JP2013098514A5 - - Google Patents

Download PDF

Info

Publication number
JP2013098514A5
JP2013098514A5 JP2011243132A JP2011243132A JP2013098514A5 JP 2013098514 A5 JP2013098514 A5 JP 2013098514A5 JP 2011243132 A JP2011243132 A JP 2011243132A JP 2011243132 A JP2011243132 A JP 2011243132A JP 2013098514 A5 JP2013098514 A5 JP 2013098514A5
Authority
JP
Japan
Prior art keywords
substrate
electrode
bump
semiconductor device
conductive portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2011243132A
Other languages
English (en)
Japanese (ja)
Other versions
JP2013098514A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2011243132A priority Critical patent/JP2013098514A/ja
Priority claimed from JP2011243132A external-priority patent/JP2013098514A/ja
Publication of JP2013098514A publication Critical patent/JP2013098514A/ja
Publication of JP2013098514A5 publication Critical patent/JP2013098514A5/ja
Withdrawn legal-status Critical Current

Links

JP2011243132A 2011-11-07 2011-11-07 半導体装置の製造方法及び半導体装置、電子機器 Withdrawn JP2013098514A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2011243132A JP2013098514A (ja) 2011-11-07 2011-11-07 半導体装置の製造方法及び半導体装置、電子機器

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011243132A JP2013098514A (ja) 2011-11-07 2011-11-07 半導体装置の製造方法及び半導体装置、電子機器

Publications (2)

Publication Number Publication Date
JP2013098514A JP2013098514A (ja) 2013-05-20
JP2013098514A5 true JP2013098514A5 (enrdf_load_stackoverflow) 2014-12-11

Family

ID=48620122

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011243132A Withdrawn JP2013098514A (ja) 2011-11-07 2011-11-07 半導体装置の製造方法及び半導体装置、電子機器

Country Status (1)

Country Link
JP (1) JP2013098514A (enrdf_load_stackoverflow)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150171039A1 (en) * 2013-12-13 2015-06-18 Chipmos Technologies Inc. Redistribution layer alloy structure and manufacturing method thereof
TW201838094A (zh) * 2017-02-16 2018-10-16 學校法人慶應義塾 層疊半導體積體電路裝置
US11688840B2 (en) * 2019-12-28 2023-06-27 Seoul Viosys Co., Ltd. Light emitting device and led display apparatus having the same
KR20230147601A (ko) * 2021-02-19 2023-10-23 소니 세미컨덕터 솔루션즈 가부시키가이샤 전자 기기

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4000045B2 (ja) * 2002-10-30 2007-10-31 京セラ株式会社 弾性表面波装置及びその製造方法
US6835589B2 (en) * 2002-11-14 2004-12-28 International Business Machines Corporation Three-dimensional integrated CMOS-MEMS device and process for making the same
EP1573799B1 (en) * 2002-12-20 2010-01-27 International Business Machines Corporation Three-dimensional device fabrication method
JP4744213B2 (ja) * 2005-07-11 2011-08-10 日本電波工業株式会社 電子部品の製造方法
JP2007318143A (ja) * 2006-05-22 2007-12-06 Samsung Electronics Co Ltd 半導体構造体及びその製造方法
KR20100020718A (ko) * 2008-08-13 2010-02-23 삼성전자주식회사 반도체 칩, 그 스택 구조 및 이들의 제조 방법
US8618670B2 (en) * 2008-08-15 2013-12-31 Qualcomm Incorporated Corrosion control of stacked integrated circuits
US8749027B2 (en) * 2009-01-07 2014-06-10 Taiwan Semiconductor Manufacturing Company, Ltd. Robust TSV structure

Similar Documents

Publication Publication Date Title
JP2009164481A5 (enrdf_load_stackoverflow)
JP2014013810A5 (enrdf_load_stackoverflow)
JP2016096292A5 (enrdf_load_stackoverflow)
EP2500935A3 (en) Stackable chip with through electrodes, manufacturing method thereof, and infrared sensor
EP2876680A3 (en) Electronic device incorporating a randomized interconnection layer
WO2016209668A3 (en) Structures and methods for reliable packages
EP2461361A3 (en) Package substrate unit and method for manufacturing package substrate unit
JP2013042154A5 (enrdf_load_stackoverflow)
JP2013251255A5 (enrdf_load_stackoverflow)
JP2012083733A5 (ja) 発光表示装置の作製方法
EP2866257A3 (en) Printed circuit board and manufacturing method thereof and semiconductor pacakge using the same
JP2013131720A5 (enrdf_load_stackoverflow)
JP2012134500A5 (enrdf_load_stackoverflow)
JP2012084865A5 (ja) 半導体装置の作製方法
JP2015015270A5 (enrdf_load_stackoverflow)
JP2016012604A5 (enrdf_load_stackoverflow)
JP2011210773A5 (enrdf_load_stackoverflow)
SG169948A1 (en) Reliable interconnect for semiconductor device
EP2669938A3 (en) Semiconductor device with an oxide solder flow prevention area on a substrate and corresponding manufacturing method
JP2011009514A5 (enrdf_load_stackoverflow)
WO2010143895A3 (en) Semiconductor substrate, semiconductor device, and manufacturing methods thereof
SG10201401166YA (en) Integrated circuit packaging system with embedded pad on layered substrate and method of manufacture thereof
EP3121647A3 (en) Display device and method of fabricating the same
EP2482311A3 (en) Semiconductor device, method of manufacturing semiconductor device, and electronic device
JP2013098514A5 (enrdf_load_stackoverflow)