KR102665001B1 - 접속체의 제조 방법 - Google Patents

접속체의 제조 방법 Download PDF

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Publication number
KR102665001B1
KR102665001B1 KR1020170017369A KR20170017369A KR102665001B1 KR 102665001 B1 KR102665001 B1 KR 102665001B1 KR 1020170017369 A KR1020170017369 A KR 1020170017369A KR 20170017369 A KR20170017369 A KR 20170017369A KR 102665001 B1 KR102665001 B1 KR 102665001B1
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KR
South Korea
Prior art keywords
electronic component
anisotropic conductive
conductive film
manufacturing
connection
Prior art date
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Application number
KR1020170017369A
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English (en)
Korean (ko)
Other versions
KR20170113037A (ko
Inventor
다이치로 가지타니
Original Assignee
데쿠세리아루즈 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication of KR20170113037A publication Critical patent/KR20170113037A/ko
Application granted granted Critical
Publication of KR102665001B1 publication Critical patent/KR102665001B1/ko
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H01B13/0026—Apparatus for manufacturing conducting or semi-conducting layers, e.g. deposition of metal
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/83009—Pre-treatment of the layer connector or the bonding area
    • H01L2224/83048—Thermal treatments, e.g. annealing, controlled pre-heating or pre-cooling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8312—Aligning
    • H01L2224/83143—Passive alignment, i.e. self alignment, e.g. using surface energy, chemical reactions, thermal equilibrium
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/832—Applying energy for connecting
    • H01L2224/83201—Compression bonding
    • H01L2224/83203—Thermocompression bonding, e.g. diffusion bonding, pressure joining, thermocompression welding or solid-state welding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0108—Transparent

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Combinations Of Printed Boards (AREA)
KR1020170017369A 2016-03-24 2017-02-08 접속체의 제조 방법 Active KR102665001B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016060736A JP6783537B2 (ja) 2016-03-24 2016-03-24 接続体の製造方法
JPJP-P-2016-060736 2016-03-24

Publications (2)

Publication Number Publication Date
KR20170113037A KR20170113037A (ko) 2017-10-12
KR102665001B1 true KR102665001B1 (ko) 2024-05-09

Family

ID=59932480

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020170017369A Active KR102665001B1 (ko) 2016-03-24 2017-02-08 접속체의 제조 방법

Country Status (4)

Country Link
JP (1) JP6783537B2 (enrdf_load_stackoverflow)
KR (1) KR102665001B1 (enrdf_load_stackoverflow)
CN (1) CN107230646B (enrdf_load_stackoverflow)
HK (1) HK1245501A1 (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109637699B (zh) * 2018-12-12 2020-05-12 武汉华星光电半导体显示技术有限公司 异方性导电膜制造方法及其设备

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006112383A1 (ja) * 2005-04-14 2006-10-26 Matsushita Electric Industrial Co., Ltd. 電子回路装置およびその製造方法
JP2012175038A (ja) * 2011-02-24 2012-09-10 Sekisui Chem Co Ltd 接続構造体の製造方法及び異方性導電材料

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1314094C (zh) * 2004-02-25 2007-05-02 友达光电股份有限公司 封装对准结构
JP5498407B2 (ja) 2011-01-25 2014-05-21 積水化学工業株式会社 接続構造体の製造方法
JP6133069B2 (ja) * 2013-01-30 2017-05-24 デクセリアルズ株式会社 加熱硬化型接着フィルム
JP5949811B2 (ja) 2014-03-04 2016-07-13 日立化成株式会社 電子部品の製造方法
JP6518101B2 (ja) * 2014-03-26 2019-05-22 積水化学工業株式会社 光硬化性導電材料、接続構造体及び接続構造体の製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006112383A1 (ja) * 2005-04-14 2006-10-26 Matsushita Electric Industrial Co., Ltd. 電子回路装置およびその製造方法
JP2012175038A (ja) * 2011-02-24 2012-09-10 Sekisui Chem Co Ltd 接続構造体の製造方法及び異方性導電材料

Also Published As

Publication number Publication date
HK1245501A1 (zh) 2018-08-24
CN107230646A (zh) 2017-10-03
JP2017175015A (ja) 2017-09-28
KR20170113037A (ko) 2017-10-12
CN107230646B (zh) 2023-05-05
JP6783537B2 (ja) 2020-11-11

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