JP2016152399A5 - - Google Patents

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Publication number
JP2016152399A5
JP2016152399A5 JP2015030795A JP2015030795A JP2016152399A5 JP 2016152399 A5 JP2016152399 A5 JP 2016152399A5 JP 2015030795 A JP2015030795 A JP 2015030795A JP 2015030795 A JP2015030795 A JP 2015030795A JP 2016152399 A5 JP2016152399 A5 JP 2016152399A5
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JP
Japan
Prior art keywords
substrate
conductive member
conductive
electrically connected
main body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2015030795A
Other languages
English (en)
Japanese (ja)
Other versions
JP6488752B2 (ja
JP2016152399A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from JP2015030795A external-priority patent/JP6488752B2/ja
Priority to JP2015030795A priority Critical patent/JP6488752B2/ja
Priority to PCT/JP2016/052575 priority patent/WO2016132852A1/ja
Priority to DE112016000817.1T priority patent/DE112016000817T5/de
Priority to CN201680009991.7A priority patent/CN107251670B/zh
Priority to US15/549,243 priority patent/US10062633B2/en
Publication of JP2016152399A publication Critical patent/JP2016152399A/ja
Publication of JP2016152399A5 publication Critical patent/JP2016152399A5/ja
Publication of JP6488752B2 publication Critical patent/JP6488752B2/ja
Application granted granted Critical
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2015030795A 2015-02-19 2015-02-19 基板ユニット Expired - Fee Related JP6488752B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2015030795A JP6488752B2 (ja) 2015-02-19 2015-02-19 基板ユニット
US15/549,243 US10062633B2 (en) 2015-02-19 2016-01-29 Substrate unit
DE112016000817.1T DE112016000817T5 (de) 2015-02-19 2016-01-29 Substrateinheit
CN201680009991.7A CN107251670B (zh) 2015-02-19 2016-01-29 基板单元
PCT/JP2016/052575 WO2016132852A1 (ja) 2015-02-19 2016-01-29 基板ユニット

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015030795A JP6488752B2 (ja) 2015-02-19 2015-02-19 基板ユニット

Publications (3)

Publication Number Publication Date
JP2016152399A JP2016152399A (ja) 2016-08-22
JP2016152399A5 true JP2016152399A5 (enExample) 2017-07-13
JP6488752B2 JP6488752B2 (ja) 2019-03-27

Family

ID=56692165

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015030795A Expired - Fee Related JP6488752B2 (ja) 2015-02-19 2015-02-19 基板ユニット

Country Status (5)

Country Link
US (1) US10062633B2 (enExample)
JP (1) JP6488752B2 (enExample)
CN (1) CN107251670B (enExample)
DE (1) DE112016000817T5 (enExample)
WO (1) WO2016132852A1 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6638262B2 (ja) * 2015-02-03 2020-01-29 株式会社オートネットワーク技術研究所 回路構成体
JP6587213B2 (ja) * 2016-05-12 2019-10-09 株式会社オートネットワーク技術研究所 配電基板
DE102018216143B3 (de) * 2018-09-21 2020-03-19 Continental Automotive Gmbh Kontaktanordnung und Vorrichtung mit einer Grundplatte und einer darauf angeordneten Kontaktanordnung
JP2020064941A (ja) * 2018-10-16 2020-04-23 住友電装株式会社 回路構造体及び電気接続箱
JP7192918B1 (ja) * 2021-06-14 2022-12-20 株式会社明電舎 バスバー放熱構造及びインバータ装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002051431A (ja) * 2000-08-02 2002-02-15 Auto Network Gijutsu Kenkyusho:Kk 車両用配電器及びその製造方法
US7167377B2 (en) 2001-11-26 2007-01-23 Sumitoo Wiring Systems, Ltd. Circuit-constituting unit and method of producing the same
JP3927017B2 (ja) 2001-11-26 2007-06-06 株式会社オートネットワーク技術研究所 回路構成体及びその製造方法
JP2005268648A (ja) * 2004-03-19 2005-09-29 Auto Network Gijutsu Kenkyusho:Kk 回路構成体
JP4732789B2 (ja) * 2005-04-28 2011-07-27 株式会社オートネットワーク技術研究所 スイッチングユニット
JP4585980B2 (ja) * 2005-10-14 2010-11-24 株式会社オートネットワーク技術研究所 電気接続箱
US7576429B2 (en) * 2005-12-30 2009-08-18 Fairchild Semiconductor Corporation Packaged semiconductor device with dual exposed surfaces and method of manufacturing
JP2009200416A (ja) * 2008-02-25 2009-09-03 Mitsubishi Electric Corp 半導体装置および半導体装置の製造方法
US8426752B2 (en) 2008-03-12 2013-04-23 Sumitomo Wiring Systems, Ltd. Electric connection box
JP4968316B2 (ja) * 2009-12-14 2012-07-04 アンデン株式会社 電子回路装置

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