JPS5630092A - Preparation of composite electrode material - Google Patents
Preparation of composite electrode materialInfo
- Publication number
- JPS5630092A JPS5630092A JP10558479A JP10558479A JPS5630092A JP S5630092 A JPS5630092 A JP S5630092A JP 10558479 A JP10558479 A JP 10558479A JP 10558479 A JP10558479 A JP 10558479A JP S5630092 A JPS5630092 A JP S5630092A
- Authority
- JP
- Japan
- Prior art keywords
- copper
- tungsten
- cylindrical
- silver
- baked
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/40—Making wire or rods for soldering or welding
- B23K35/402—Non-consumable electrodes; C-electrodes
Abstract
PURPOSE:To improve the characteristic and manufacturing efficiency, by heating the cylindrical formed body mainly composed of tungsten with the infiltration material composed of copper or silver and impregnating the material into said body and at the same time, forming the substrate part composed of said material in the hollow part of the formed body. CONSTITUTION:Tungsten powder is put in a fixed mold and is pressed and then, the cylindrical formed body 1 is obtained. Next, said body 1 is baked in the hydrogen furnace and the copper 3 is put in the graphite vessel 2 using as the infiltration material and then, said tungsten baked body 1 is placed on the copper 3 so as to contact with it. Then, said vessel 2 is put in the continuous hydrogen furnance and is heated. The copper 3 is dissolved and is diffused into the body 1 and then, the cylindrical body made of copper-tungsten, is formed and also, the substrate part is formed by filling the hollow space 10 of the cylindrical body with the copper 3. Further, silver can be used in stead of said copper.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10558479A JPS5630092A (en) | 1979-08-21 | 1979-08-21 | Preparation of composite electrode material |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10558479A JPS5630092A (en) | 1979-08-21 | 1979-08-21 | Preparation of composite electrode material |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5630092A true JPS5630092A (en) | 1981-03-26 |
JPS6141680B2 JPS6141680B2 (en) | 1986-09-17 |
Family
ID=14411542
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10558479A Granted JPS5630092A (en) | 1979-08-21 | 1979-08-21 | Preparation of composite electrode material |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5630092A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5409864A (en) * | 1982-07-26 | 1995-04-25 | Sumitomo Electric Industries, Ltd. | Substrate for semiconductor apparatus |
-
1979
- 1979-08-21 JP JP10558479A patent/JPS5630092A/en active Granted
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5409864A (en) * | 1982-07-26 | 1995-04-25 | Sumitomo Electric Industries, Ltd. | Substrate for semiconductor apparatus |
US5525428A (en) * | 1982-07-26 | 1996-06-11 | Sumitomo Electric Industries, Ltd. | Substrate for semiconductor apparatus |
US5563101A (en) * | 1982-07-26 | 1996-10-08 | Sumitomo Electric Industries, Ltd. | Substrate for semiconductor apparatus |
US5708959A (en) * | 1982-07-26 | 1998-01-13 | Sumitomo Electric Industries, Ltd. | Substrate for semiconductor apparatus |
Also Published As
Publication number | Publication date |
---|---|
JPS6141680B2 (en) | 1986-09-17 |
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