JPS55117249A - Semiconductor supporting electrode - Google Patents

Semiconductor supporting electrode

Info

Publication number
JPS55117249A
JPS55117249A JP2443379A JP2443379A JPS55117249A JP S55117249 A JPS55117249 A JP S55117249A JP 2443379 A JP2443379 A JP 2443379A JP 2443379 A JP2443379 A JP 2443379A JP S55117249 A JPS55117249 A JP S55117249A
Authority
JP
Japan
Prior art keywords
fiber
electrode
carbon fiber
mold
spiral state
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2443379A
Other languages
Japanese (ja)
Inventor
Hideo Arakawa
Keiichi Kuniya
Takashi Namekawa
Masabumi Ohashi
Tsuneo Yoshinari
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP2443379A priority Critical patent/JPS55117249A/en
Publication of JPS55117249A publication Critical patent/JPS55117249A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01006Carbon [C]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01029Copper [Cu]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06Polymers
    • H01L2924/078Adhesive characteristics other than chemical
    • H01L2924/07802Adhesive characteristics other than chemical not being an ohmic electrical conductor

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)

Abstract

PURPOSE:To enhance the conductivity of a semiconductor supporting electrode and reduce the thermal expansion of the electrode by containing 25-40vol% of carbon C fiber in the electrode made of Cu-C fiber composite material interposed with carbon fiber in spiral state when forming the elecrode and dispersing agglomerated carbon fiber group in Cu matrix. CONSTITUTION:A bundle of Cu plated carbon fiber having a diameter of 1mum is passed through 50wt% of Cu powder slurry, and hot pressed in spiral state in H2 at 700 deg.C under the pressure of 200-250kg/cm<2> to provide a Cu-30C fiber composite material. Or the bundle of fiber is similarly set in spiral state in a graphite casting mold, the mold is dipped in molten Cu, retained in H2 at 1100 deg.C for predetermined time, and then cooled. Then, the mold is ground. Thus, the carbon fiber group is dispersed in the Cu matrix to enhance the conductivity of the electrode and reduce the thermal expansion thereof.
JP2443379A 1979-03-05 1979-03-05 Semiconductor supporting electrode Pending JPS55117249A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2443379A JPS55117249A (en) 1979-03-05 1979-03-05 Semiconductor supporting electrode

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2443379A JPS55117249A (en) 1979-03-05 1979-03-05 Semiconductor supporting electrode

Publications (1)

Publication Number Publication Date
JPS55117249A true JPS55117249A (en) 1980-09-09

Family

ID=12138011

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2443379A Pending JPS55117249A (en) 1979-03-05 1979-03-05 Semiconductor supporting electrode

Country Status (1)

Country Link
JP (1) JPS55117249A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3226314A3 (en) * 2016-03-31 2017-10-25 Hitachi Metals, Ltd. Stress relaxation structure and thermoelectric conversion module

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3226314A3 (en) * 2016-03-31 2017-10-25 Hitachi Metals, Ltd. Stress relaxation structure and thermoelectric conversion module

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