JP2017175015A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2017175015A5 JP2017175015A5 JP2016060736A JP2016060736A JP2017175015A5 JP 2017175015 A5 JP2017175015 A5 JP 2017175015A5 JP 2016060736 A JP2016060736 A JP 2016060736A JP 2016060736 A JP2016060736 A JP 2016060736A JP 2017175015 A5 JP2017175015 A5 JP 2017175015A5
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- connection body
- manufacturing
- conductive film
- anisotropic conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 claims 8
- 238000000034 method Methods 0.000 claims 8
- 230000001678 irradiating effect Effects 0.000 claims 2
- 239000002245 particle Substances 0.000 claims 2
- 238000010438 heat treatment Methods 0.000 claims 1
- 238000003825 pressing Methods 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016060736A JP6783537B2 (ja) | 2016-03-24 | 2016-03-24 | 接続体の製造方法 |
| KR1020170017369A KR102665001B1 (ko) | 2016-03-24 | 2017-02-08 | 접속체의 제조 방법 |
| CN201710138673.7A CN107230646B (zh) | 2016-03-24 | 2017-03-09 | 连接体的制造方法 |
| HK18104396.2A HK1245501A1 (zh) | 2016-03-24 | 2018-04-03 | 连接体的制造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016060736A JP6783537B2 (ja) | 2016-03-24 | 2016-03-24 | 接続体の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2017175015A JP2017175015A (ja) | 2017-09-28 |
| JP2017175015A5 true JP2017175015A5 (enrdf_load_stackoverflow) | 2019-04-25 |
| JP6783537B2 JP6783537B2 (ja) | 2020-11-11 |
Family
ID=59932480
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016060736A Active JP6783537B2 (ja) | 2016-03-24 | 2016-03-24 | 接続体の製造方法 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6783537B2 (enrdf_load_stackoverflow) |
| KR (1) | KR102665001B1 (enrdf_load_stackoverflow) |
| CN (1) | CN107230646B (enrdf_load_stackoverflow) |
| HK (1) | HK1245501A1 (enrdf_load_stackoverflow) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109637699B (zh) * | 2018-12-12 | 2020-05-12 | 武汉华星光电半导体显示技术有限公司 | 异方性导电膜制造方法及其设备 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1314094C (zh) * | 2004-02-25 | 2007-05-02 | 友达光电股份有限公司 | 封装对准结构 |
| WO2006112383A1 (ja) * | 2005-04-14 | 2006-10-26 | Matsushita Electric Industrial Co., Ltd. | 電子回路装置およびその製造方法 |
| JP5498407B2 (ja) | 2011-01-25 | 2014-05-21 | 積水化学工業株式会社 | 接続構造体の製造方法 |
| JP2012175038A (ja) * | 2011-02-24 | 2012-09-10 | Sekisui Chem Co Ltd | 接続構造体の製造方法及び異方性導電材料 |
| JP6133069B2 (ja) * | 2013-01-30 | 2017-05-24 | デクセリアルズ株式会社 | 加熱硬化型接着フィルム |
| JP5949811B2 (ja) | 2014-03-04 | 2016-07-13 | 日立化成株式会社 | 電子部品の製造方法 |
| JP6518101B2 (ja) * | 2014-03-26 | 2019-05-22 | 積水化学工業株式会社 | 光硬化性導電材料、接続構造体及び接続構造体の製造方法 |
-
2016
- 2016-03-24 JP JP2016060736A patent/JP6783537B2/ja active Active
-
2017
- 2017-02-08 KR KR1020170017369A patent/KR102665001B1/ko active Active
- 2017-03-09 CN CN201710138673.7A patent/CN107230646B/zh active Active
-
2018
- 2018-04-03 HK HK18104396.2A patent/HK1245501A1/zh unknown