JP2014526113A5 - - Google Patents

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Publication number
JP2014526113A5
JP2014526113A5 JP2014516964A JP2014516964A JP2014526113A5 JP 2014526113 A5 JP2014526113 A5 JP 2014526113A5 JP 2014516964 A JP2014516964 A JP 2014516964A JP 2014516964 A JP2014516964 A JP 2014516964A JP 2014526113 A5 JP2014526113 A5 JP 2014526113A5
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JP
Japan
Prior art keywords
outer conductor
main portion
openings
conductor
plasma chamber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2014516964A
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English (en)
Japanese (ja)
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JP2014526113A (ja
JP6076337B2 (ja
Filing date
Publication date
Priority claimed from US13/282,469 external-priority patent/US20120326592A1/en
Application filed filed Critical
Publication of JP2014526113A publication Critical patent/JP2014526113A/ja
Publication of JP2014526113A5 publication Critical patent/JP2014526113A5/ja
Application granted granted Critical
Publication of JP6076337B2 publication Critical patent/JP6076337B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2014516964A 2011-06-21 2012-06-21 プラズマチャンバのための伝送線ｒｆアプリケータ Expired - Fee Related JP6076337B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201161499205P 2011-06-21 2011-06-21
US61/499,205 2011-06-21
US13/282,469 US20120326592A1 (en) 2011-06-21 2011-10-27 Transmission Line RF Applicator for Plasma Chamber
US13/282,469 2011-10-27
PCT/US2012/000298 WO2012177293A2 (en) 2011-06-21 2012-06-21 Transmission line rf applicator for plasma chamber

Publications (3)

Publication Number Publication Date
JP2014526113A JP2014526113A (ja) 2014-10-02
JP2014526113A5 true JP2014526113A5 (enExample) 2015-08-06
JP6076337B2 JP6076337B2 (ja) 2017-02-08

Family

ID=47361213

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014516964A Expired - Fee Related JP6076337B2 (ja) 2011-06-21 2012-06-21 プラズマチャンバのための伝送線ｒｆアプリケータ

Country Status (5)

Country Link
US (1) US20120326592A1 (enExample)
JP (1) JP6076337B2 (enExample)
KR (1) KR101696198B1 (enExample)
CN (4) CN111010795B (enExample)
WO (1) WO2012177293A2 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9048518B2 (en) * 2011-06-21 2015-06-02 Applied Materials, Inc. Transmission line RF applicator for plasma chamber
US20150243483A1 (en) * 2014-02-21 2015-08-27 Lam Research Corporation Tunable rf feed structure for plasma processing
JP6240042B2 (ja) * 2014-08-05 2017-11-29 東芝メモリ株式会社 半導体製造装置および半導体装置の製造方法
US9456532B2 (en) * 2014-12-18 2016-09-27 General Electric Company Radio-frequency power generator configured to reduce electromagnetic emissions
JP6483546B2 (ja) * 2015-06-24 2019-03-13 トヨタ自動車株式会社 プラズマ化学気相成長装置
JP6561725B2 (ja) * 2015-09-25 2019-08-21 日新電機株式会社 アンテナ及びプラズマ処理装置
US10943768B2 (en) * 2018-04-20 2021-03-09 Applied Materials, Inc. Modular high-frequency source with integrated gas distribution
JP2022512764A (ja) * 2018-10-18 2022-02-07 アプライド マテリアルズ インコーポレイテッド 放射デバイス、基板上に材料を堆積させるための堆積装置、及び基板上に材料を堆積させるための方法
WO2020117594A1 (en) 2018-12-04 2020-06-11 Applied Materials, Inc. Substrate supports including metal-ceramic interfaces

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63114974A (ja) * 1986-10-31 1988-05-19 Matsushita Electric Ind Co Ltd プラズマ装置
US5707452A (en) * 1996-07-08 1998-01-13 Applied Microwave Plasma Concepts, Inc. Coaxial microwave applicator for an electron cyclotron resonance plasma source
JP4025330B2 (ja) * 1996-07-08 2007-12-19 株式会社東芝 プラズマ処理装置
JP2959508B2 (ja) * 1997-02-14 1999-10-06 日新電機株式会社 プラズマ発生装置
JP4273983B2 (ja) * 2004-02-04 2009-06-03 株式会社島津製作所 表面波励起プラズマｃｖｄ装置
US7180392B2 (en) * 2004-06-01 2007-02-20 Verigy Pte Ltd Coaxial DC block
JP2006144099A (ja) * 2004-11-24 2006-06-08 Toppan Printing Co Ltd ３次元中空容器の薄膜成膜装置
KR100689037B1 (ko) * 2005-08-24 2007-03-08 삼성전자주식회사 마이크로파 공명 플라즈마 발생장치 및 그것을 구비하는플라즈마 처리 시스템
DE102006048815B4 (de) * 2006-10-16 2016-03-17 Iplas Innovative Plasma Systems Gmbh Vorrichtung und Verfahren zur Erzeugung von Mikrowellenplasmen hoher Leistung
FR2921538B1 (fr) * 2007-09-20 2009-11-13 Air Liquide Dispositifs generateurs de plasma micro-ondes et torches a plasma
JP2010080350A (ja) * 2008-09-26 2010-04-08 Tokai Rubber Ind Ltd マイクロ波プラズマ処理装置およびマイクロ波プラズマ処理方法
JP2010219004A (ja) * 2009-03-19 2010-09-30 Adtec Plasma Technology Co Ltd プラズマ発生装置
US8147614B2 (en) * 2009-06-09 2012-04-03 Applied Materials, Inc. Multi-gas flow diffuser

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