JP2017098315A5 - - Google Patents
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- Publication number
- JP2017098315A5 JP2017098315A5 JP2015226212A JP2015226212A JP2017098315A5 JP 2017098315 A5 JP2017098315 A5 JP 2017098315A5 JP 2015226212 A JP2015226212 A JP 2015226212A JP 2015226212 A JP2015226212 A JP 2015226212A JP 2017098315 A5 JP2017098315 A5 JP 2017098315A5
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- shape
- semiconductor
- mounting
- manufactured
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 10
- 239000000758 substrate Substances 0.000 description 5
- 239000002184 metal Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- QXZUUHYBWMWJHK-UHFFFAOYSA-N [Co].[Ni] Chemical compound [Co].[Ni] QXZUUHYBWMWJHK-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- -1 nickel-cobalt Chemical compound 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015226212A JP6806436B2 (ja) | 2015-11-19 | 2015-11-19 | 半導体装置用基板とその製造方法、および半導体装置 |
| JP2020198627A JP7339231B2 (ja) | 2015-11-19 | 2020-11-30 | 半導体装置用基板、半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015226212A JP6806436B2 (ja) | 2015-11-19 | 2015-11-19 | 半導体装置用基板とその製造方法、および半導体装置 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020198627A Division JP7339231B2 (ja) | 2015-11-19 | 2020-11-30 | 半導体装置用基板、半導体装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2017098315A JP2017098315A (ja) | 2017-06-01 |
| JP2017098315A5 true JP2017098315A5 (enExample) | 2018-10-11 |
| JP6806436B2 JP6806436B2 (ja) | 2021-01-06 |
Family
ID=58817285
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015226212A Active JP6806436B2 (ja) | 2015-11-19 | 2015-11-19 | 半導体装置用基板とその製造方法、および半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP6806436B2 (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2019212649A (ja) * | 2018-05-31 | 2019-12-12 | マクセルホールディングス株式会社 | 半導体装置用基板とその製造方法、および半導体装置 |
| JP2022189979A (ja) * | 2020-11-30 | 2022-12-22 | マクセル株式会社 | 半導体装置用基板、半導体装置 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4942827B2 (enExample) * | 1971-11-15 | 1974-11-16 | ||
| JP3764587B2 (ja) * | 1998-06-30 | 2006-04-12 | 富士通株式会社 | 半導体装置の製造方法 |
| JP3455685B2 (ja) * | 1998-11-05 | 2003-10-14 | 新光電気工業株式会社 | 半導体装置の製造方法 |
| JP4362163B2 (ja) * | 1999-04-06 | 2009-11-11 | 富士通マイクロエレクトロニクス株式会社 | 半導体装置の製造方法 |
| JP2001230345A (ja) * | 2000-02-17 | 2001-08-24 | Sumitomo Metal Mining Co Ltd | 半導体装置及びその製造方法並びにその製造に用いられるリードフレーム |
| US7538415B1 (en) * | 2003-11-20 | 2009-05-26 | Bridge Semiconductor Corporation | Semiconductor chip assembly with bumped terminal, filler and insulative base |
| JP2006093575A (ja) * | 2004-09-27 | 2006-04-06 | Hitachi Cable Ltd | 半導体装置およびその製造方法 |
| US20100123230A1 (en) * | 2008-11-20 | 2010-05-20 | Frederick Rodriguez Dahilig | Integrated circuit packaging system having bumped lead and method of manufacture thereof |
| JP5851888B2 (ja) * | 2012-03-02 | 2016-02-03 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法および半導体装置 |
| JP2013042187A (ja) * | 2012-11-29 | 2013-02-28 | Hitachi Maxell Ltd | 半導体装置 |
-
2015
- 2015-11-19 JP JP2015226212A patent/JP6806436B2/ja active Active
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