JP2020505771A5 - - Google Patents

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Publication number
JP2020505771A5
JP2020505771A5 JP2019539312A JP2019539312A JP2020505771A5 JP 2020505771 A5 JP2020505771 A5 JP 2020505771A5 JP 2019539312 A JP2019539312 A JP 2019539312A JP 2019539312 A JP2019539312 A JP 2019539312A JP 2020505771 A5 JP2020505771 A5 JP 2020505771A5
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JP
Japan
Prior art keywords
conductor layer
power module
pipe
layer
module according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2019539312A
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English (en)
Japanese (ja)
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JP6872291B2 (ja
JP2020505771A (ja
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Publication date
Priority claimed from EP17173262.1A external-priority patent/EP3410478A1/en
Application filed filed Critical
Publication of JP2020505771A publication Critical patent/JP2020505771A/ja
Publication of JP2020505771A5 publication Critical patent/JP2020505771A5/ja
Application granted granted Critical
Publication of JP6872291B2 publication Critical patent/JP6872291B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2019539312A 2017-05-29 2018-05-01 パワーモジュール及びパワーモジュールを製造する方法 Expired - Fee Related JP6872291B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP17173262.1A EP3410478A1 (en) 2017-05-29 2017-05-29 Power module and method for manufacturing the power module
EP17173262.1 2017-05-29
PCT/JP2018/018023 WO2018221149A1 (en) 2017-05-29 2018-05-01 Power module and method for manufacturing the power module

Publications (3)

Publication Number Publication Date
JP2020505771A JP2020505771A (ja) 2020-02-20
JP2020505771A5 true JP2020505771A5 (enExample) 2020-04-02
JP6872291B2 JP6872291B2 (ja) 2021-05-19

Family

ID=58800718

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019539312A Expired - Fee Related JP6872291B2 (ja) 2017-05-29 2018-05-01 パワーモジュール及びパワーモジュールを製造する方法

Country Status (5)

Country Link
US (1) US11121059B2 (enExample)
EP (1) EP3410478A1 (enExample)
JP (1) JP6872291B2 (enExample)
CN (1) CN110663112A (enExample)
WO (1) WO2018221149A1 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11967899B2 (en) 2020-05-22 2024-04-23 Marel Power Solutions Fluid cooled inverter
US11849539B2 (en) * 2020-08-13 2023-12-19 Toyota Motor Engineering & Manufacturing North America, Inc. Embedded cooling systems utilizing heat pipes
US12193202B2 (en) 2021-09-15 2025-01-07 Marel Power Solutions, Inc. Air cooled compact power systems
KR20240058927A (ko) 2021-09-15 2024-05-07 마렐 파워 솔루션즈, 인코포레이티드 공랭식 전력 컨버터
JP2024080085A (ja) * 2022-12-01 2024-06-13 ナブテスコ株式会社 部品内蔵型回路基板および部品内蔵型回路基板の製造方法

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05235492A (ja) * 1992-02-26 1993-09-10 Hitachi Ltd 配線基板
JP4140100B2 (ja) * 1998-10-29 2008-08-27 ソニー株式会社 ヒートパイプ内蔵プリント配線基板
FR2786656B1 (fr) * 1998-11-27 2001-01-26 Alstom Technology Composant electronique de puissance comportant des moyens de refroidissement
SE522799C2 (sv) * 2000-02-23 2004-03-09 Teracom Ab Anordning för borttransport av värme från uppvärmda element samt ett förfarande för tillverkning av anordningen
US6292366B1 (en) * 2000-06-26 2001-09-18 Intel Corporation Printed circuit board with embedded integrated circuit
US20040229391A1 (en) * 2003-04-25 2004-11-18 Kazuyuki Ohya LED lamp manufacturing process
JP4350606B2 (ja) * 2004-07-23 2009-10-21 シャープ株式会社 プリント配線板の製造方法
KR20050117482A (ko) * 2005-06-29 2005-12-14 주식회사 써모랩 냉각장치가 내장된 인쇄회로기판 및 그의 제작방법
US20090165302A1 (en) * 2007-12-31 2009-07-02 Slaton David S Method of forming a heatsink
JP2009290021A (ja) * 2008-05-29 2009-12-10 Toshiba Corp 部品内蔵プリント配線板、同配線板の製造方法および電子機器
DE102008040906A1 (de) * 2008-07-31 2010-02-04 Robert Bosch Gmbh Leiterplatine mit elektronischem Bauelement
CN103635012A (zh) * 2012-08-21 2014-03-12 三星电机株式会社 印刷电路板以及用于制造该印刷电路板的方法
CN105593626A (zh) * 2013-12-24 2016-05-18 古河电气工业株式会社 受热部结构和散热器
JP6398405B2 (ja) * 2014-07-15 2018-10-03 富士電機株式会社 半導体装置及び半導体装置の製造方法
US9567204B2 (en) * 2014-08-29 2017-02-14 Taiwan Semiconductor Manufacturing Co., Ltd. Microelectrochemical systems (MEMS) device having a seal layer arranged over or lining a hole in fluid communication with a cavity of the MEMS device
WO2016071324A1 (en) * 2014-11-03 2016-05-12 At & S Austria Technologie & Systemtechnik Aktiengesellschaft Hermetically sealed heat pipe structure synthesized with support structure and method for producing it
WO2017069216A1 (ja) * 2015-10-22 2017-04-27 旭硝子株式会社 配線基板の製造方法

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