and-repeat system, The exposure apparatus characterized by the above-mentioned.
An exposure apparatus for exposing a substrate through an original plate,
a stage for holding and moving the substrate;
a surface plate on which the stage is placed;
a projection optical system for projecting the pattern of the original plate onto the substrate;
a measuring unit for measuring a position in the height direction of the substrate held on the stage;
having a control,
The control unit is
In the measurement period set to 1/2 of the oscillation period of the surface plate vibrated by the movement of the stage, the height of the substrate from the timing at which the vibration amplitude of the surface plate vibrated by the movement of the stage becomes maximum or minimum The position of the direction is measured by the measuring unit,
The exposure apparatus according to claim 1, wherein a distance between the projection optical system and the stage holding the substrate to be exposed is controlled based on a position in the height direction of the substrate measured by the measurement unit.
10. The method of claim 9,
The control unit sets the measurement period to an integer multiple of an oscillation period of the surface plate before exposing the substrate, and sets a timing at which the measurement unit starts measuring the position of the substrate in the height direction of the surface plate. An exposure apparatus characterized by setting the timing at which the vibration amplitude becomes maximum or minimum.
11. The method of claim 10,
The control unit measures the height direction of the substrate held by the stage for a predetermined period while moving the stage or after moving the stage so that the substrate is positioned below the projection optical system, in the measurement unit. The oscillation period is obtained from the fluctuation of the position in the height direction of the substrate in the predetermined period obtained by exposure apparatus.
12. The method of claim 11,
The said control part sets the timing at which the said measuring part starts measurement of the position of the height direction of the said board|substrate based on the vibration phase of the said surface plate, The exposure apparatus characterized by the above-mentioned.
10. The method of claim 9,
The said exposure apparatus is an exposure apparatus of a step-and-repeat system, The exposure apparatus characterized by the above-mentioned.
Exposure comprising: a stage holding and moving a substrate; a surface plate on which the stage is placed; a projection optical system for projecting a pattern of an original plate onto the substrate; An exposure method for exposing the substrate using an apparatus,
The position in the height direction is measured by the measurement unit in a measurement period set to an integer multiple of the vibration period of the surface plate that vibrates by the movement of the stage,
and controlling a distance between the projection optical system and the stage holding the substrate to be exposed, based on the position in the height direction of the substrate measured by the measurement unit.
Exposure comprising: a stage holding and moving a substrate; a surface plate on which the stage is placed; a projection optical system for projecting a pattern of an original plate onto the substrate; An exposure method for exposing the substrate using an apparatus,
In the measurement period set to 1/2 of the oscillation period of the surface plate vibrated by the movement of the stage, the height of the substrate from the timing at which the vibration amplitude of the surface plate vibrated by the movement of the stage becomes maximum or minimum The position of the direction is measured by the measuring unit,
and controlling a distance between the projection optical system and the stage holding the substrate to be exposed, based on the position in the height direction of the substrate measured by the measurement unit.
The process of exposing a board|substrate using the exposure apparatus of Claim 1;
developing the exposed substrate;
A process of manufacturing an article from the developed substrate,
A method of manufacturing an article, characterized in that it has
The process of exposing a board|substrate using the exposure apparatus of Claim 9;
developing the exposed substrate;
A process of manufacturing an article from the developed substrate,
A method of manufacturing an article, characterized in that it has

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