JP2017120821A5 - - Google Patents
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- Publication number
- JP2017120821A5 JP2017120821A5 JP2015256354A JP2015256354A JP2017120821A5 JP 2017120821 A5 JP2017120821 A5 JP 2017120821A5 JP 2015256354 A JP2015256354 A JP 2015256354A JP 2015256354 A JP2015256354 A JP 2015256354A JP 2017120821 A5 JP2017120821 A5 JP 2017120821A5
- Authority
- JP
- Japan
- Prior art keywords
- insulating film
- manufacturing
- semiconductor device
- heat treatment
- source
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- 239000004065 semiconductor Substances 0.000 claims 45
- 238000004519 manufacturing process Methods 0.000 claims 32
- 238000010438 heat treatment Methods 0.000 claims 22
- 238000000034 method Methods 0.000 claims 16
- 239000002184 metal Substances 0.000 claims 13
- 239000000758 substrate Substances 0.000 claims 13
- 239000004020 conductor Substances 0.000 claims 6
- 229910021332 silicide Inorganic materials 0.000 claims 6
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 claims 6
- 238000005530 etching Methods 0.000 claims 4
- 238000004140 cleaning Methods 0.000 claims 3
- 239000012535 impurity Substances 0.000 claims 2
- 238000005468 ion implantation Methods 0.000 claims 2
- 239000000463 material Substances 0.000 claims 2
- 230000015572 biosynthetic process Effects 0.000 claims 1
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015256354A JP2017120821A (ja) | 2015-12-28 | 2015-12-28 | 半導体装置の製造方法 |
| US15/368,625 US10134869B2 (en) | 2015-12-28 | 2016-12-04 | Method of manufacturing semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015256354A JP2017120821A (ja) | 2015-12-28 | 2015-12-28 | 半導体装置の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2017120821A JP2017120821A (ja) | 2017-07-06 |
| JP2017120821A5 true JP2017120821A5 (OSRAM) | 2018-07-12 |
Family
ID=59087315
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015256354A Pending JP2017120821A (ja) | 2015-12-28 | 2015-12-28 | 半導体装置の製造方法 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US10134869B2 (OSRAM) |
| JP (1) | JP2017120821A (OSRAM) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11205578B2 (en) * | 2017-10-18 | 2021-12-21 | Texas Instruments Incorporated | Dopant anneal with stabilization step for IC with matched devices |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100212098B1 (ko) * | 1987-09-19 | 1999-08-02 | 가나이 쓰도무 | 반도체 집적회로 장치 및 그 제조 방법과 반도체 집적 회로 장치의 배선기판 및 그 제조 방법 |
| JPH09199720A (ja) * | 1996-01-22 | 1997-07-31 | Oki Electric Ind Co Ltd | Ｍｏｓ型半導体装置とその製造方法 |
| JP2002280459A (ja) * | 2001-03-21 | 2002-09-27 | Kawasaki Microelectronics Kk | 集積回路の製造方法 |
| JP2004103900A (ja) * | 2002-09-11 | 2004-04-02 | Matsushita Electric Ind Co Ltd | 半導体装置及びその製造方法 |
| KR100446309B1 (ko) * | 2002-11-14 | 2004-09-01 | 삼성전자주식회사 | Ｌ자형 스페이서를 채용한 반도체 소자의 제조 방법 |
| JP2004235255A (ja) * | 2003-01-28 | 2004-08-19 | Nec Electronics Corp | 半導体装置の製造方法及び半導体装置 |
| JP5061429B2 (ja) | 2005-07-01 | 2012-10-31 | ソニー株式会社 | 半導体装置の製造方法 |
| JP2007019206A (ja) * | 2005-07-07 | 2007-01-25 | Matsushita Electric Ind Co Ltd | 半導体装置及びその製造方法 |
| US8115154B2 (en) | 2008-08-01 | 2012-02-14 | Sony Corporation | Solid-state imaging device, method of producing the same, and imaging device |
| JP5493382B2 (ja) | 2008-08-01 | 2014-05-14 | ソニー株式会社 | 固体撮像装置、その製造方法および撮像装置 |
| JP5446281B2 (ja) * | 2008-08-01 | 2014-03-19 | ソニー株式会社 | 固体撮像装置、その製造方法および撮像装置 |
| JP5430904B2 (ja) * | 2008-10-15 | 2014-03-05 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法 |
-
2015
- 2015-12-28 JP JP2015256354A patent/JP2017120821A/ja active Pending
-
2016
- 2016-12-04 US US15/368,625 patent/US10134869B2/en active Active
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