JP2017130531A - 半導体装置 - Google Patents
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- 229910052751 metal Inorganic materials 0.000 claims abstract description 36
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- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
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Abstract
【解決手段】実施形態の半導体装置は、環状の第1のフレームと、複数の半導体素子と、第1の電極と、第2の電極と、第1のフレームの内側に設けられ、少なくとも一部が第1の電極と第2の電極との間に設けられ、樹脂を含み、複数の半導体素子を保持する第2のフレームと、第1の電極の周囲に設けられ、第1のフレームと第1の電極を接続し、金属を含み、環状の第1の部材と、第2の電極の周囲に設けられ、第1のフレームと第2の電極を接続し、金属を含み、環状の第2の部材と、第1の電極の周囲に設けられ、少なくとも一部が第1の部材と第2のフレームとの間に設けられ、外周部の少なくとも一部の領域が第1のフレームに接するか又は重なり、環状の第1の弾性体と、第2の電極の周囲に設けられ、少なくとも一部が第2の部材と第2のフレームとの間に設けられ、環状の第2の弾性体と、を備える。
【選択図】図1
Description
実施形態の半導体装置は、セラミックを含み、環状の第1のフレームと、複数の半導体素子と、第1の電極と、第2の電極と、第1のフレームの内側に設けられ、少なくとも一部が第1の電極と第2の電極との間に設けられ、樹脂を含み、複数の半導体素子を保持する第2のフレームと、第1の電極の周囲に設けられ、第1のフレームと第1の電極を接続し、金属を含み、環状の第1の部材と、第2の電極の周囲に設けられ、第1のフレームと第2の電極を接続し、金属を含み、環状の第2の部材と、第1の電極の周囲に設けられ、少なくとも一部が第1の部材と第2のフレームとの間に設けられ、外周部の少なくとも一部の領域の端部が第1のフレームに接するか又は重なり、第1の部材よりも弾性限界に至るまでの変位量が大きい、環状の第1の弾性体と、第2の電極の周囲に設けられ、少なくとも一部が第2の部材と第2のフレームとの間に設けられ、第2の部材よりも弾性限界に至るまでの変位量が大きい、環状の第2の弾性体と、を備える。
本実施形態の半導体装置は、第1の弾性体の外周部の全部の領域が第1のフレームに重なる点で、第1の実施形態と異なっている。第1の実施形態と重複する内容については、記述を省略する。
本実施形態の半導体装置は、第1の弾性体の外周部の少なくとも一部の領域が第1のフレームに接する点で、第1の実施形態と異なっている。第1の実施形態と重複する内容については、記述を省略する。
12 ハウジング(第1のフレーム)
14 樹脂フレーム(第2のフレーム)
14a 第1のサブフレーム
14b 第2のサブフレーム
18 第1の電極ブロック(第1の電極)
20 第2の電極ブロック(第2の電極)
22 第1のフランジ(第1の部材)
24 第2のフランジ(第2の部材)
26 第1の保護材(第1の弾性体)
26a 凸領域(領域)
28 第2の保護材(第2の弾性体)
28a 凸領域(領域)
Claims (5)
- 環状の第1のフレームと、
複数の半導体素子と、
第1の電極と、
第2の電極と、
前記第1のフレームの内側に設けられ、少なくとも一部が前記第1の電極と前記第2の電極との間に設けられ、樹脂を含み、前記複数の半導体素子を保持する第2のフレームと、
前記第1の電極の周囲に設けられ、前記第1のフレームと前記第1の電極を接続し、金属を含み、環状の第1の部材と、
前記第2の電極の周囲に設けられ、前記第1のフレームと前記第2の電極を接続し、金属を含み、環状の第2の部材と、
前記第1の電極の周囲に設けられ、少なくとも一部が前記第1の部材と前記第2のフレームとの間に設けられ、外周部の少なくとも一部の領域が前記第1のフレームに接するか又は重なり、前記第1の部材よりも弾性限界に至るまでの変位量が大きい、環状の第1の弾性体と、
前記第2の電極の周囲に設けられ、少なくとも一部が前記第2の部材と前記第2のフレームとの間に設けられ、前記第2の部材よりも弾性限界に至るまでの変位量が大きい、環状の第2の弾性体と、
を備える半導体装置。 - 前記領域が複数設けられ、前記領域が前記第1の部材の外周部に設けられた凸領域である請求項1記載の半導体装置。
- 前記第2のフレームが、第1のサブフレーム、前記第1のサブフレームとの間に前記半導体素子を挟む第2のサブフレームを有し、前記第1のサブフレームと前記第2のサブフレームの一方に複数の凹部が設けられ、前記第1のサブフレームと前記第2のサブフレームの他方に前記複数の凹部にはめ込まれた凸部が設けられ、前記凹部と前記第1の部材との間に挟まれた前記第1の弾性体の外周部に前記領域が設けられた請求項2記載の半導体装置。
- 前記第1のフレーム、前記第1の電極、前記第2の電極、前記第1の部材、及び、前記第2の部材で囲まれる領域内に存在する空洞部の体積を第1の体積とし、前記第1の弾性体及び前記第2の弾性体の占める体積を第2の体積とした場合に、前記第1の体積と前記第2の体積の和に対して前記第2の体積が占める割合が45%以下である請求項1乃至請求項3いずれか一項記載の半導体装置。
- 前記第1の弾性体及び前記第2の弾性体は、シリコーン、PTFE、又は、ポリイミドである請求項1乃至請求項4いずれか一項記載の半導体装置。
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JP2016008331A JP6359573B2 (ja) | 2016-01-19 | 2016-01-19 | 半導体装置 |
US15/252,048 US10032760B2 (en) | 2016-01-19 | 2016-08-30 | Semiconductor device |
CN201610801251.9A CN106981460B (zh) | 2016-01-19 | 2016-09-05 | 半导体装置 |
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JP2016008331A JP6359573B2 (ja) | 2016-01-19 | 2016-01-19 | 半導体装置 |
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JP2017130531A true JP2017130531A (ja) | 2017-07-27 |
JP6359573B2 JP6359573B2 (ja) | 2018-07-18 |
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Cited By (1)
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JP7444529B2 (ja) | 2021-05-17 | 2024-03-06 | 東芝三菱電機産業システム株式会社 | 電力変換装置 |
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Publication number | Priority date | Publication date | Assignee | Title |
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CN113330556B (zh) * | 2019-02-01 | 2024-07-30 | 三菱电机株式会社 | 半导体装置 |
JP7395452B2 (ja) * | 2020-09-23 | 2023-12-11 | 株式会社東芝 | 半導体装置 |
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JPH04352457A (ja) * | 1991-05-30 | 1992-12-07 | Mitsubishi Electric Corp | 圧接型半導体装置及びその製造方法 |
JPH06177272A (ja) * | 1992-12-08 | 1994-06-24 | Fuji Electric Co Ltd | 平形半導体整流素子の取付け構造 |
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JP2008084926A (ja) * | 2006-09-26 | 2008-04-10 | Mitsubishi Electric Corp | 圧接型半導体装置 |
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JPH0760893B2 (ja) * | 1989-11-06 | 1995-06-28 | 三菱電機株式会社 | 半導体装置およびその製造方法 |
US5371386A (en) | 1992-04-28 | 1994-12-06 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device and method of assembling the same |
JP2741822B2 (ja) | 1992-09-07 | 1998-04-22 | 三菱電機株式会社 | 半導体装置およびその組立方法 |
DE19839422A1 (de) | 1998-08-29 | 2000-03-02 | Asea Brown Boveri | Explosionsschutz für Halbleitermodule |
JP2016082105A (ja) | 2014-10-17 | 2016-05-16 | 株式会社東芝 | 半導体装置 |
JP6301857B2 (ja) * | 2015-02-24 | 2018-03-28 | 株式会社東芝 | 半導体モジュール |
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- 2016-01-19 JP JP2016008331A patent/JP6359573B2/ja not_active Expired - Fee Related
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JP7444529B2 (ja) | 2021-05-17 | 2024-03-06 | 東芝三菱電機産業システム株式会社 | 電力変換装置 |
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CN106981460A (zh) | 2017-07-25 |
JP6359573B2 (ja) | 2018-07-18 |
US10032760B2 (en) | 2018-07-24 |
US20170207211A1 (en) | 2017-07-20 |
CN106981460B (zh) | 2019-09-20 |
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