TW202234171A - Exposure apparatus, method thereof, and method of manufacturing article Provide an exposure apparatus, which exposes a substrate through an original. - Google Patents

Abstract

This invention provides an exposure apparatus, which exposes a substrate through an original. The mentioned exposure apparatus includes: a mounting table that is movable while holding a substrate; a flat plate that is placed on the substrate; a projection optical system that projects the pattern of an original onto the substrate; a measuring unit that measures the height position of the substrate held on the mounting table; and a control unit. The above-mentioned control unit: it measure the height direction through the above-mentioned measuring unit in a measurement period that is set to an integer multiple of a vibration cycle of the above-mentioned flat plate, which vibrates due to movement of the above-mentioned mounting table; and it controls the distance between the above-mentioned projection optical system and the above-mentioned mounting table holding the above-mentioned exposed substrate, based upon the position of the height direction of the above-mentioned substrate, which is measured by the above-mentioned measuring unit.

Description

Exposure apparatus, exposure method, and manufacturing method of article

The present invention relates to an exposure apparatus, an exposure method, and a method of manufacturing an article.

In the lithography process of the apparatus which manufactures a semiconductor element etc., the exposure apparatus which exposes a board|substrate via an original plate (mask or a reticle) generally, and transfers the pattern of an original plate to a board|substrate is used. As such an exposure apparatus, a step-and-repeat-type exposure apparatus (stepper) and an exposure apparatus (scanner) using a step-and-scan type are generally known. The stepper exposure machine is a low-cost device compared to the scanning exposure machine, and is used in a process that does not require high resolution and high-precision overlapping. In the stepper exposure machine, after driving the substrate stage holding the substrate to below the projection optical system (exposure position), the position of the substrate in the height direction (the distance from the projection optical system) is measured with the focus sensor, and the The measured value drives the substrate stage to focus the substrate with respect to the projection optical system. A technique related to the measurement of the position in the height direction of such a substrate has been proposed in Japanese Patent Application Laid-Open No. 11-87233.

[The problem to be solved by the invention] However, in the stepper, the measurement value of the focus sensor includes an error due to vibration of the substrate table holding the substrate to be measured. Among these errors, the control deviation of the substrate stage can be corrected by removing the measured value, but unobservable components such as vibration of the plate on which the substrate stage is placed cannot be corrected, resulting in defocusing. Since the stepper exposure machine needs to be implemented as a low-cost device, it is not realistic to provide a sensor for measuring the vibration of the flat panel and to perform control in real time. Accordingly, the present invention provides an exposure apparatus that is advantageous in that the influence of the vibration of the flat plate is reduced and high-precision exposure is realized. [Means for solving problems] An exposure apparatus according to an aspect of the present invention is an exposure apparatus that exposes a substrate through an original plate, and the exposure apparatus includes a stage that moves while holding the substrate, a flat plate on which the stage is placed, and a projection optical system , which projects the pattern of the original plate on the substrate; a measuring unit that measures the position in the height direction of the substrate held on the stage; and a control unit; Measuring the position in the height direction through the measurement unit during a measurement period that is an integral multiple of the vibration period of the plate that moves and vibrates; and controlling the projection optics based on the position in the height direction of the substrate measured through the measurement unit The distance between the system and the aforementioned stage that maintains the aforementioned substrate to be exposed. Further objects and other aspects of the present invention will be made clear by the embodiments described below with reference to the drawings. [Compared to the efficacy of the prior art] According to the present invention, for example, it is possible to provide an exposure apparatus which is advantageous in realizing high-precision exposure by reducing the influence of vibration of the flat plate.

Hereinafter, embodiments will be described in detail with reference to the drawings. In addition, the following embodiments do not limit the scope of the claims of the inventors. Although a plurality of features are described in the embodiments, all of these features are not necessarily required for the invention, and a plurality of features may be arbitrarily combined. In addition, in the drawings, the same or the same components are denoted by the same reference numerals, and repeated descriptions are omitted. FIG. 1 is a schematic diagram illustrating the configuration of an exposure apparatus 1 according to an aspect of the present invention. The exposure apparatus 1 is used in the manufacturing process of apparatuses, such as a semiconductor element, and is a photolithography apparatus which exposes a board|substrate via an original plate, and forms a pattern on a board|substrate. The exposure apparatus 1 is a step-and-repeat type exposure apparatus (stepper) in this embodiment. Here, the step-and-repeat method is an exposure method in which the substrate is moved stepwise for one shot exposure of the shot region of the substrate, and the next shot region is moved to the exposure position (exposure region). The exposure apparatus 1 includes an illumination optical system 102 , a projection optical system 104 , a stage 105 that moves while holding the substrate S, a measurement unit 106 , a structure 107 , a sensor 108 between plates, a control unit 109 , and a flat plate on which the stage 105 is placed 110. In addition, in this specification and a drawing, the direction parallel to the surface of the board|substrate S is represented by the XYZ coordinate system of the XY plane. Let the directions parallel to the X, Y, and Z axes in the XYZ coordinate system be the X direction, the Y direction, and the Z direction, respectively, and let the rotation around the X axis, the rotation around the Y axis, and the rotation around the Z axis be θX, respectively , θY and θZ. The illumination optical system 102 guides light from the light source 101 to illuminate the original plate 103 . The light source 101 includes, for example, an i-ray mercury lamp, an excimer laser, or the like. On the original plate 103, a pattern to be transferred to the substrate S is drawn. The projection optical system 104 projects the pattern (pattern image) of the original plate 103 on the substrate S. In the exposure apparatus 1 , the light passing through the original plate 103 is imaged on the substrate held on the stage 105 via the projection optical system 104 . The pattern image projected on the board|substrate S reacts with the photosensitive material, such as a resist layer apply|coated to the board|substrate S, by developing this board|substrate S, a pattern is formed on the board|substrate. Further, as described above, by stepping the stage 105 holding the substrate S to sequentially expose the irradiation area of the substrate S (that is, repeating the step movement and exposure), the entire irradiation area of the substrate S can be exposed. exposure. The position and orientation of the stage 105 are measured by a position measuring device including an interferometer, an encoder, and the like, and are managed with high precision under the control of the control unit 109 based on the measured values. In this way, by managing the position and posture of the stage 105, it is possible to achieve high-precision superposition. The measurement unit 106 measures the position in the height direction (Z direction) of the substrate S held on the stage 105 (hereinafter, referred to as "the height position of the substrate S"). When exposing the substrate S, it is necessary to match the height position and the inclination of the substrate S with respect to the position of the pattern image projected from the projection optical system 104 , that is, to focus the substrate S with respect to the imaging plane of the projection optical system 104 . . Therefore, the measurement unit 106 measures the height position of the substrate S, and based on the measured value, the substrate S is controlled by the control unit 109 so that the substrate S is focused with respect to the imaging plane of the projection optical system 104 to hold the substrate S. At least one of the position and posture of the stage 105 is controlled. In the present embodiment, the measurement unit 106 is constituted by a focus sensor that performs optical detection, but it is not limited to this, and other detection methods using a capacitance sensor, a pressure sensor, or the like may be used. Way. Moreover, in order to acquire the inclination of the board|substrate S in addition to the height of the board|substrate S, in the exposure area|region on the board|substrate, the some measurement point (measurement point) which transmits the measurement part 106 and measures the height position is provided. The projection optical system 104 and the measurement unit 106 are held by a structure 107 that is raised via a vibration canceling device so as not to be affected by disturbance vibration. The inter-plate sensor 108 includes, for example, a displacement sensor, and measures the distance between the structure 107 and the plate 110 . Here, the position of the projection optical system 104 with respect to the structure 107 is secured, and the position of the stage 105 with respect to the flat plate 110 is secured. Therefore, the distance between the projection optical system 104 and the stage 105 can be obtained by measuring the distance between the structure 107 and the flat plate 110 by the inter-plate sensor 108 . The control unit 109 is constituted by a computer including a CPU, a memory, and the like, and controls the various parts of the exposure apparatus 1 as a whole according to a program stored in the memory unit, for example, to operate the exposure apparatus 1 . The control unit 109 is based on information on the height and inclination of the substrate S obtained by the measuring unit 106 and information on the distance (variation) between the projection optical system 104 and the stage 105 obtained by the inter-plate sensor 108 And (movement of) the stage 105 is controlled. The control unit 109 controls, for example, so-called step-and-repeat exposure in which the entire area of the substrate S is exposed by repeating the exposure of the shot region on the substrate while moving the stage 105 stepwise. 2 , the operation of the exposure apparatus 1 will be described, and specifically, the exposure process (exposure method) of exposing the substrate S via the original plate 103 to transfer the pattern of the original plate 103 to the substrate S will be described. This exposure process is performed by the control unit 109 as a whole by controlling each part of the exposure apparatus 1 . In S201 , the substrate S is carried into the exposure apparatus 1 . Specifically, the substrate S is carried into the exposure apparatus 1 via a substrate transfer unit (not shown), and the substrate S is held by the stage 105 . In S202, the stage 105 holding the substrate S is moved to the exposure position. For example, the stage 105 holding the substrate S is moved so that the irradiation area on the substrate (the irradiation area to be exposed next) is positioned at the exposure position below the projection optical system 104 . In S203 , the height position of the substrate S held on the stage 105 at the exposure position located below the projection optical system 104 is measured through the measuring unit 106 . In S204, position alignment (focusing) in the height direction of the substrate S is performed. Specifically, based on the height position of the substrate S measured in S203, at least one of the position and posture of the stage 105 holding the substrate S is controlled so that the substrate S is focused on the imaging plane of the projection optical system 104 By. In other words, the distance between the projection optical system 104 and the stage 105 is controlled so that the substrate S is focused on the imaging plane of the projection optical system 104 by moving the stage 105 . In S205 , the exposure of the substrate S focused in S204 is performed via the original plate 103 . In S206, it is determined whether or not the entire area of the substrate S has been exposed, that is, whether or not the entire irradiated area on the substrate has been exposed. When the whole area of the substrate S is not exposed, the process proceeds to S202 in order to expose the unexposed shot area on the substrate. On the other hand, when the whole area|region of the board|substrate S has been exposed, the exposure process is complete|finished. Here, the vibration from the bottom surface on which the exposure apparatus 1 is installed and the movement of the stage 105 holding the substrate S will be described on the influence of such exposure processing. The stage 105 is placed on the flat plate 110 as described above. The flat plate 110 vibrates mainly at a frequency based on the natural value of the flat plate 110 under the influence of vibration from the bottom surface on which the exposure apparatus 1 is installed, reaction force of the movement of the stage 105 , and the like. Therefore, in S203 , the measurement value (height position of the substrate S) obtained by the measurement unit 106 includes an error due to the vibration of the stage 105 propagating through the flat plate 110 . Similarly, during the period of exposing the substrate S ( S205 ), it is also affected by the vibration of the stage 105 . The stage 105 is controlled by the control unit 109 for focusing, but the vibration of the flat plate 110 is not observable, so defocusing occurs due to this influence. Defocusing caused by vibration of the flat plate 110 will be specifically described with reference to FIG. 3 . 3 : is a figure which shows the fluctuation|variation of the height position of the board|substrate S after moving the stage 105 to an exposure position. Referring to FIG. 3 , it can be seen that the height position of the substrate S (the stage 105 ) is subjected to the reaction force generated by the movement of the stage 105 and the vibration from the ground at the frequency f of the natural vibration frequency of the flat plate 110 over a long period of time. Make a change (vibrate). Mt is a measurement period during which the measurement unit 106 measures the height position of the substrate S. After the stage 105 is moved to the exposure position, the measurement unit 106 measures the height position of the substrate S while the height position of the substrate S held on the stage 105 is fluctuated by vibration from the flat plate 110 . Et is an exposure period in which the substrate S is exposed after focusing on the substrate S based on the height position of the substrate S measured by the measuring unit 106 . In the exposure period Et, like the measurement period Mt, the substrate S is exposed in a state where the height position of the substrate S held on the stage 105 is fluctuated due to vibration from the flat plate 110 . 4 is a graph showing a measurement error amount obtained by setting the measurement period Mt to 0.4×( 1/f) corresponds to each measurement start sequence. In addition, the measurement start sequence is the start sequence of the measurement period Mt in which the measurement unit 106 starts the measurement of the height position of the substrate S. Referring to FIG. 4 , when the height position of the substrate S vibrates with the amplitude A, and the period that does not coincide with the vibration period (1/f), which is the reciprocal of the frequency f, is set as the measurement period Mt, the amount of measurement error depends on The measurement start timing changes. Therefore, since the measurement value obtained by measuring the height position of the substrate S by the measuring unit 106 includes measurement errors as shown in FIG. 4 , focusing on the substrate S becomes a factor of defocusing. Therefore, in the present embodiment, the vibration period and frequency of the flat plate 110 on which the stage 105 is placed are obtained in advance, and the measurement period Mt is set according to the vibration period and frequency of the flat plate 110, thereby reducing the measurement included in the measurement value of the measurement unit 106. effect of errors. In other words, the measurement errors included in the measurement values of the measurement unit 106 are averaged (cancel each other), and the substrate S is focused on the basis thereof, thereby reducing the influence of the vibration of the unobservable flat plate 110 . FIG. 5 is a diagram illustrating a measurement error amount, which corresponds to setting the measurement period Mt to t1 (does not match the vibration period (1/f)) and t2 (does not match the vibration period (1/f)) ) and t3 (corresponding to each measurement start sequence at the time of the vibration period (1/f)). 5 , setting the measurement period Mt to an integral multiple of the vibration period 1/f of the plate 110 makes the measurement error amount averaged and reduced (to be zero) irrespective of the measurement start timing. Therefore, in the present embodiment, the measurement period Mt is set to be an integer multiple (t3) of the vibration period 1/f of the flat plate 110 . In addition, when exposing the substrate S ( S205 ), the exposure period Et is also set to an integer multiple of the vibration period 1/f of the plate 110 so that the fluctuation of the height position of the substrate S due to the vibration of the plate 110 is affected is also averaged (reduced) for further accuracy improvements. In this case, the intensity of light for exposing the substrate S may be controlled so that the exposure amount of the substrate S becomes the target exposure amount according to the exposure period Et set to be an integer multiple of the vibration period 1/f of the plate 110 . Next, an example of a process of acquiring the vibration period of the flat plate 110 and setting the measurement period Mt in which the measurement unit 106 measures the height position of the substrate S will be described with reference to FIG. 6 . This process is performed, for example, in a preparation period before this exposure period (before exposure of the substrate S is performed) in which the exposure process shown in FIG. 2 is performed. Since the flat plate 110 is a large structure, the frequency of the vibration is generally 100 Hz or less. On the other hand, in the present embodiment, since the focus sensor configured as the measurement unit 106 has a measurement bandwidth of, for example, 2 kHz or more, it is possible to perform the measurement at a high speed sufficiently higher than twice the maximum frequency of vibration that may be generated by the flat panel 110 . Measure. In S601 , like S201 , the substrate S is carried into the exposure apparatus 1 . In S602, as in S202, the stage 105 holding the substrate S is moved to the exposure position. In S603, the fluctuation of the height position of the substrate S due to the vibration of the flat plate 110 is acquired. Specifically, while the stage 105 is moved while the substrate S is located under the projection optical system 104 or after the stage 105 is moved, the substrate S held on the stage 105 is transmitted through the measuring unit 106 at high speed and continuously for a predetermined period of time. Measure the height position. Accordingly, fluctuations in the height position of the substrate S due to vibration of the flat plate 110 under the influence of vibration from the bottom surface on which the exposure apparatus 1 is installed, reaction force of the movement of the stage 105, and the like can be obtained. In S604, the vibration period 1/f of the flat plate 110 (or the frequency f of the vibration of the flat plate 110) is obtained from the change in the height position of the substrate S acquired in S603. In S605 , the measurement period Mt during which the measurement unit 106 measures the height position of the substrate S is set to an integer multiple of the vibration period of the plate 110 obtained in S604 ((1/f)×n (n=1, 2, 3 ,…)). In addition, from the viewpoint of the throughput, it is obviously advantageous to set the measurement period Mt to be one cycle (1 time) of the vibration cycle of the flat plate 110 . However, the measurement speed may be slower than the vibration period of the flat panel 110 depending on the responsiveness or the like of the focus sensor configured as the measurement unit 106 . In such a case, the measurement period Mt may be set to an integer multiple of the vibration period of the plate 110 so that the measurement period Mt becomes the shortest in accordance with the measurement speed. In the present embodiment, the vibration period (frequency (main frequency) of vibration) of the flat plate 110 is obtained by using the measurement unit 106, but it is not limited to this. For example, based on the vibration frequencies of the stage 105 and the sensor 108 between the plates, the main frequency components specific to the plate 110 may be separated from the vibration propagating through the connecting portion connecting the respective parts of the exposure apparatus 1 to obtain the The vibration period of the plate 110 . In addition, the vibration period of the flat plate 110 may be obtained by estimating the vibration of the flat plate 110 based on the design value of the stage 105 and the design value of the flat plate 110 . In addition, in the present embodiment, the case of obtaining the vibration period of the flat plate 110 in the preparation period of the exposure period has been described, but the timing of obtaining the vibration period of the flat plate 110 is not limited. For example, the period before the exposure of the first substrate among the plurality of substrates included in the batch may be carried out to the exposure apparatus 1 (for example, the period between S202 and S203 ) The vibration period of the flat plate 110 is obtained. In this case, the period up to the exposure of the initial substrate (for example, the period in which the procedures of S201 and S202 are performed) is regarded as the preparation period, and the period for actually exposing the initial substrate (for example, the period in which the procedures from S203 to S202 are performed) The period of the procedure of S205) is regarded as this exposure period. In addition, when it is estimated from the measurement value of the measurement part 106 that the vibration period of the plate 110 obtained in advance changes over time, the measurement period Mt may be adjusted according to the time change. As described above, according to the exposure apparatus 1 of the present embodiment, the measurement period Mt and the exposure period Et are set to integer multiples of the vibration period of the plate 110, thereby reducing the influence of the vibration of the plate 110 and realizing high-precision exposure. In addition, the vibration of the flat plate 110 is mainly caused by the reaction force of the movement of the stage 105. Therefore, the frequency of the vibration of the flat plate 110 after the stage 105 has been moved to the exposure position is determined by the layout (exposure layout) of the irradiation area of the substrate S. Find unique values. Consider the case where the stage 105 is moved so that the shot region located at the exposure position is changed from shot region Sa to shot region Sb as shown in FIG. 7 . FIG. 8 is a diagram illustrating a change in the height position of the substrate S after the stage 105 is moved so that the shot region located at the exposure position is changed from the shot region Sa to the shot region Sb. The moving time T0 of the stage 105 required to change the shot area at the exposure position from the shot area Sa to the shot area Sb is determined from the size of the shot area (the moving distance of the stage 105 ) and the moving speed of the stage 105 through the exposure time determined by the layout. The vibration of the flat plate 110 is excited by the reaction force of the movement of the stage 105, so by obtaining the vibration of the flat plate 110 for each radiation area, the vibration phase of the flat plate 110 after the stage 105 is moved can also be obtained. As described above, the vibration phase of the flat plate 110 can be obtained from the fluctuation of the height position of the substrate S, the moving distance and the moving speed of the stage 105 . The vibration phase of the plate 110 is obtained so that the time T1 from when the stage 105 is moved to the exposure position until the measurement of the height position of the substrate S is started can be set as the time sequence (phase angle) at which the amplitude of the vibration of the plate 110 becomes maximum or minimum. 90 degrees or 270 degrees). Accordingly, the measurement period Mt during which the measurement unit 106 measures the height position of the substrate S can be set to 1/2 of the vibration period (1/f) of the flat plate 110, and the measurement period Mt can be shortened. FIG. 9 is a graph showing the amount of measurement error corresponding to each measurement start timing when the measurement period Mt is set to 1/2f with respect to the vibration (amplitude A, frequency f) of the plate 110 . In FIG. 9 , 901 , 902 , 903 , 904 , 905 , and 906 indicate the time sequence when the amplitude of the vibration of the flat plate 110 becomes the maximum or minimum. By setting the start sequence of the measurement period Mt in which the measurement unit 106 starts the measurement of the height position of the substrate S as sequence 901 , 902 , 903 , 904 , 905 or 906 , the measurement error included in the measurement value of the measurement unit 106 can be averaged reduced and reduced. In this way, the measurement period Mt may be set to 1/2 of the vibration period of the flat panel 110 and the start timing of the measurement period Mt may be set to the timing at which the vibration amplitude of the flat panel 110 becomes the maximum or minimum. In this case, the measurement error included in the measurement value of the measurement unit 106 can be averaged while the measurement period Mt is shortened, and the influence of the vibration of the flat plate 110 which is not observable can be reduced. The manufacturing method of the article in the embodiment of the present invention is suitable for manufacturing articles such as flat panel displays, liquid crystal display elements, semiconductor elements, and MEMS, for example. This manufacturing method includes: a process of exposing the substrate coated with the photosensitive agent using the above-described exposure apparatus 1; and a process of developing the exposed photosensitive agent. In addition, an etching process, an ion implantation process, etc. are performed on the substrate using the pattern of the developed photosensitive agent as a mask to form a circuit pattern on the substrate. These procedures of exposure, development, etching, etc. are repeated to form a circuit pattern composed of a plurality of layers on the substrate. In the subsequent process, the substrate on which the circuit pattern is formed is diced (processed), and the wafer mounting, bonding, and inspection processes are performed. In addition, the manufacturing method may include other well-known procedures (oxidation, film formation, evaporation, doping, planarization, resist lift-off, etc.). The manufacturing method of the article according to the present embodiment is more advantageous to at least one of the performance, quality, productivity, and production cost of the article than conventionally. The invention is not limited to the above-described embodiments, and various changes and modifications can be made without departing from the spirit and scope of the invention. Therefore, the scope of the patent application is written to disclose the scope of the invention.

1: Exposure device 101: Light source 102: Illumination Optical System 103: Original 104: Projection Optical System 105: Stage 106: Measurement Department 107: Construct 108: Sensor between plates 109: Control Department 110: Flat S: substrate Sa: Irradiated area Sb: Irradiated area

FIG. 1 is a schematic diagram illustrating a configuration of an exposure apparatus according to an aspect of the present invention. [ Fig. 2] Fig. 2 is a flowchart for explaining exposure processing through the exposure apparatus shown in Fig. 1 . [ Fig. 3] Fig. 3 is a diagram illustrating an example of variation in the height position of the substrate. [ Fig. 4] Fig. 4 is a diagram illustrating an example of the measurement error amount included in the measurement value of the measurement unit. [ Fig. 5] Fig. 5 is a diagram illustrating an example of a measurement error amount included in a measurement value of a measurement unit. [ Fig. 6] Fig. 6 is a flowchart for explaining the process of setting the measurement period of the measurement unit. [ Fig. 7] Fig. 7 is a diagram illustrating an example of an exposure layout. [ Fig. 8] Fig. 8 is a diagram illustrating an example of variation in the height position of the substrate. [ Fig. 9] Fig. 9 is a diagram illustrating an example of the measurement error amount included in the measurement value of the measurement unit.

Claims (17)

An exposure device that exposes a substrate via an original plate, The aforementioned exposure apparatus has: a stage that moves while holding the aforementioned substrate; a flat plate on which the aforementioned stage is placed; a projection optical system, which projects the pattern of the original plate on the substrate; a measurement unit that measures a position in the height direction of the substrate held on the stage; and control department; The aforementioned control unit: Measure the position in the height direction through the measurement unit during a measurement period set to an integral multiple of the vibration period of the plate vibrated by the movement of the stage; and The distance between the projection optical system and the stage holding the substrate to be exposed is controlled based on the position in the height direction of the substrate measured through the measurement unit. The exposure apparatus according to claim 1, wherein the control unit sets the measurement period to be an integral multiple of the vibration period of the flat plate before exposing the substrate. The exposure apparatus according to claim 2, wherein the control unit is held on the stage for a predetermined period after the stage is moved so that the substrate is positioned under the projection optical system or after the stage is moved. The vibration period is obtained from the fluctuation of the position in the height direction of the substrate in the predetermined period obtained by measuring the position in the height direction of the substrate of the stage. The exposure apparatus according to claim 1, wherein the control unit exposes the substrate during an exposure period set to an integral multiple of the vibration period of the flat plate after controlling the distance. The exposure apparatus according to claim 4, wherein the control unit sets the exposure period to be an integral multiple of the vibration period of the plate before exposing the substrate. The exposure apparatus according to claim 4, wherein the control unit controls the light for exposing the substrate so that the exposure amount of the substrate becomes a target exposure amount according to the exposure period set to an integral multiple of the vibration period of the plate Strength of. The exposure apparatus according to claim 2, wherein the control unit obtains the vibration period by estimating vibration of the plate due to movement of the stage based on a design value of the stage and a design value of the plate. The exposure apparatus according to claim 1, wherein the exposure apparatus is a step-and-repeat exposure apparatus. An exposure device that exposes a substrate via an original plate, The aforementioned exposure apparatus has: a stage that moves while holding the aforementioned substrate; a flat plate on which the aforementioned stage is placed; a projection optical system, which projects the pattern of the original plate on the substrate; a measurement unit that measures a position in the height direction of the substrate held on the stage; and control department; The aforementioned control unit: During the measurement period set to 1/2 of the vibration period of the flat plate vibrated by the movement of the stage, the substrate is placed at the time sequence when the vibration amplitude of the flat plate vibrated by the movement of the stage becomes the maximum or minimum. The position in the height direction is measured by the aforementioned measuring section; and The distance between the projection optical system and the stage holding the substrate to be exposed is controlled based on the position in the height direction of the substrate measured through the measurement unit. The exposure apparatus according to claim 9, wherein the control unit sets the measurement period to an integral multiple of the vibration period of the flat plate before exposing the substrate, and starts the measurement of the position in the height direction of the substrate by the measurement unit The timing is set to the timing at which the vibration amplitude of the flat panel becomes the maximum or minimum. The exposure apparatus according to claim 10, wherein the control unit is held on the stage for a predetermined period after moving the stage so that the substrate is positioned under the projection optical system or after the stage is moved. The position of the substrate in the height direction of the stage is obtained from the fluctuation of the position in the height direction of the substrate in the predetermined period obtained by the measurement unit. The vibration phase of the flat plate was obtained from the moving speed. The exposure apparatus according to claim 11, wherein the control unit sets the timing at which the measurement unit starts measurement of the position in the height direction of the substrate based on the vibration phase of the flat plate. The exposure apparatus according to claim 9, wherein the exposure apparatus is a step-and-repeat exposure apparatus. An exposure method using an exposure device having a stage that moves while holding a substrate, a flat plate on which the stage is placed, a projection optical system that projects a pattern of an original plate on the substrate, and a projection optical system that is held on the substrate. The measuring unit that measures the position in the height direction of the substrate on the stage, and the exposure method is performed by using the exposure apparatus to expose the substrate, The position in the height direction is measured by the measurement unit during a measurement period set to an integral multiple of the vibration period of the plate vibrated by the movement of the stage, The distance between the projection optical system and the stage holding the substrate to be exposed is controlled based on the position in the height direction of the substrate measured through the measurement unit. An exposure method using an exposure device having a stage that moves while holding a substrate, a flat plate on which the stage is placed, a projection optical system that projects a pattern of an original plate on the substrate, and a projection optical system that is held on the substrate. The measuring unit that measures the position in the height direction of the substrate on the stage, and the exposure method is performed by using the exposure apparatus to expose the substrate, During the measurement period set to 1/2 of the vibration period of the flat plate vibrated by the movement of the stage, the substrate is placed at the time sequence when the vibration amplitude of the flat plate vibrated by the movement of the stage becomes the maximum or minimum. The position of the height direction is measured by the above-mentioned measuring part, The distance between the projection optical system and the stage holding the substrate to be exposed is controlled based on the position in the height direction of the substrate measured through the measurement unit. A method of manufacturing an article, comprising: A procedure for exposing a substrate using the exposure apparatus of claim 1; a procedure for developing the exposed substrate; and A procedure for making articles from the developed substrates described above. A method of manufacturing an article, comprising: A procedure for exposing a substrate using the exposure apparatus of claim 9; a procedure for developing the exposed substrate; and A procedure for making articles from the developed substrates described above.

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