JPS55117249A - Semiconductor supporting electrode - Google Patents
Semiconductor supporting electrodeInfo
- Publication number
- JPS55117249A JPS55117249A JP2443379A JP2443379A JPS55117249A JP S55117249 A JPS55117249 A JP S55117249A JP 2443379 A JP2443379 A JP 2443379A JP 2443379 A JP2443379 A JP 2443379A JP S55117249 A JPS55117249 A JP S55117249A
- Authority
- JP
- Japan
- Prior art keywords
- fiber
- electrode
- carbon fiber
- mold
- spiral state
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Abstract
PURPOSE:To enhance the conductivity of a semiconductor supporting electrode and reduce the thermal expansion of the electrode by containing 25-40vol% of carbon C fiber in the electrode made of Cu-C fiber composite material interposed with carbon fiber in spiral state when forming the elecrode and dispersing agglomerated carbon fiber group in Cu matrix. CONSTITUTION:A bundle of Cu plated carbon fiber having a diameter of 1mum is passed through 50wt% of Cu powder slurry, and hot pressed in spiral state in H2 at 700 deg.C under the pressure of 200-250kg/cm<2> to provide a Cu-30C fiber composite material. Or the bundle of fiber is similarly set in spiral state in a graphite casting mold, the mold is dipped in molten Cu, retained in H2 at 1100 deg.C for predetermined time, and then cooled. Then, the mold is ground. Thus, the carbon fiber group is dispersed in the Cu matrix to enhance the conductivity of the electrode and reduce the thermal expansion thereof.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2443379A JPS55117249A (en) | 1979-03-05 | 1979-03-05 | Semiconductor supporting electrode |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2443379A JPS55117249A (en) | 1979-03-05 | 1979-03-05 | Semiconductor supporting electrode |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS55117249A true JPS55117249A (en) | 1980-09-09 |
Family
ID=12138011
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2443379A Pending JPS55117249A (en) | 1979-03-05 | 1979-03-05 | Semiconductor supporting electrode |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS55117249A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3226314A3 (en) * | 2016-03-31 | 2017-10-25 | Hitachi Metals, Ltd. | Stress relaxation structure and thermoelectric conversion module |
-
1979
- 1979-03-05 JP JP2443379A patent/JPS55117249A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3226314A3 (en) * | 2016-03-31 | 2017-10-25 | Hitachi Metals, Ltd. | Stress relaxation structure and thermoelectric conversion module |
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