JPS5630092A - Preparation of composite electrode material - Google Patents

Preparation of composite electrode material

Info

Publication number
JPS5630092A
JPS5630092A JP10558479A JP10558479A JPS5630092A JP S5630092 A JPS5630092 A JP S5630092A JP 10558479 A JP10558479 A JP 10558479A JP 10558479 A JP10558479 A JP 10558479A JP S5630092 A JPS5630092 A JP S5630092A
Authority
JP
Japan
Prior art keywords
copper
tungsten
cylindrical
silver
baked
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10558479A
Other languages
Japanese (ja)
Other versions
JPS6141680B2 (en
Inventor
Shigeaki Sekiguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP10558479A priority Critical patent/JPS5630092A/en
Publication of JPS5630092A publication Critical patent/JPS5630092A/en
Publication of JPS6141680B2 publication Critical patent/JPS6141680B2/ja
Granted legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/40Making wire or rods for soldering or welding
    • B23K35/402Non-consumable electrodes; C-electrodes

Abstract

PURPOSE:To improve the characteristic and manufacturing efficiency, by heating the cylindrical formed body mainly composed of tungsten with the infiltration material composed of copper or silver and impregnating the material into said body and at the same time, forming the substrate part composed of said material in the hollow part of the formed body. CONSTITUTION:Tungsten powder is put in a fixed mold and is pressed and then, the cylindrical formed body 1 is obtained. Next, said body 1 is baked in the hydrogen furnace and the copper 3 is put in the graphite vessel 2 using as the infiltration material and then, said tungsten baked body 1 is placed on the copper 3 so as to contact with it. Then, said vessel 2 is put in the continuous hydrogen furnance and is heated. The copper 3 is dissolved and is diffused into the body 1 and then, the cylindrical body made of copper-tungsten, is formed and also, the substrate part is formed by filling the hollow space 10 of the cylindrical body with the copper 3. Further, silver can be used in stead of said copper.
JP10558479A 1979-08-21 1979-08-21 Preparation of composite electrode material Granted JPS5630092A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10558479A JPS5630092A (en) 1979-08-21 1979-08-21 Preparation of composite electrode material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10558479A JPS5630092A (en) 1979-08-21 1979-08-21 Preparation of composite electrode material

Publications (2)

Publication Number Publication Date
JPS5630092A true JPS5630092A (en) 1981-03-26
JPS6141680B2 JPS6141680B2 (en) 1986-09-17

Family

ID=14411542

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10558479A Granted JPS5630092A (en) 1979-08-21 1979-08-21 Preparation of composite electrode material

Country Status (1)

Country Link
JP (1) JPS5630092A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5409864A (en) * 1982-07-26 1995-04-25 Sumitomo Electric Industries, Ltd. Substrate for semiconductor apparatus

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5409864A (en) * 1982-07-26 1995-04-25 Sumitomo Electric Industries, Ltd. Substrate for semiconductor apparatus
US5525428A (en) * 1982-07-26 1996-06-11 Sumitomo Electric Industries, Ltd. Substrate for semiconductor apparatus
US5563101A (en) * 1982-07-26 1996-10-08 Sumitomo Electric Industries, Ltd. Substrate for semiconductor apparatus
US5708959A (en) * 1982-07-26 1998-01-13 Sumitomo Electric Industries, Ltd. Substrate for semiconductor apparatus

Also Published As

Publication number Publication date
JPS6141680B2 (en) 1986-09-17

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