JPS55162249A - Heat discharge electrode plate for ic device - Google Patents

Heat discharge electrode plate for ic device

Info

Publication number
JPS55162249A
JPS55162249A JP6893279A JP6893279A JPS55162249A JP S55162249 A JPS55162249 A JP S55162249A JP 6893279 A JP6893279 A JP 6893279A JP 6893279 A JP6893279 A JP 6893279A JP S55162249 A JPS55162249 A JP S55162249A
Authority
JP
Japan
Prior art keywords
electrode plate
carbon fiber
mold
fiber
discharge electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6893279A
Other languages
Japanese (ja)
Inventor
Takashi Namekawa
Keiichi Kuniya
Hideo Arakawa
Tsuneo Yoshinari
Masabumi Ohashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP6893279A priority Critical patent/JPS55162249A/en
Publication of JPS55162249A publication Critical patent/JPS55162249A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3733—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

PURPOSE:To increase heat conduction and heat radiation effects by the method wherein an IC heat discharge electrode plate having an insulating plate on its surface is made of a composite material consisting of copper or silver and carbon fiber, and further, carbon fiber is arranged in a ring form around the electrode plate and it is placed inside nondirectionally. CONSTITUTION:Carbon fiber is plated with copper. This is cut into short fibers, 5-10mm. These are stirred in water, and nondirectional Cu-C composite fiber material is produced. Next, these are put into a square graphite casting mold and held in H2 at 500 deg.C under a pressure of 100kg/cm<2> for 1hr. Then, the material is cooled and taken out of the mold. Subsequently, Cu-C fiber is wound around this in a spiral, and the resultant substance is put into a square graphite casting mold and it is hot pressed again in H2 at 800 deg.C under a pressure of 200kg/cm<2> for 1hr. Then, it is cooled and taken out of the mold. By this, the thermal expansion coefficient becomes same as that of the insulation plate, so that it is possible to obtain easily an electrode plate of low thermal expansion and high heat conduction.
JP6893279A 1979-06-04 1979-06-04 Heat discharge electrode plate for ic device Pending JPS55162249A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6893279A JPS55162249A (en) 1979-06-04 1979-06-04 Heat discharge electrode plate for ic device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6893279A JPS55162249A (en) 1979-06-04 1979-06-04 Heat discharge electrode plate for ic device

Publications (1)

Publication Number Publication Date
JPS55162249A true JPS55162249A (en) 1980-12-17

Family

ID=13387922

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6893279A Pending JPS55162249A (en) 1979-06-04 1979-06-04 Heat discharge electrode plate for ic device

Country Status (1)

Country Link
JP (1) JPS55162249A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63120448A (en) * 1986-11-08 1988-05-24 Matsushita Electric Works Ltd Substrate for heat dissipation
US4809058A (en) * 1985-12-16 1989-02-28 Hitachi, Ltd. Integrated circuit device
US7097914B2 (en) * 2001-08-28 2006-08-29 Kabushiki Kaisha Toyota Jidoshokki Composite structural material, and method of producing the same
CN104144597B (en) * 2012-12-11 2017-01-11 天诺光电材料股份有限公司 Heat-conduction-fiber-enhanced high heat conductivity graphite cooling fin and manufacturing method

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4809058A (en) * 1985-12-16 1989-02-28 Hitachi, Ltd. Integrated circuit device
JPS63120448A (en) * 1986-11-08 1988-05-24 Matsushita Electric Works Ltd Substrate for heat dissipation
US7097914B2 (en) * 2001-08-28 2006-08-29 Kabushiki Kaisha Toyota Jidoshokki Composite structural material, and method of producing the same
CN104144597B (en) * 2012-12-11 2017-01-11 天诺光电材料股份有限公司 Heat-conduction-fiber-enhanced high heat conductivity graphite cooling fin and manufacturing method

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