JP2017183566A5 - - Google Patents

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Publication number
JP2017183566A5
JP2017183566A5 JP2016070137A JP2016070137A JP2017183566A5 JP 2017183566 A5 JP2017183566 A5 JP 2017183566A5 JP 2016070137 A JP2016070137 A JP 2016070137A JP 2016070137 A JP2016070137 A JP 2016070137A JP 2017183566 A5 JP2017183566 A5 JP 2017183566A5
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JP
Japan
Prior art keywords
stress relaxation
relaxation structure
structure according
metal foil
thermoelectric conversion
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Application number
JP2016070137A
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English (en)
Japanese (ja)
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JP2017183566A (ja
JP6458759B2 (ja
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Publication date
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Priority to JP2016070137A priority Critical patent/JP6458759B2/ja
Priority claimed from JP2016070137A external-priority patent/JP6458759B2/ja
Priority to US15/414,139 priority patent/US20170288116A1/en
Priority to EP17153473.8A priority patent/EP3226314B1/en
Publication of JP2017183566A publication Critical patent/JP2017183566A/ja
Publication of JP2017183566A5 publication Critical patent/JP2017183566A5/ja
Application granted granted Critical
Publication of JP6458759B2 publication Critical patent/JP6458759B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2016070137A 2016-03-31 2016-03-31 応力緩和構造体及び熱電変換モジュール Expired - Fee Related JP6458759B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2016070137A JP6458759B2 (ja) 2016-03-31 2016-03-31 応力緩和構造体及び熱電変換モジュール
US15/414,139 US20170288116A1 (en) 2016-03-31 2017-01-24 Stress Relaxation Structure and Thermoelectric Conversion Module
EP17153473.8A EP3226314B1 (en) 2016-03-31 2017-01-27 Thermoelectric conversion module comprising stress relaxation structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016070137A JP6458759B2 (ja) 2016-03-31 2016-03-31 応力緩和構造体及び熱電変換モジュール

Publications (3)

Publication Number Publication Date
JP2017183566A JP2017183566A (ja) 2017-10-05
JP2017183566A5 true JP2017183566A5 (enExample) 2018-04-05
JP6458759B2 JP6458759B2 (ja) 2019-01-30

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ID=57914826

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016070137A Expired - Fee Related JP6458759B2 (ja) 2016-03-31 2016-03-31 応力緩和構造体及び熱電変換モジュール

Country Status (3)

Country Link
US (1) US20170288116A1 (enExample)
EP (1) EP3226314B1 (enExample)
JP (1) JP6458759B2 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3703140B1 (en) * 2017-10-24 2023-11-22 Resonac Corporation Method for manufacturing thermoelectric conversion module, thermoelectric conversion module, and binder for thermoelectric conversion module
JP7248091B2 (ja) * 2021-02-03 2023-03-29 三菱マテリアル株式会社 熱電変換モジュール、および、熱電変換モジュールの製造方法
CN117501859A (zh) * 2021-06-30 2024-02-02 株式会社村田制作所 热电转换器件

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55117249A (en) * 1979-03-05 1980-09-09 Hitachi Ltd Semiconductor supporting electrode
JPH01183139A (ja) * 1988-01-16 1989-07-20 Sumitomo Special Metals Co Ltd 放熱基板
JPH0780272B2 (ja) * 1989-12-12 1995-08-30 住友特殊金属株式会社 熱伝導複合材料
ATE142371T1 (de) * 1989-12-12 1996-09-15 Sumitomo Spec Metals Verfahren zur herstellung eines wärmeleitenden mischmaterial
US5510650A (en) * 1994-09-02 1996-04-23 General Motors Corporation Low mechanical stress, high electrical and thermal conductance semiconductor die mount
JP4062994B2 (ja) * 2001-08-28 2008-03-19 株式会社豊田自動織機 放熱用基板材、複合材及びその製造方法
US20040010170A1 (en) * 2002-01-09 2004-01-15 Vickers George H. Para-xylene and ethylbenzene separation from mixed C8 aromatics
JP2003229609A (ja) * 2002-02-05 2003-08-15 Sango Co Ltd 熱電変換モジュール用の熱応力緩和材とその製造方法と熱電変換装置
US7663486B2 (en) * 2006-06-16 2010-02-16 Motorola, Inc. RFID tag user memory indication
JP2008010764A (ja) * 2006-06-30 2008-01-17 Chugoku Electric Power Co Inc:The 熱電変換装置
JP2010093009A (ja) * 2008-10-07 2010-04-22 Sumitomo Chemical Co Ltd 熱電変換モジュールおよび熱電変換素子
JP5733678B2 (ja) * 2010-12-24 2015-06-10 日立化成株式会社 熱電変換モジュールおよびその製造方法
JP6064886B2 (ja) 2012-12-26 2017-01-25 株式会社豊田中央研究所 熱伝導性応力緩和構造体
US20140261608A1 (en) * 2013-03-14 2014-09-18 Gmz Energy, Inc. Thermal Interface Structure for Thermoelectric Devices
JP2014183256A (ja) 2013-03-21 2014-09-29 Denso Corp 接合体およびこれを用いた半導体装置、ならびにそれらの製造方法

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