JP2017112612A5 - - Google Patents

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JP2017112612A5
JP2017112612A5 JP2016244228A JP2016244228A JP2017112612A5 JP 2017112612 A5 JP2017112612 A5 JP 2017112612A5 JP 2016244228 A JP2016244228 A JP 2016244228A JP 2016244228 A JP2016244228 A JP 2016244228A JP 2017112612 A5 JP2017112612 A5 JP 2017112612A5
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piezoelectric
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transducer
base
vibration
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JP2016244228A 2011-02-15 2016-12-16 マイクロドームアレイを使用した圧電トランスデューサ Active JP6262837B2 (ja)

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US201161443042P 2011-02-15 2011-02-15
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EP (1) EP2676459B1 (enExample)
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KR (1) KR20140005289A (enExample)
CN (2) CN106269451B (enExample)
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Families Citing this family (152)

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Publication number Priority date Publication date Assignee Title
US9282945B2 (en) 2009-04-14 2016-03-15 Maui Imaging, Inc. Calibration of ultrasound probes
US10226234B2 (en) 2011-12-01 2019-03-12 Maui Imaging, Inc. Motion detection using ping-based and multiple aperture doppler ultrasound
US9173047B2 (en) 2008-09-18 2015-10-27 Fujifilm Sonosite, Inc. Methods for manufacturing ultrasound transducers and other components
US9184369B2 (en) 2008-09-18 2015-11-10 Fujifilm Sonosite, Inc. Methods for manufacturing ultrasound transducers and other components
JP2011076725A (ja) * 2009-09-29 2011-04-14 Fujifilm Corp 圧電型ｍｅｍｓ素子およびその製造方法
EP2536339B1 (en) 2010-02-18 2024-05-15 Maui Imaging, Inc. Point source transmission and speed-of-sound correction using multi-aperture ultrasound imaging
EP3563768A3 (en) 2010-10-13 2020-02-12 Maui Imaging, Inc. Concave ultrasound transducers and 3d arrays
CN106269451B (zh) 2011-02-15 2020-02-21 富士胶卷迪马蒂克斯股份有限公司 使用微圆顶阵列的压电式换能器
US8811636B2 (en) * 2011-11-29 2014-08-19 Qualcomm Mems Technologies, Inc. Microspeaker with piezoelectric, metal and dielectric membrane
JP2015503404A (ja) 2011-12-29 2015-02-02 マウイ イマギング，インコーポレーテッド 任意経路のｍモード超音波イメージング
EP2816958B1 (en) 2012-02-21 2020-03-25 Maui Imaging, Inc. Determining material stiffness using multiple aperture ultrasound
IN2014DN07243A (enExample) 2012-03-26 2015-04-24 Maui Imaging Inc
US8767512B2 (en) 2012-05-01 2014-07-01 Fujifilm Dimatix, Inc. Multi-frequency ultra wide bandwidth transducer
US9454954B2 (en) * 2012-05-01 2016-09-27 Fujifilm Dimatix, Inc. Ultra wide bandwidth transducer with dual electrode
EP2883079B1 (en) 2012-08-10 2017-09-27 Maui Imaging, Inc. Calibration of multiple aperture ultrasound probes
KR102176319B1 (ko) 2012-08-21 2020-11-09 마우이 이미징, 인코포레이티드 초음파 이미징 시스템 메모리 아키텍처
CN103676827A (zh) 2012-09-06 2014-03-26 Ip音乐集团有限公司 用于远程控制音频设备的系统和方法
CN203053923U (zh) * 2012-09-18 2013-07-10 天津空中代码工程应用软件开发有限公司 监控高聚合物材料注塑过程的传感器
TWI498011B (zh) * 2012-09-24 2015-08-21 Zippy Tech Corp Waterproof piezoelectric ceramic speakers
US9660170B2 (en) 2012-10-26 2017-05-23 Fujifilm Dimatix, Inc. Micromachined ultrasonic transducer arrays with multiple harmonic modes
US10555720B2 (en) 2012-12-28 2020-02-11 Volcano Corporation Intravascular ultrasound imaging apparatus, interface, architecture, and method of manufacturing
US9375850B2 (en) * 2013-02-07 2016-06-28 Fujifilm Dimatix, Inc. Micromachined ultrasonic transducer devices with metal-semiconductor contact for reduced capacitive cross-talk
US9096422B2 (en) * 2013-02-15 2015-08-04 Fujifilm Dimatix, Inc. Piezoelectric array employing integrated MEMS switches
WO2014160291A1 (en) 2013-03-13 2014-10-02 Maui Imaging, Inc. Alignment of ultrasound transducer arrays and multiple aperture probe assembly
EP2973767B1 (en) 2013-03-14 2017-11-22 Volcano Corporation Method of coating wafer-scale transducer
FR3005223B1 (fr) * 2013-04-30 2015-04-24 Sagem Defense Securite Procede de commande d'un dispositif piezoelectrique a element piezoelectrique rapporte sur un support
US9437802B2 (en) 2013-08-21 2016-09-06 Fujifilm Dimatix, Inc. Multi-layered thin film piezoelectric devices and methods of making the same
US9883848B2 (en) 2013-09-13 2018-02-06 Maui Imaging, Inc. Ultrasound imaging using apparent point-source transmit transducer
JP5797356B2 (ja) * 2013-09-26 2015-10-21 京セラ株式会社 弾性波装置および弾性波モジュール
US9475093B2 (en) 2013-10-03 2016-10-25 Fujifilm Dimatix, Inc. Piezoelectric ultrasonic transducer array with switched operational modes
WO2015063702A2 (en) * 2013-11-04 2015-05-07 Koninklijke Philips N.V. High volume manufacture of single element ultrasound transducers
US9525119B2 (en) * 2013-12-11 2016-12-20 Fujifilm Dimatix, Inc. Flexible micromachined transducer device and method for fabricating same
US10478858B2 (en) 2013-12-12 2019-11-19 Qualcomm Incorporated Piezoelectric ultrasonic transducer and process
US9604255B2 (en) * 2014-01-10 2017-03-28 Fujifilm Dimatix, Inc. Method, apparatus and system for a transferable micromachined piezoelectric transducer array
WO2015112452A1 (en) * 2014-01-24 2015-07-30 The Regents Of The University Of California Curved piezoelectric transducers
EP3110628B1 (en) * 2014-02-28 2019-07-03 The Regents of the University of California Variable thickness diaphragm for a wideband robust piezoelectric micromachined ultrasonic transducer (pmut)
JP6209992B2 (ja) * 2014-03-04 2017-10-11 富士ゼロックス株式会社 静電荷像現像用トナー、静電荷像現像剤、トナーカートリッジ、プロセスカートリッジ、画像形成装置、及び画像形成方法
JP6209993B2 (ja) * 2014-03-04 2017-10-11 富士ゼロックス株式会社 静電荷像現像用トナー、静電荷像現像剤、トナーカートリッジ、プロセスカートリッジ、画像形成装置、及び画像形成方法
NL2012419B1 (en) * 2014-03-13 2016-01-06 Novioscan B V High voltage MEMS, and a portable ultrasound device comprising such a MEMS.
US10022751B2 (en) * 2014-05-30 2018-07-17 Fujifilm Dimatix, Inc. Piezoelectric transducer device for configuring a sequence of operational modes
US10107645B2 (en) 2014-05-30 2018-10-23 Fujifilm Dimatix, Inc. Piezoelectric transducer device with flexible substrate
US9789515B2 (en) 2014-05-30 2017-10-17 Fujifilm Dimatix, Inc. Piezoelectric transducer device with lens structures
CN106660074B (zh) * 2014-07-08 2019-09-24 高通股份有限公司 压电超声换能器及工艺
KR102617888B1 (ko) 2014-08-18 2023-12-22 마우이 이미징, 인코포레이티드 네트워크-기반 초음파 이미징 시스템
US10139479B2 (en) * 2014-10-15 2018-11-27 Qualcomm Incorporated Superpixel array of piezoelectric ultrasonic transducers for 2-D beamforming
CN104270034A (zh) * 2014-10-20 2015-01-07 吉林大学 一种曲面压电发电悬臂梁
JP5798699B1 (ja) * 2014-10-24 2015-10-21 太陽誘電株式会社 電気音響変換装置
CN104622512B (zh) * 2015-02-04 2017-06-13 天津大学 椭圆膜单元结构电容式微超声传感器环形阵列及电路系统
US9862592B2 (en) * 2015-03-13 2018-01-09 Taiwan Semiconductor Manufacturing Co., Ltd. MEMS transducer and method for manufacturing the same
JP2016181841A (ja) * 2015-03-24 2016-10-13 セイコーエプソン株式会社 超音波センサー及びその駆動方法
KR102681141B1 (ko) 2015-03-30 2024-07-02 마우이 이미징, 인코포레이티드 오브젝트 모션을 검출하기 위한 초음파 이미징 시스템들 및 방법들
CN104811881B (zh) * 2015-04-29 2019-03-19 歌尔股份有限公司 压电扬声器及其形成方法
US10345162B2 (en) * 2015-08-28 2019-07-09 Kabushiki Kaisha Toshiba Sensor and electronic device
US10497748B2 (en) 2015-10-14 2019-12-03 Qualcomm Incorporated Integrated piezoelectric micromechanical ultrasonic transducer pixel and array
US11128957B2 (en) 2015-10-21 2021-09-21 Goertek Inc. Micro-speaker, speaker device and electronic apparatus
US10353503B2 (en) * 2015-10-29 2019-07-16 Texas Instruments Incorporated Integrated force sensing element
CN105305881B (zh) * 2015-11-26 2017-09-12 北京工业大学 基于压电效应的弧形振动能量采集器
CN105499110B (zh) * 2016-01-11 2017-11-21 深圳开立生物医疗科技股份有限公司 一种环形阵列换能器及其制备方法和超声内镜
WO2017132517A1 (en) 2016-01-27 2017-08-03 Maui Imaging, Inc. Ultrasound imaging with sparse array probes
JP6665667B2 (ja) * 2016-04-28 2020-03-13 セイコーエプソン株式会社 超音波デバイス、超音波モジュール、及び超音波測定装置
US10670716B2 (en) 2016-05-04 2020-06-02 Invensense, Inc. Operating a two-dimensional array of ultrasonic transducers
US10656255B2 (en) 2016-05-04 2020-05-19 Invensense, Inc. Piezoelectric micromachined ultrasonic transducer (PMUT)
US10445547B2 (en) 2016-05-04 2019-10-15 Invensense, Inc. Device mountable packaging of ultrasonic transducers
US10315222B2 (en) 2016-05-04 2019-06-11 Invensense, Inc. Two-dimensional array of CMOS control elements
US10600403B2 (en) 2016-05-10 2020-03-24 Invensense, Inc. Transmit operation of an ultrasonic sensor
US10408797B2 (en) 2016-05-10 2019-09-10 Invensense, Inc. Sensing device with a temperature sensor
US10706835B2 (en) 2016-05-10 2020-07-07 Invensense, Inc. Transmit beamforming of a two-dimensional array of ultrasonic transducers
US10452887B2 (en) 2016-05-10 2019-10-22 Invensense, Inc. Operating a fingerprint sensor comprised of ultrasonic transducers
US11673165B2 (en) 2016-05-10 2023-06-13 Invensense, Inc. Ultrasonic transducer operable in a surface acoustic wave (SAW) mode
US10441975B2 (en) 2016-05-10 2019-10-15 Invensense, Inc. Supplemental sensor modes and systems for ultrasonic transducers
US10539539B2 (en) 2016-05-10 2020-01-21 Invensense, Inc. Operation of an ultrasonic sensor
US10632500B2 (en) 2016-05-10 2020-04-28 Invensense, Inc. Ultrasonic transducer with a non-uniform membrane
US10562070B2 (en) 2016-05-10 2020-02-18 Invensense, Inc. Receive operation of an ultrasonic sensor
US11119598B2 (en) * 2016-06-09 2021-09-14 Aito Bv Piezzoelectric touch device
US10856840B2 (en) 2016-06-20 2020-12-08 Butterfly Network, Inc. Universal ultrasound device and related apparatus and methods
US11712221B2 (en) 2016-06-20 2023-08-01 Bfly Operations, Inc. Universal ultrasound device and related apparatus and methods
US10712378B2 (en) 2016-07-01 2020-07-14 United States Of America As Represented By The Administrator Of Nasa Dynamic multidimensional electric potential and electric field quantitative measurement system and method
US10900930B2 (en) 2016-07-15 2021-01-26 United States Of America As Represented By The Administrator Of Nasa Method for phonon assisted creation and annihilation of subsurface electric dipoles
JP6595422B2 (ja) * 2016-08-24 2019-10-23 株式会社東芝 センサ及び電子機器
JP6805630B2 (ja) * 2016-08-24 2020-12-23 セイコーエプソン株式会社 超音波デバイス、超音波モジュール、及び超音波測定装置
CN107920313A (zh) * 2016-08-27 2018-04-17 深圳市诺维创科技有限公司 一种微型压电超声换能器及其制作方法
JP2018048894A (ja) * 2016-09-21 2018-03-29 株式会社東芝 センサ及び電子機器
GB2555835B (en) * 2016-11-11 2018-11-28 Novosound Ltd Ultrasound transducer
US11039814B2 (en) 2016-12-04 2021-06-22 Exo Imaging, Inc. Imaging devices having piezoelectric transducers
US10518293B2 (en) * 2016-12-09 2019-12-31 Sensus USA, Inc. Thickness-planar mode transducers and related devices
US20180190896A1 (en) * 2017-01-04 2018-07-05 Te Connectivity Corporation Ultrasonic Transmitter and Receiver
US10620252B2 (en) 2017-01-19 2020-04-14 United States Of America As Represented By The Administrator Of Nasa Electric field imaging system
US10891461B2 (en) 2017-05-22 2021-01-12 Invensense, Inc. Live fingerprint detection utilizing an integrated ultrasound and infrared sensor
US10474862B2 (en) 2017-06-01 2019-11-12 Invensense, Inc. Image generation in an electronic device using ultrasonic transducers
US10643052B2 (en) 2017-06-28 2020-05-05 Invensense, Inc. Image generation in an electronic device using ultrasonic transducers
KR102391311B1 (ko) * 2017-07-07 2022-04-26 엘지디스플레이 주식회사 필름 스피커 및 이를 포함하는 표시 장치
CN107520110A (zh) * 2017-07-31 2017-12-29 瑞声科技(新加坡)有限公司 压电超声换能器及其制备方法
GB2565375A (en) * 2017-08-11 2019-02-13 Cirrus Logic Int Semiconductor Ltd MEMS devices and processes
CN107470116B (zh) * 2017-08-14 2019-10-18 太仓宏微电子科技有限公司 一种基于mems技术的高频超声阵列换能器及制作方法
US10949030B2 (en) 2017-09-26 2021-03-16 Apple Inc. Shear-poled curved piezoelectric material
TW201918079A (zh) * 2017-10-17 2019-05-01 友達光電股份有限公司 音效系統
US10936841B2 (en) 2017-12-01 2021-03-02 Invensense, Inc. Darkfield tracking
US10997388B2 (en) 2017-12-01 2021-05-04 Invensense, Inc. Darkfield contamination detection
US10984209B2 (en) 2017-12-01 2021-04-20 Invensense, Inc. Darkfield modeling
CN108175441A (zh) * 2017-12-28 2018-06-19 业成科技（成都）有限公司 超声波感测装置
US11151355B2 (en) 2018-01-24 2021-10-19 Invensense, Inc. Generation of an estimated fingerprint
US10456107B2 (en) * 2018-02-20 2019-10-29 General Electric Company Ultrasound imaging device and method for transmitting audible sounds
US10755067B2 (en) 2018-03-22 2020-08-25 Invensense, Inc. Operating a fingerprint sensor comprised of ultrasonic transducers
US10648852B2 (en) 2018-04-11 2020-05-12 Exo Imaging Inc. Imaging devices having piezoelectric transceivers
US10656007B2 (en) 2018-04-11 2020-05-19 Exo Imaging Inc. Asymmetrical ultrasound transducer array
WO2019226547A1 (en) 2018-05-21 2019-11-28 Exo Imaging, Inc. Ultrasonic transducers with q spoiling
CN108955736B (zh) * 2018-05-30 2020-03-06 京东方科技集团股份有限公司 一种超声波传感器及其制作方法、显示装置
EP3830877A4 (en) 2018-08-01 2021-10-20 Exo Imaging Inc. SYSTEMS AND PROCEDURES FOR THE INTEGRATION OF ULTRASONIC CONVERTERS WITH HYBRID CONTACTS
US10725573B2 (en) 2018-08-06 2020-07-28 Apple Inc. Annular piezoelectric structure for ultrasonic touch sensing
CN109272976B (zh) * 2018-10-25 2023-09-05 无锡十顶电子科技有限公司 一种蜂鸣器驱动电路
CN109696260A (zh) * 2018-12-25 2019-04-30 电子科技大学 一种新型压力敏感元结构
US10936843B2 (en) 2018-12-28 2021-03-02 Invensense, Inc. Segmented image acquisition
CN109760243B (zh) * 2018-12-28 2021-04-27 广州瑞派医疗器械有限责任公司 凸阵式超声波换能器制造设备及方法
CN109508097B (zh) * 2019-01-11 2022-04-08 业成科技（成都）有限公司 触觉反馈模块及其制备方法和触控装置
CN109815918B (zh) * 2019-01-28 2021-11-05 京东方科技集团股份有限公司 指纹识别模组及其制作方法和驱动方法、显示装置
CN111491238A (zh) * 2019-01-28 2020-08-04 华一声学股份有限公司 立体薄膜扬声器
JP7349090B2 (ja) * 2019-05-21 2023-09-22 日清紡マイクロデバイス株式会社 圧電素子
CN112076972A (zh) * 2019-06-12 2020-12-15 苏州嘉辉超声波科技有限公司 一种超声波换能器
US11188735B2 (en) 2019-06-24 2021-11-30 Invensense, Inc. Fake finger detection using ridge features
US11216681B2 (en) 2019-06-25 2022-01-04 Invensense, Inc. Fake finger detection based on transient features
US11216632B2 (en) 2019-07-17 2022-01-04 Invensense, Inc. Ultrasonic fingerprint sensor with a contact layer of non-uniform thickness
US11176345B2 (en) 2019-07-17 2021-11-16 Invensense, Inc. Ultrasonic fingerprint sensor with a contact layer of non-uniform thickness
CN110475188A (zh) * 2019-07-30 2019-11-19 吕舒晗 一种柔性压电换能器及系统
US20210041287A1 (en) * 2019-08-09 2021-02-11 Apple Inc. On-Bed Differential Piezoelectric Sensor
US11232549B2 (en) 2019-08-23 2022-01-25 Invensense, Inc. Adapting a quality threshold for a fingerprint image
US12109591B2 (en) * 2019-09-09 2024-10-08 GE Precision Healthcare LLC Ultrasound transducer array architecture and method of manufacture
TW202519098A (zh) 2019-09-12 2025-05-01 美商艾克索影像股份有限公司 經由邊緣溝槽、虛擬樞軸及自由邊界而增強的微加工超音波傳感器(mut)耦合效率及頻寬
CN110636420B (zh) * 2019-09-25 2021-02-09 京东方科技集团股份有限公司 一种薄膜扬声器、薄膜扬声器的制备方法以及电子设备
KR102380771B1 (ko) * 2019-10-02 2022-03-31 재단법인대구경북과학기술원 압전소자 및 압전소자 제조방법
US11392789B2 (en) 2019-10-21 2022-07-19 Invensense, Inc. Fingerprint authentication using a synthetic enrollment image
CN110793708B (zh) * 2019-11-15 2021-12-03 联合微电子中心有限责任公司 一种压电式mems声传感器
US12022737B2 (en) * 2020-01-30 2024-06-25 UltraSense Systems, Inc. System including piezoelectric capacitor assembly having force-measuring, touch-sensing, and haptic functionalities
CN115551650A (zh) 2020-03-09 2022-12-30 应美盛公司 具有非均匀厚度的接触层的超声指纹传感器
US11243300B2 (en) 2020-03-10 2022-02-08 Invensense, Inc. Operating a fingerprint sensor comprised of ultrasonic transducers and a presence sensor
US11328165B2 (en) 2020-04-24 2022-05-10 Invensense, Inc. Pressure-based activation of fingerprint spoof detection
CN111711899B (zh) * 2020-06-22 2021-06-22 武汉华星光电技术有限公司 显示面板
US11995909B2 (en) 2020-07-17 2024-05-28 Tdk Corporation Multipath reflection correction
US12174295B2 (en) 2020-08-07 2024-12-24 Tdk Corporation Acoustic multipath correction
US11951512B2 (en) 2021-03-31 2024-04-09 Exo Imaging, Inc. Imaging devices having piezoelectric transceivers with harmonic characteristics
US11819881B2 (en) 2021-03-31 2023-11-21 Exo Imaging, Inc. Imaging devices having piezoelectric transceivers with harmonic characteristics
EP4326449A1 (en) * 2021-04-19 2024-02-28 The Cleveland Clinic Foundation High resolution intravascular ultrasound (h-ivus)
US12486159B2 (en) 2021-06-30 2025-12-02 Exo Imaging, Inc. Micro-machined ultrasound transducers with insulation layer and methods of manufacture
US12416807B2 (en) 2021-08-20 2025-09-16 Tdk Corporation Retinal projection display system
US12260050B2 (en) 2021-08-25 2025-03-25 Tdk Corporation Differential receive at an ultrasonic transducer
JP2023042042A (ja) 2021-09-14 2023-03-27 日清紡ホールディングス株式会社 圧電体デバイス
CN114007175B (zh) * 2021-10-19 2022-08-23 上海交通大学 超声换能器阵列及其形成方法
CN115153638B (zh) * 2022-07-25 2025-07-01 重庆三峡医药高等专科学校 一种面部弹性模量测试方法
CN115432662B (zh) * 2022-08-12 2024-10-08 复旦大学 中心支撑底电极的微机械超声换能器
CN116237224B (zh) * 2022-12-24 2025-11-04 西安交通大学 一种压电式高频宽带透明超声换能器及其制备方法
KR20250018642A (ko) * 2023-07-31 2025-02-07 한국과학기술원 곡률 압전 미세가공 초음파 변환자 소자, 및 그 제조 방법
KR20250050276A (ko) * 2023-10-06 2025-04-15 한국과학기술연구원 초음파의 비선형성을 이용한 초음파 이미지 생성 장치 및 방법
NL2037462B1 (en) * 2024-04-15 2025-11-03 Univ Delft Tech Ultrasound transmitter

Family Cites Families (99)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5758877Y2 (enExample) * 1974-02-18 1982-12-16
JPS5215972B2 (enExample) * 1974-02-28 1977-05-06
US4045695A (en) 1974-07-15 1977-08-30 Pioneer Electronic Corporation Piezoelectric electro-acoustic transducer
US3962063A (en) 1974-12-18 1976-06-08 Advanced Materials Systems, Inc. Selective plating apparatus
US4322877A (en) 1978-09-20 1982-04-06 Minnesota Mining And Manufacturing Company Method of making piezoelectric polymeric acoustic transducer
US5265069A (en) 1979-04-27 1993-11-23 The United States Of America As Represented By The Secretary Of The Navy Blanket array adhesion system
FR2511570A1 (fr) * 1981-08-11 1983-02-18 Thomson Csf Transducteur electroacoustique a polymere piezoelectrique
DE3478357D1 (en) * 1983-03-17 1989-06-29 Matsushita Electric Industrial Co Ltd Ultrasonic transducers having improved acoustic impedance matching layers
US4588998A (en) 1983-07-27 1986-05-13 Ricoh Company, Ltd. Ink jet head having curved ink
JPS60111600A (ja) * 1983-11-21 1985-06-18 Mitsubishi Mining & Cement Co Ltd 電気機械変換素子
JPS60167598A (ja) * 1984-02-09 1985-08-30 Shimadzu Corp 超音波探触子
US5154797A (en) 1991-08-14 1992-10-13 The United States Of America As Represented By The Secretary Of The Army Silicon shadow mask
JP3040554B2 (ja) * 1991-10-08 2000-05-15 ジーイー横河メディカルシステム株式会社 超音波探触子
US5340510A (en) 1993-04-05 1994-08-23 Materials Systems Incorporated Method for making piezoelectric ceramic/polymer composite transducers
IT1268870B1 (it) 1993-08-23 1997-03-13 Seiko Epson Corp Testa di registrazione a getto d'inchiostro e procedimento per la sua fabbricazione.
US5557305A (en) 1994-02-24 1996-09-17 Spectra, Inc. Ink jet purging arrangement
JPH07285221A (ja) 1994-04-19 1995-10-31 Sharp Corp インクジェットヘッド
US5634999A (en) * 1994-09-06 1997-06-03 Ngk Insulators, Ltd. Method of producing ceramic diaphragm structure having convex diaphragm portion
JP3032439B2 (ja) * 1994-11-29 2000-04-17 リオン株式会社 超音波送受波装置
US5598050A (en) 1995-02-17 1997-01-28 Materials Systems Inc. Acoustic actuator and flextensional cover plate there for
JPH0923499A (ja) * 1995-07-06 1997-01-21 Oki Electric Ind Co Ltd 圧電振動子
US5691960A (en) 1995-08-02 1997-11-25 Materials Systems, Inc. Conformal composite acoustic transducer panel and method of fabrication thereof
JP3890634B2 (ja) * 1995-09-19 2007-03-07 セイコーエプソン株式会社 圧電体薄膜素子及びインクジェット式記録ヘッド
US5888412A (en) 1996-03-04 1999-03-30 Motorola, Inc. Method for making a sculptured diaphragm
US6217158B1 (en) 1996-04-11 2001-04-17 Seiko Epson Corporation Layered type ink jet recording head with improved piezoelectric actuator unit
JP3776520B2 (ja) * 1996-09-04 2006-05-17 アロカ株式会社 超音波探触子
JPH1081018A (ja) 1996-09-06 1998-03-31 Sony Corp プリンタ装置及びその製造方法
US5831371A (en) 1996-11-22 1998-11-03 Face International Corp. Snap-action ferroelectric transducer
US5870482A (en) 1997-02-25 1999-02-09 Knowles Electronics, Inc. Miniature silicon condenser microphone
US6074178A (en) 1997-04-15 2000-06-13 Face International Corp. Piezoelectrically actuated peristaltic pump
US6111818A (en) 1997-04-28 2000-08-29 Materials Systems Inc. Low voltage piezoelectric actuator
US5841736A (en) 1997-04-28 1998-11-24 Materials Systems Incorporated Low voltage piezoelectric transducer and method
US6107726A (en) 1997-07-25 2000-08-22 Materials Systems, Inc. Serpentine cross-section piezoelectric linear actuator
US20030036746A1 (en) * 2001-08-16 2003-02-20 Avi Penner Devices for intrabody delivery of molecules and systems and methods utilizing same
US6140740A (en) * 1997-12-30 2000-10-31 Remon Medical Technologies, Ltd. Piezoelectric transducer
US6126273A (en) * 1998-04-30 2000-10-03 Hewlett-Packard Co. Inkjet printer printhead which eliminates unpredictable ink nucleation variations
US6168906B1 (en) 1998-05-26 2001-01-02 The Charles Stark Draper Laboratory, Inc. Micromachined membrane with locally compliant and stiff regions and method of making same
US6361154B1 (en) 1998-09-03 2002-03-26 Matsushita Electric Industrial Co., Ltd. Ink-jet head with piezoelectric actuator
US6492762B1 (en) 1999-03-22 2002-12-10 Transurgical, Inc. Ultrasonic transducer, transducer array, and fabrication method
JP3748097B2 (ja) * 1999-04-20 2006-02-22 セイコーエプソン株式会社 圧電体薄膜素子、圧電体薄膜素子を備えるアクチュエータおよびアクチュエータを備えるインクジェット式記録ヘッド
US6217150B1 (en) 1999-06-11 2001-04-17 Lexmark International, Inc. Method of printing with an ink jet printer using multiple carriage speeds
US6222304B1 (en) * 1999-07-28 2001-04-24 The Charles Stark Draper Laboratory Micro-shell transducer
US6625854B1 (en) * 1999-11-23 2003-09-30 Koninklijke Philips Electronics N.V. Ultrasonic transducer backing assembly and methods for making same
US6321428B1 (en) * 2000-03-28 2001-11-27 Measurement Specialties, Inc. Method of making a piezoelectric transducer having protuberances for transmitting acoustic energy
US6321142B1 (en) 2000-05-16 2001-11-20 Cummins Engine Company, Inc. System for programming a vehicle control computer with selectable features and/or trim values
JP2001326999A (ja) 2000-05-18 2001-11-22 Olympus Optical Co Ltd 圧電構造体の加工方法および複合圧電体の製造方法
DE10039644A1 (de) 2000-08-14 2002-02-28 Rubitec Gesellschaft Fuer Innovation & Technologie Ruhr Univ Bochum Mbh Lochmaske und Verfahren zur Herstellung einer Lochmaske
US6589180B2 (en) * 2001-06-20 2003-07-08 Bae Systems Information And Electronic Systems Integration, Inc Acoustical array with multilayer substrate integrated circuits
US6937736B2 (en) 2001-08-06 2005-08-30 Measurement Specialties, Inc. Acoustic sensor using curved piezoelectric film
US20030068580A1 (en) 2001-10-09 2003-04-10 Chief Lin Ceramic shadow-mask in IC process flow
US7309948B2 (en) 2001-12-05 2007-12-18 Fujifilm Corporation Ultrasonic transducer and method of manufacturing the same
US7204586B2 (en) * 2001-12-18 2007-04-17 Dimatix, Inc. Ink jet printing module
US6824253B2 (en) 2001-12-18 2004-11-30 Spectra, Inc. Low voltage ink jet printing module
US7439141B2 (en) 2001-12-27 2008-10-21 Spansion, Llc Shallow trench isolation approach for improved STI corner rounding
US7045459B2 (en) 2002-02-19 2006-05-16 Northrop Grumman Corporation Thin film encapsulation of MEMS devices
US7363705B2 (en) 2003-02-04 2008-04-29 Microfabrica, Inc. Method of making a contact
DE10247487A1 (de) 2002-10-11 2004-05-06 Infineon Technologies Ag Membran und Verfahren zu deren Herstellung
GB0229655D0 (en) 2002-12-20 2003-01-22 Xaar Technology Ltd Droplet deposition apparatus
US6883903B2 (en) 2003-01-21 2005-04-26 Martha A. Truninger Flextensional transducer and method of forming flextensional transducer
US6821450B2 (en) 2003-01-21 2004-11-23 Hewlett-Packard Development Company, L.P. Substrate and method of forming substrate for fluid ejection device
JP4133580B2 (ja) 2003-05-21 2008-08-13 独立行政法人科学技術振興機構 圧電材料の加工方法
JP3787725B2 (ja) * 2003-10-17 2006-06-21 独立行政法人科学技術振興機構 超音波振動子及びその製造方法
CN1890707B (zh) * 2003-12-04 2011-04-13 皇家飞利浦电子股份有限公司 实施装有ic并带有高衰减背载的传感器
US7741756B2 (en) 2003-12-04 2010-06-22 Koninklijke Philips Electronics N.V. Ultrasound transducer and method for implementing flip-chip two dimensional array technology to curved arrays
US20050133479A1 (en) 2003-12-19 2005-06-23 Youngner Dan W. Equipment and process for creating a custom sloped etch in a substrate
US7372346B2 (en) 2003-12-24 2008-05-13 Interuniversitair Microelektronica Centrum (Imec) Acoustic resonator
US8008835B2 (en) * 2004-02-27 2011-08-30 Georgia Tech Research Corporation Multiple element electrode cMUT devices and fabrication methods
US7806839B2 (en) 2004-06-14 2010-10-05 Ethicon Endo-Surgery, Inc. System and method for ultrasound therapy using grating lobes
WO2006047326A1 (en) 2004-10-21 2006-05-04 Fujifilm Dimatix, Inc. Sacrificial substrate for etching
US20060147329A1 (en) * 2004-12-30 2006-07-06 Tanner Edward T Active valve and active valving for pump
JP4453830B2 (ja) 2005-03-25 2010-04-21 セイコーエプソン株式会社 圧電素子およびその製造方法、インクジェット式記録ヘッド、並びに、インクジェットプリンタ
KR100983924B1 (ko) 2005-05-18 2010-09-27 파나소닉 전공 주식회사 반도체 기판 상에 굴곡된 프로파일을 형성하는 방법
JP2007035823A (ja) 2005-07-26 2007-02-08 Elpida Memory Inc トレンチ形成方法、半導体装置の製造方法および半導体装置
JP4799091B2 (ja) * 2005-09-09 2011-10-19 パナソニック株式会社 超音波探触子
JPWO2007069365A1 (ja) 2005-12-14 2009-05-21 パナソニック株式会社 Ｍｅｍｓ振動膜構造及びその形成方法
KR101153562B1 (ko) 2006-01-26 2012-06-11 삼성전기주식회사 압전 방식의 잉크젯 프린트헤드 및 그 제조방법
JP2007335779A (ja) * 2006-06-19 2007-12-27 Matsushita Electric Ind Co Ltd 圧電体薄膜素子、インクジェットヘッドおよびインクジェット式記録装置
DE602007004242D1 (de) * 2006-09-25 2010-02-25 Koninkl Philips Electronics Nv Flip-chip-verbindung über chip-durchgangswege
JP4839176B2 (ja) 2006-10-12 2011-12-21 オリンパスメディカルシステムズ株式会社 超音波トランスデューサ及び超音波診断装置
US7687976B2 (en) * 2007-01-31 2010-03-30 General Electric Company Ultrasound imaging system
JP5080858B2 (ja) * 2007-05-17 2012-11-21 太陽誘電株式会社 圧電薄膜共振器およびフィルタ
US8236480B2 (en) 2007-05-24 2012-08-07 The United States of America, as represented by the Secretary of Commere, the National Institute of Standards and Technology Fabrication method of topographically modulated microstructures using pattern homogenization with UV light
US20090182229A1 (en) * 2008-01-10 2009-07-16 Robert Gideon Wodnicki UltraSound System With Highly Integrated ASIC Architecture
JP5438983B2 (ja) * 2008-02-08 2014-03-12 株式会社東芝 超音波プローブ及び超音波診断装置
US8766512B2 (en) * 2009-03-31 2014-07-01 Sand 9, Inc. Integration of piezoelectric materials with substrates
CN101391379B (zh) * 2008-10-28 2010-06-02 北京航空航天大学 一种能够快速对中的超声振动锥柄
JP5399166B2 (ja) * 2009-08-14 2014-01-29 富士フイルム株式会社 柱状構造膜とその成膜方法、圧電素子、液体吐出装置、及び圧電型超音波振動子
KR20130130681A (ko) 2010-07-26 2013-12-02 후지필름 가부시키가이샤 만곡된 압전막을 갖는 장치의 형성
US8733272B2 (en) 2010-12-29 2014-05-27 Fujifilm Corporation Electrode configurations for piezoelectric actuators
CN106269451B (zh) 2011-02-15 2020-02-21 富士胶卷迪马蒂克斯股份有限公司 使用微圆顶阵列的压电式换能器
US8628677B2 (en) 2011-03-31 2014-01-14 Fujifilm Corporation Forming curved features using a shadow mask
US8404132B2 (en) 2011-03-31 2013-03-26 Fujifilm Corporation Forming a membrane having curved features
US8450213B2 (en) 2011-04-13 2013-05-28 Fujifilm Corporation Forming a membrane having curved features
JP2015516233A (ja) * 2012-04-30 2015-06-11 ザ リージェンツ オブ ザ ユニバーシティ オブ ミシガン ラピッドプロトタイピング方法を使用した超音波トランスデューサー製造
US8767512B2 (en) 2012-05-01 2014-07-01 Fujifilm Dimatix, Inc. Multi-frequency ultra wide bandwidth transducer
US9061320B2 (en) 2012-05-01 2015-06-23 Fujifilm Dimatix, Inc. Ultra wide bandwidth piezoelectric transducer arrays
US9660170B2 (en) * 2012-10-26 2017-05-23 Fujifilm Dimatix, Inc. Micromachined ultrasonic transducer arrays with multiple harmonic modes
US9525119B2 (en) 2013-12-11 2016-12-20 Fujifilm Dimatix, Inc. Flexible micromachined transducer device and method for fabricating same
RU2654949C1 (ru) 2014-07-11 2018-05-23 Микротек Медикал Текнолоджиз Лтд. Многоэлементный преобразователь

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