JP2017183530A - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
- Publication number
- JP2017183530A JP2017183530A JP2016068793A JP2016068793A JP2017183530A JP 2017183530 A JP2017183530 A JP 2017183530A JP 2016068793 A JP2016068793 A JP 2016068793A JP 2016068793 A JP2016068793 A JP 2016068793A JP 2017183530 A JP2017183530 A JP 2017183530A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- temperature sensor
- heat
- temperature
- insulating substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 70
- 239000000758 substrate Substances 0.000 claims abstract description 31
- 230000002265 prevention Effects 0.000 claims abstract description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 49
- 238000001816 cooling Methods 0.000 abstract description 29
- 230000017525 heat dissipation Effects 0.000 abstract description 8
- 239000000498 cooling water Substances 0.000 description 43
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 16
- 229910052802 copper Inorganic materials 0.000 description 16
- 239000010949 copper Substances 0.000 description 16
- 238000001514 detection method Methods 0.000 description 9
- 238000000034 method Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 230000005856 abnormality Effects 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 239000003990 capacitor Substances 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000009499 grossing Methods 0.000 description 2
- 230000020169 heat generation Effects 0.000 description 2
- 238000011144 upstream manufacturing Methods 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
しかし、特許文献2の技術のように、温度センサとは別に水温センサを設けて水抜けを検知していたのではセンサが複数になるため、装置が複雑になる上、装置のコストが高くなる。
そのため、半導体素子からの熱を放熱するインバータ冷却装置のような放熱部材を備えた半導体装置であって、冷却配管中に水温センサを用いることなく、簡易で且つ廉価な構成で正確に水温を検出することができる技術が求められる。
ΔT1=(Ppm/Q)×A
また、半導体装置10は、電動車両や、いわゆるハイブリット車両に搭載される他、舶用や一般産業用に供することもできる。
Claims (2)
- 発熱する半導体素子と、
該半導体素子を一方の面に実装する絶縁基板と、
該絶縁基板の他方の面に設けられ前記半導体素子からの熱を放熱する放熱部材とを備える半導体装置であって、
前記絶縁基板の一方の面に実装される温度センサと、
前記絶縁基板上に実装された前記半導体素子及び前記温度センサとの間に、前記半導体素子から発熱の熱伝導を防止する熱伝導防止部とを備えていることを特徴とする半導体装置。 - 前記熱電等防止部は、前記絶縁基板に形成されたスリットであることを特徴とする請求項1記載の半導体装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016068793A JP6637812B2 (ja) | 2016-03-30 | 2016-03-30 | 半導体装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016068793A JP6637812B2 (ja) | 2016-03-30 | 2016-03-30 | 半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2017183530A true JP2017183530A (ja) | 2017-10-05 |
JP6637812B2 JP6637812B2 (ja) | 2020-01-29 |
Family
ID=60006407
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016068793A Active JP6637812B2 (ja) | 2016-03-30 | 2016-03-30 | 半導体装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP6637812B2 (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102019201284A1 (de) | 2018-03-30 | 2019-10-02 | Fuji Electric Co., Ltd. | Halbleitervorrichtung, Halbleiterbaugruppe, Halbleitermodul und Halbleiterschaltungsvorrichtung |
US11107748B2 (en) | 2018-09-21 | 2021-08-31 | Fuji Electric Co., Ltd. | Semiconductor module and vehicle |
US11777020B2 (en) | 2019-02-07 | 2023-10-03 | Fuji Electric Co., Ltd. | Semiconductor device and semiconductor module |
DE102022132612A1 (de) | 2022-12-08 | 2024-06-13 | Audi Aktiengesellschaft | Leistungselektronikanordnung für eine fremderregte Synchronmaschine und Kraftfahrzeug |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09148523A (ja) * | 1995-11-21 | 1997-06-06 | Toshiba Corp | 半導体装置 |
JPH11330321A (ja) * | 1998-05-15 | 1999-11-30 | Shibaura Mechatronics Corp | 回路素子の過熱防護構造 |
JP2012160602A (ja) * | 2011-02-01 | 2012-08-23 | Honda Motor Co Ltd | 半導体装置 |
JP2015161746A (ja) * | 2014-02-26 | 2015-09-07 | 株式会社リコー | 冷却装置、及び画像形成装置 |
JP2015208081A (ja) * | 2014-04-18 | 2015-11-19 | 日産自動車株式会社 | 半導体素子温度推定装置 |
-
2016
- 2016-03-30 JP JP2016068793A patent/JP6637812B2/ja active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09148523A (ja) * | 1995-11-21 | 1997-06-06 | Toshiba Corp | 半導体装置 |
US5721455A (en) * | 1995-11-21 | 1998-02-24 | Kabushiki Kaisha Toshiba | Semiconductor device having a thermal resistance detector in the heat radiating path |
JPH11330321A (ja) * | 1998-05-15 | 1999-11-30 | Shibaura Mechatronics Corp | 回路素子の過熱防護構造 |
JP2012160602A (ja) * | 2011-02-01 | 2012-08-23 | Honda Motor Co Ltd | 半導体装置 |
JP2015161746A (ja) * | 2014-02-26 | 2015-09-07 | 株式会社リコー | 冷却装置、及び画像形成装置 |
JP2015208081A (ja) * | 2014-04-18 | 2015-11-19 | 日産自動車株式会社 | 半導体素子温度推定装置 |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102019201284A1 (de) | 2018-03-30 | 2019-10-02 | Fuji Electric Co., Ltd. | Halbleitervorrichtung, Halbleiterbaugruppe, Halbleitermodul und Halbleiterschaltungsvorrichtung |
US10794773B2 (en) | 2018-03-30 | 2020-10-06 | Fuji Electric Co., Ltd. | Semiconductor device, semiconductor package, semiconductor module, and semiconductor circuit device |
US11371891B2 (en) | 2018-03-30 | 2022-06-28 | Fuji Electric Co., Ltd. | Semiconductor device, semiconductor package, semiconductor module, and semiconductor circuit device |
US11107748B2 (en) | 2018-09-21 | 2021-08-31 | Fuji Electric Co., Ltd. | Semiconductor module and vehicle |
US11777020B2 (en) | 2019-02-07 | 2023-10-03 | Fuji Electric Co., Ltd. | Semiconductor device and semiconductor module |
DE102022132612A1 (de) | 2022-12-08 | 2024-06-13 | Audi Aktiengesellschaft | Leistungselektronikanordnung für eine fremderregte Synchronmaschine und Kraftfahrzeug |
Also Published As
Publication number | Publication date |
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JP6637812B2 (ja) | 2020-01-29 |
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