JP2017143186A5 - - Google Patents
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- Publication number
- JP2017143186A5 JP2017143186A5 JP2016023693A JP2016023693A JP2017143186A5 JP 2017143186 A5 JP2017143186 A5 JP 2017143186A5 JP 2016023693 A JP2016023693 A JP 2016023693A JP 2016023693 A JP2016023693 A JP 2016023693A JP 2017143186 A5 JP2017143186 A5 JP 2017143186A5
- Authority
- JP
- Japan
- Prior art keywords
- processing apparatus
- vacuum processing
- sample
- chamber
- plate member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 238000010438 heat treatment Methods 0.000 claims 3
- 238000007789 sealing Methods 0.000 claims 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims 1
- 230000005540 biological transmission Effects 0.000 claims 1
- 230000000903 blocking effect Effects 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
- 229910052698 phosphorus Inorganic materials 0.000 claims 1
- 239000011574 phosphorus Substances 0.000 claims 1
- 230000002093 peripheral effect Effects 0.000 description 2
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016023693A JP6625891B2 (ja) | 2016-02-10 | 2016-02-10 | 真空処理装置 |
| US15/072,392 US10290472B2 (en) | 2016-02-10 | 2016-03-17 | Vacuum processing apparatus |
| US16/378,783 US10937635B2 (en) | 2016-02-10 | 2019-04-09 | Vacuum processing apparatus |
| US17/160,801 US11557463B2 (en) | 2016-02-10 | 2021-01-28 | Vacuum processing apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016023693A JP6625891B2 (ja) | 2016-02-10 | 2016-02-10 | 真空処理装置 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019214960A Division JP6825069B2 (ja) | 2019-11-28 | 2019-11-28 | 真空処理装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2017143186A JP2017143186A (ja) | 2017-08-17 |
| JP2017143186A5 true JP2017143186A5 (enExample) | 2019-03-07 |
| JP6625891B2 JP6625891B2 (ja) | 2019-12-25 |
Family
ID=59498305
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016023693A Active JP6625891B2 (ja) | 2016-02-10 | 2016-02-10 | 真空処理装置 |
Country Status (2)
| Country | Link |
|---|---|
| US (3) | US10290472B2 (enExample) |
| JP (1) | JP6625891B2 (enExample) |
Families Citing this family (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6820717B2 (ja) | 2016-10-28 | 2021-01-27 | 株式会社日立ハイテク | プラズマ処理装置 |
| US11694911B2 (en) | 2016-12-20 | 2023-07-04 | Lam Research Corporation | Systems and methods for metastable activated radical selective strip and etch using dual plenum showerhead |
| KR102563925B1 (ko) * | 2018-08-31 | 2023-08-04 | 삼성전자 주식회사 | 반도체 제조 장치 |
| WO2020086173A2 (en) * | 2018-09-26 | 2020-04-30 | Applied Materials, Inc. | Heat conductive spacer for plasma processing chamber |
| US11276579B2 (en) | 2018-11-14 | 2022-03-15 | Hitachi High-Tech Corporation | Substrate processing method and plasma processing apparatus |
| WO2020110192A1 (ja) | 2018-11-27 | 2020-06-04 | 株式会社日立ハイテクノロジーズ | プラズマ処理装置及びそれを用いた試料の処理方法 |
| US11515167B2 (en) | 2019-02-01 | 2022-11-29 | Hitachi High-Tech Corporation | Plasma etching method and plasma processing apparatus |
| WO2021108294A2 (en) | 2019-11-27 | 2021-06-03 | Applied Materials, Inc. | Processing chamber with multiple plasma units |
| WO2021108297A1 (en) | 2019-11-27 | 2021-06-03 | Applied Materials, Inc. | Dual plasma pre-clean for selective gap fill |
| CN113287190B (zh) | 2019-12-20 | 2023-12-22 | 株式会社日立高新技术 | 等离子处理装置以及晶片处理方法 |
| FI129609B (en) * | 2020-01-10 | 2022-05-31 | Picosun Oy | Substrate processing apparatus |
| JP7244447B2 (ja) * | 2020-02-20 | 2023-03-22 | 株式会社日立ハイテク | プラズマ処理装置 |
| US11961719B2 (en) | 2020-06-25 | 2024-04-16 | Hitachi High-Tech Corporation | Vacuum processing method |
| CN114127896A (zh) | 2020-06-30 | 2022-03-01 | 株式会社日立高新技术 | 蚀刻处理方法以及蚀刻处理装置 |
| JP2022152246A (ja) * | 2021-03-29 | 2022-10-12 | 株式会社日立ハイテク | ウエハ処理装置 |
| KR20230015846A (ko) * | 2021-07-23 | 2023-01-31 | 에이에스엠 아이피 홀딩 비.브이. | 램프 히터가 있는 기판 이송 시스템, 챔버 퍼지 방법 |
| JP7092959B1 (ja) * | 2022-03-23 | 2022-06-28 | Ｓｐｐテクノロジーズ株式会社 | 基板処理装置 |
| JP7245378B1 (ja) | 2022-03-23 | 2023-03-23 | Ｓｐｐテクノロジーズ株式会社 | 基板処理装置 |
| CN119948614A (zh) | 2023-09-06 | 2025-05-06 | 株式会社日立高新技术 | 晶片处理装置 |
| WO2025243104A1 (en) * | 2024-05-24 | 2025-11-27 | Applied Materials, Inc. | Heating system, vacuum chamber, and method of processing a substrate in a vacuum chamber |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62130275A (ja) | 1985-12-02 | 1987-06-12 | Anelva Corp | 放射線導入窓 |
| JPH04293781A (ja) | 1991-03-20 | 1992-10-19 | Hitachi Ltd | マイクロ波プラズマ処理装置 |
| KR100605884B1 (ko) | 1998-11-11 | 2006-08-01 | 동경 엘렉트론 주식회사 | 표면 처리 방법 및 장치 |
| JP2002083803A (ja) * | 2000-09-07 | 2002-03-22 | Yac Co Ltd | エッチング装置やアッシング装置といったようなドライプロセッシング装置 |
| JP4232330B2 (ja) * | 2000-09-22 | 2009-03-04 | 東京エレクトロン株式会社 | 励起ガス形成装置、処理装置及び処理方法 |
| US20070267143A1 (en) * | 2006-05-16 | 2007-11-22 | Applied Materials, Inc. | In situ cleaning of CVD system exhaust |
| JP4995579B2 (ja) * | 2007-01-05 | 2012-08-08 | 株式会社日立国際電気 | 基板処理装置及び半導体デバイスの製造方法 |
| US7967996B2 (en) * | 2007-01-30 | 2011-06-28 | Applied Materials, Inc. | Process for wafer backside polymer removal and wafer front side photoresist removal |
| US9793126B2 (en) | 2010-08-04 | 2017-10-17 | Lam Research Corporation | Ion to neutral control for wafer processing with dual plasma source reactor |
| US9548223B2 (en) * | 2011-12-23 | 2017-01-17 | Lam Research Ag | Apparatus for treating surfaces of wafer-shaped articles |
| US20150129131A1 (en) * | 2013-11-14 | 2015-05-14 | Taiwan Semiconductor Manufacturing Co., Ltd. | Semiconductor processing apparatus and pre-clean system |
| JP2015185594A (ja) * | 2014-03-20 | 2015-10-22 | 株式会社日立ハイテクノロジーズ | エッチング装置 |
-
2016
- 2016-02-10 JP JP2016023693A patent/JP6625891B2/ja active Active
- 2016-03-17 US US15/072,392 patent/US10290472B2/en active Active
-
2019
- 2019-04-09 US US16/378,783 patent/US10937635B2/en active Active
-
2021
- 2021-01-28 US US17/160,801 patent/US11557463B2/en active Active
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