JP2017200722A - 研削盤システム - Google Patents

研削盤システム Download PDF

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Publication number
JP2017200722A
JP2017200722A JP2017086849A JP2017086849A JP2017200722A JP 2017200722 A JP2017200722 A JP 2017200722A JP 2017086849 A JP2017086849 A JP 2017086849A JP 2017086849 A JP2017086849 A JP 2017086849A JP 2017200722 A JP2017200722 A JP 2017200722A
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JP
Japan
Prior art keywords
workpiece
grinding
sensor
surface roughness
grinding machine
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2017086849A
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English (en)
Japanese (ja)
Other versions
JP2017200722A5 (enExample
Inventor
森田　浩
Hiroshi Morita
浩 森田
英二 福田
Eiji Fukuda
英二 福田
光晴 石原
Mitsuharu Ishihara
光晴 石原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JTEKT Corp
Original Assignee
JTEKT Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by JTEKT Corp filed Critical JTEKT Corp
Publication of JP2017200722A publication Critical patent/JP2017200722A/ja
Publication of JP2017200722A5 publication Critical patent/JP2017200722A5/ja
Pending legal-status Critical Current

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  • Machine Tool Sensing Apparatuses (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
JP2017086849A 2016-04-28 2017-04-26 研削盤システム Pending JP2017200722A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016091861 2016-04-28
JP2016091861 2016-04-28

Publications (2)

Publication Number Publication Date
JP2017200722A true JP2017200722A (ja) 2017-11-09
JP2017200722A5 JP2017200722A5 (enExample) 2020-07-16

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ID=60264796

Family Applications (1)

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JP2017086849A Pending JP2017200722A (ja) 2016-04-28 2017-04-26 研削盤システム

Country Status (1)

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JP (1) JP2017200722A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN120724728A (zh) * 2025-09-01 2025-09-30 湖南科技大学 一种混合粒径cbn砂轮磨削表面形貌的仿真方法

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01219607A (ja) * 1988-02-29 1989-09-01 Sanyo Electric Co Ltd 加工機の粗さ計測装置
JPH0295543A (ja) * 1988-09-30 1990-04-06 Omron Tateisi Electron Co 研削盤制御装置
JPH031758U (enExample) * 1989-05-29 1991-01-09
JPH07171742A (ja) * 1993-11-01 1995-07-11 Toyo A Tec Kk 適応制御研削方法及びその装置
JP2008044074A (ja) * 2006-08-17 2008-02-28 Ntn Corp 研削モニタ装置
JP2012021992A (ja) * 2004-09-10 2012-02-02 Okayama Univ 熱電対接触式の表面粗さ測定方法及びワークの表面状態検出装置
JP2012196740A (ja) * 2011-03-22 2012-10-18 Tokyo Seimitsu Co Ltd 定寸装置
US20130252513A1 (en) * 2012-03-22 2013-09-26 Balance Systems S.R.L. Feeler for workpieces being machined

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01219607A (ja) * 1988-02-29 1989-09-01 Sanyo Electric Co Ltd 加工機の粗さ計測装置
JPH0295543A (ja) * 1988-09-30 1990-04-06 Omron Tateisi Electron Co 研削盤制御装置
JPH031758U (enExample) * 1989-05-29 1991-01-09
JPH07171742A (ja) * 1993-11-01 1995-07-11 Toyo A Tec Kk 適応制御研削方法及びその装置
JP2012021992A (ja) * 2004-09-10 2012-02-02 Okayama Univ 熱電対接触式の表面粗さ測定方法及びワークの表面状態検出装置
JP2008044074A (ja) * 2006-08-17 2008-02-28 Ntn Corp 研削モニタ装置
JP2012196740A (ja) * 2011-03-22 2012-10-18 Tokyo Seimitsu Co Ltd 定寸装置
US20130252513A1 (en) * 2012-03-22 2013-09-26 Balance Systems S.R.L. Feeler for workpieces being machined

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN120724728A (zh) * 2025-09-01 2025-09-30 湖南科技大学 一种混合粒径cbn砂轮磨削表面形貌的仿真方法

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