JP2017123354A5 - - Google Patents

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Publication number
JP2017123354A5
JP2017123354A5 JP2016000029A JP2016000029A JP2017123354A5 JP 2017123354 A5 JP2017123354 A5 JP 2017123354A5 JP 2016000029 A JP2016000029 A JP 2016000029A JP 2016000029 A JP2016000029 A JP 2016000029A JP 2017123354 A5 JP2017123354 A5 JP 2017123354A5
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JP
Japan
Prior art keywords
sample
plasma
voltage
processing apparatus
detaching
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2016000029A
Other languages
English (en)
Japanese (ja)
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JP6505027B2 (ja
JP2017123354A (ja
Filing date
Publication date
Priority claimed from JP2016000029A external-priority patent/JP6505027B2/ja
Priority to JP2016000029A priority Critical patent/JP6505027B2/ja
Application filed filed Critical
Priority to KR1020160098402A priority patent/KR102001018B1/ko
Priority to TW105126383A priority patent/TWI612611B/zh
Priority to US15/248,205 priority patent/US10490412B2/en
Publication of JP2017123354A publication Critical patent/JP2017123354A/ja
Publication of JP2017123354A5 publication Critical patent/JP2017123354A5/ja
Publication of JP6505027B2 publication Critical patent/JP6505027B2/ja
Application granted granted Critical
Priority to US16/660,938 priority patent/US11107694B2/en
Priority to US17/386,892 priority patent/US11664233B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2016000029A 2016-01-04 2016-01-04 試料の離脱方法およびプラズマ処理装置 Active JP6505027B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2016000029A JP6505027B2 (ja) 2016-01-04 2016-01-04 試料の離脱方法およびプラズマ処理装置
KR1020160098402A KR102001018B1 (ko) 2016-01-04 2016-08-02 시료의 이탈 방법 및 플라스마 처리 장치
TW105126383A TWI612611B (zh) 2016-01-04 2016-08-18 樣品的脫離方法及電漿處理裝置
US15/248,205 US10490412B2 (en) 2016-01-04 2016-08-26 Method for releasing sample and plasma processing apparatus using same
US16/660,938 US11107694B2 (en) 2016-01-04 2019-10-23 Method for releasing sample and plasma processing apparatus using same
US17/386,892 US11664233B2 (en) 2016-01-04 2021-07-28 Method for releasing sample and plasma processing apparatus using same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016000029A JP6505027B2 (ja) 2016-01-04 2016-01-04 試料の離脱方法およびプラズマ処理装置

Publications (3)

Publication Number Publication Date
JP2017123354A JP2017123354A (ja) 2017-07-13
JP2017123354A5 true JP2017123354A5 (enExample) 2018-05-31
JP6505027B2 JP6505027B2 (ja) 2019-04-24

Family

ID=59235797

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016000029A Active JP6505027B2 (ja) 2016-01-04 2016-01-04 試料の離脱方法およびプラズマ処理装置

Country Status (4)

Country Link
US (3) US10490412B2 (enExample)
JP (1) JP6505027B2 (enExample)
KR (1) KR102001018B1 (enExample)
TW (1) TWI612611B (enExample)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6407694B2 (ja) * 2014-12-16 2018-10-17 株式会社日立ハイテクノロジーズ プラズマ処理装置
JP6811144B2 (ja) * 2017-05-30 2021-01-13 東京エレクトロン株式会社 プラズマ処理装置の静電チャックを運用する方法
CN108550538B (zh) * 2018-05-21 2021-01-08 浙江兰达光电科技有限公司 一种半导体芯片生产工艺
US11437262B2 (en) * 2018-12-12 2022-09-06 Applied Materials, Inc Wafer de-chucking detection and arcing prevention
EP4132228A4 (en) * 2020-03-31 2024-05-15 Atonarp Inc. PLASMA GENERATION DEVICE
JP7519877B2 (ja) * 2020-10-29 2024-07-22 東京エレクトロン株式会社 プラズマ処理方法およびプラズマ処理装置
JP7578360B2 (ja) * 2020-12-22 2024-11-06 東京エレクトロン株式会社 除電方法及びプラズマ処理システム

Family Cites Families (24)

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US5459632A (en) * 1994-03-07 1995-10-17 Applied Materials, Inc. Releasing a workpiece from an electrostatic chuck
TW334609B (en) * 1996-09-19 1998-06-21 Hitachi Ltd Electrostatic chuck, method and device for processing sanyle use the same
KR19980024679U (ko) 1996-10-30 1998-07-25 홍성기 광고용 녹화 카셋테이프
JP2978470B2 (ja) * 1998-04-08 1999-11-15 株式会社日立製作所 静電吸着装置および被吸着物離脱方法
GB9812850D0 (en) * 1998-06-16 1998-08-12 Surface Tech Sys Ltd A method and apparatus for dechucking
US6125025A (en) * 1998-09-30 2000-09-26 Lam Research Corporation Electrostatic dechucking method and apparatus for dielectric workpieces in vacuum processors
US6236555B1 (en) * 1999-04-19 2001-05-22 Applied Materials, Inc. Method for rapidly dechucking a semiconductor wafer from an electrostatic chuck utilizing a hysteretic discharge cycle
JP2002134489A (ja) * 2000-10-25 2002-05-10 Tokyo Electron Ltd 基板除電方法、気相堆積装置、半導体装置の製造方法
US6898064B1 (en) * 2001-08-29 2005-05-24 Lsi Logic Corporation System and method for optimizing the electrostatic removal of a workpiece from a chuck
JP2004047511A (ja) * 2002-07-08 2004-02-12 Tokyo Electron Ltd 離脱方法、処理方法、静電吸着装置および処理装置
JP4336124B2 (ja) * 2003-03-10 2009-09-30 東京エレクトロン株式会社 プラズマ処理方法及びプラズマ処理装置
US7292428B2 (en) * 2005-04-26 2007-11-06 Applied Materials, Inc. Electrostatic chuck with smart lift-pin mechanism for a plasma reactor
JP4847909B2 (ja) * 2007-03-29 2011-12-28 東京エレクトロン株式会社 プラズマ処理方法及び装置
JP2009054746A (ja) * 2007-08-27 2009-03-12 Nikon Corp 静電チャック及び静電チャック方法
US7813103B2 (en) * 2007-10-11 2010-10-12 Applied Materials, Inc. Time-based wafer de-chucking from an electrostatic chuck having separate RF BIAS and DC chucking electrodes
JP2009141069A (ja) * 2007-12-05 2009-06-25 Hitachi High-Technologies Corp プラズマ処理装置及び処理方法
JP2010040822A (ja) * 2008-08-06 2010-02-18 Tokyo Electron Ltd 静電吸着装置の除電処理方法、基板処理装置、及び記憶媒体
WO2010081009A2 (en) * 2009-01-11 2010-07-15 Applied Materials, Inc. Systems, apparatus and methods for making an electrical connection to a robot and electrical end effector thereof
CN101872733B (zh) * 2009-04-24 2012-06-27 中微半导体设备(上海)有限公司 感测和移除被加工半导体工艺件的残余电荷的系统和方法
US8797705B2 (en) * 2009-09-10 2014-08-05 Lam Research Corporation Methods and arrangement for plasma dechuck optimization based on coupling of plasma signaling to substrate position and potential
US8840754B2 (en) * 2010-09-17 2014-09-23 Lam Research Corporation Polar regions for electrostatic de-chucking with lift pins
JP5875775B2 (ja) * 2011-03-30 2016-03-02 東京エレクトロン株式会社 基板除去方法及び記憶媒体
JP6013740B2 (ja) * 2012-02-03 2016-10-25 東京エレクトロン株式会社 離脱制御方法及びプラズマ処理装置の制御装置
JP6132497B2 (ja) * 2012-09-12 2017-05-24 東京エレクトロン株式会社 離脱制御方法及びプラズマ処理装置

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